JPH01289150A - Solder-clad lead frame and manufacture thereof - Google Patents
Solder-clad lead frame and manufacture thereofInfo
- Publication number
- JPH01289150A JPH01289150A JP11812488A JP11812488A JPH01289150A JP H01289150 A JPH01289150 A JP H01289150A JP 11812488 A JP11812488 A JP 11812488A JP 11812488 A JP11812488 A JP 11812488A JP H01289150 A JPH01289150 A JP H01289150A
- Authority
- JP
- Japan
- Prior art keywords
- lead
- lead frame
- clad
- tin
- parts
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 7
- 229910001174 tin-lead alloy Inorganic materials 0.000 claims abstract description 15
- 238000000034 method Methods 0.000 claims abstract description 13
- 239000000463 material Substances 0.000 claims abstract description 12
- 238000005253 cladding Methods 0.000 claims description 16
- 229910000679 solder Inorganic materials 0.000 claims description 5
- LQBJWKCYZGMFEV-UHFFFAOYSA-N lead tin Chemical compound [Sn].[Pb] LQBJWKCYZGMFEV-UHFFFAOYSA-N 0.000 abstract description 8
- 230000009977 dual effect Effects 0.000 abstract description 3
- 238000005530 etching Methods 0.000 abstract description 2
- 238000000275 quality assurance Methods 0.000 abstract description 2
- 238000005096 rolling process Methods 0.000 abstract 1
- 229910045601 alloy Inorganic materials 0.000 description 6
- 239000000956 alloy Substances 0.000 description 6
- 229910001020 Au alloy Inorganic materials 0.000 description 3
- 239000003353 gold alloy Substances 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Abstract
Description
【発明の詳細な説明】
［産業上の利用分野］
本発明は、複数の半導体チップを取付けた回路基板とリ
ードフレームを回路接続した後、樹脂封止を施す樹脂封
止型の混成集積回路装置のなめのリードフレームおよび
その製法に関する。[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a resin-sealed hybrid integrated circuit device in which a circuit board on which a plurality of semiconductor chips are attached and a lead frame are connected to each other and then resin-sealed. Concerning a lead frame and its manufacturing method.
［従来の技術］
従来、樹脂封止型の混成集積回路装置の回路形成におい
ては、第２図に示すように、セラミックス又はポリイミ
ドの回路基板１０とリードフレーム１２との接合結線は
、金合金等の極細線１４を用いた熱圧着方式により、双
方の指定位置で、極細線１４と基板１ｏ、又は極細線１
４とリードフレーム１２を夫々接合することにより行っ
ていたやこの場合、リードフレーム１２のリード先端部
１２ａは、金合金等のＫＩＩｌｌＩ線を熱圧着し易い様
に、コイニング加工により平坦化されていた。[Prior Art] Conventionally, in the circuit formation of a resin-sealed hybrid integrated circuit device, as shown in FIG. By thermocompression bonding method using the ultra-fine wire 14, the ultra-fine wire 14 and the substrate 1o or the ultra-fine wire 1 are bonded at designated positions on both sides.
In this case, the lead tips 12a of the lead frame 12 were flattened by coining to facilitate thermocompression bonding of KIII wires such as gold alloy. .
［発明が解決しようとする課題］
しかしながら、樹脂封止型の混成集積回路装置の回路形
成において、回路基板とリードフレームのリードとの間
を結線するために、金合金等の極細線の熱圧着方式にの
み頼る従来の方法では、リードフレームに対する基板の
固着強度が保ちにくかった。従って、結線の際に又は結
線品を次工程へ移送する際に、回路基板とリードフレー
ムの位置関係に変動を生じ、このために回路の切断や現
象を生じることが多く、製品の歩留まりを低下させてい
た。[Problems to be Solved by the Invention] However, in circuit formation of a resin-sealed hybrid integrated circuit device, thermocompression bonding of ultrafine wires such as gold alloy is required to connect the circuit board and the leads of the lead frame. With conventional methods that rely solely on the method, it is difficult to maintain the adhesion strength of the board to the lead frame. Therefore, when connecting wires or transferring wired products to the next process, the positional relationship between the circuit board and lead frame changes, which often causes circuit breaks and other phenomena, reducing the yield of products. I was letting it happen.
又、これらを解決する目的で、デュアルタイプのリード
フレームに対して、本発明者らは、本出願と同日に出願
した発明では、リードフレームのリード先端部を二段コ
イニングして基板の設置位置を固定する技術を提供した
。しかし、回路のリード数が多いリードフレームにあっ
ては、リード先端部の幅が極端に細く設定されているた
め、デュアルタイプに用いた二段コイニング方式では、
リード先端部の拡幅現象により、隣接するリードとの接
触事故を招き易く、作業の安定性を欠くと共に、回路基
板を支持するための強度も不十分になりがちであった。In addition, in order to solve these problems, the present inventors have developed an invention for a dual type lead frame, which was filed on the same day as the present application. provided the technology to fix it. However, for lead frames with a large number of circuit leads, the width of the lead tip is set extremely thin, so the two-stage coining method used for the dual type
Due to the widening phenomenon of the tip of the lead, it is easy to cause an accident of contact with an adjacent lead, resulting in a lack of operational stability, and the strength to support the circuit board tends to be insufficient.
更にリードフレームのリード先端部に部分的なはんだめ
っきを方組したリードフレームを用いることも考えられ
たが、はんだ処理を満足させるための合金厚さを得るた
めの厚めつきを安定して得る事が不可能であった。Furthermore, it was considered to use a lead frame with partial solder plating on the lead tips of the lead frame, but it was difficult to stably obtain the alloy thickness to satisfy the soldering process. was not possible.
［課題を解決するための手段］
前述の課題を解決するため、本発明は、基本的には、混
成集積回路装置の回路基板とり−ドフレームとを確実に
固着せしめるため、リードフレームのリード先端部とな
る素材の中央部に錫−鉛合金のクラッド部をあらかじめ
設けたリードフレームを提供する。[Means for Solving the Problems] In order to solve the above-mentioned problems, the present invention basically provides a method for reliably fixing the circuit board of a hybrid integrated circuit device to the lead frame. To provide a lead frame in which a cladding portion of a tin-lead alloy is preliminarily provided in the center of a material serving as a lead frame.
さらに、本発明は、基本的には、混成集積回路装置の回
路基板とリードフレームとを確実に固着せしめるため、
リードフレームのリード先端部となる素材の中央部に錫
−鉛合金のクラッド部をあらかじめ設けて、回路基板と
リードフレームとを錫−鉛合金によるはんだ付けにより
接合するようにした方法を提供する。Furthermore, the present invention basically provides the following steps for reliably fixing the circuit board and lead frame of a hybrid integrated circuit device.
To provide a method in which a cladding part of a tin-lead alloy is provided in advance in the center of a material serving as a lead tip part of a lead frame, and a circuit board and a lead frame are joined by soldering with the tin-lead alloy.
［作用］
リードフレームのリード先端部にはんだ付けに必要な厚
さの錫−鉛合金製クラッド部を設けたから、上記錫−鉛
合金でクラッドされたリードフレーム先端部に混成集積
回路装置基板のターミナル部を重ね合すせて加熱処理す
ることにより、従来機械的な強度が十分に保てなかった
金合金等の極細線を用いた熱圧着方式に比べて、遥かに
安定した強度の基板固着を保証できる。[Function] Since a tin-lead alloy cladding part of the thickness necessary for soldering is provided at the lead end of the lead frame, the terminal of the hybrid integrated circuit board can be attached to the lead frame end clad with the tin-lead alloy. By overlapping the parts and heat-treating them, we can achieve a much more stable and strong bonding of the substrate than conventional thermocompression bonding methods using ultra-fine wires such as gold alloys, which have not been able to maintain sufficient mechanical strength. I can guarantee it.
［実施例］ 以下に本願発明を図面を参照しながら詳細に述べる。[Example] The present invention will be described in detail below with reference to the drawings.
第１図は、第２図に対応して、リードフレーム１２のリ
ード先端部１２ａを示す、リードフレーム加工用母材と
しては、４２合金、１９４９４合金通常利用されている
リードフレーム材料が利用できる。FIG. 1 shows a lead tip portion 12a of a lead frame 12, corresponding to FIG. 2. As a base material for lead frame processing, lead frame materials commonly used such as 42 alloy and 19494 alloy can be used.
先ず、リードフレーム加工用母材である長尺条の幅方向
中央部に長手方向に錫−鉛合金をインレイクラツドした
圧延素材を用い、プレス加工またはエツチング加工によ
り、リード先端部１２ａの所要部分にのみ錫−鉛クラツ
ド部１６を表面に保有するリードフレーム１２を製作す
る。First, using a rolled material in which a tin-lead alloy is inlaid in the widthwise center of a long strip that is a base material for lead frame processing in the longitudinal direction, the required portion of the lead tip 12a is formed by pressing or etching. A lead frame 12 having a tin-lead cladding portion 16 on its surface is manufactured only in this case.
鍋−鉛クラツド部１６の厚さは０．０５〜０゜２ｍｍと
し、錫−鉛クラツド部１６のクラッド幅は、組立てられ
る装置の形状により変動するが、約１０ｍｍとする。錫
−餡クラッド部１６の厚さをＱ、０５〜０．２ｍｍとし
たのは、０．０５ｍｍ未満では回路基板を確実にリード
フレームに固着させる為の機械的強度が保証されぬ為で
あり、逆に０．０２ｍｍを超えるとリード母材部の肉厚
が薄くなって、装置全体の強度が保ち誼くなる為である
。The thickness of the pot-lead cladding part 16 is 0.05 to 0.2 mm, and the cladding width of the tin-lead cladding part 16 is about 10 mm, although it varies depending on the shape of the device to be assembled. The reason why the thickness of the tin-bean paste cladding part 16 is set to Q, 05 to 0.2 mm is because if the thickness is less than 0.05 mm, the mechanical strength to securely fix the circuit board to the lead frame cannot be guaranteed. On the other hand, if it exceeds 0.02 mm, the thickness of the lead base material portion becomes thinner, and the strength of the entire device is maintained and the lead base material becomes thinner.
以上のようにｇ −１９インレイ４２合金条を用いて錫
−鉛クラツド部１６を形成したリード先端部１２ａに混
成集積回路基板１０のターミナル部を重ね合わせて２０
０〜２５０℃で熱処理して、回路基板１０とリード先端
部１２ａの確実な固着を得た。As described above, the terminal part of the hybrid integrated circuit board 10 is superimposed on the lead tip part 12a in which the tin-lead clad part 16 is formed using the g-19 inlay 42 alloy strip.
Heat treatment was performed at 0 to 250°C to ensure reliable adhesion between the circuit board 10 and the lead tips 12a.
具体的な実施例について以下に説明する。Specific examples will be described below.
厚さ０．２５ｍｍ、幅５０ｍｍの４２合金条でリードフ
レーム１２を形成し、その幅方向中央部に、１２ｍｍの
幅にわたって＃Ｓ６０重量％−鉛４０重址％の組成を有
する錫−鉛インレイ４２合金条を用いて錫−鉛クラツド
部１６を形成した。こうして、リードフレーム１２のリ
ード先端部１２ａにおいて、１．２５ｍｍＸ１．５ｍｍ
の領域に、錫６０重１％−鈴４０重量％の組成を有する
錫−鉛合金のクラッド部１６を形成した２８ピンのリー
ドフレーム１２をルス打抜法によりｆＭ造できた。A lead frame 12 is formed of a 42 alloy strip having a thickness of 0.25 mm and a width of 50 mm, and a tin-lead inlay 42 having a composition of 60% by weight of #S and 40% by weight of lead is placed at the center in the width direction of the lead frame 12 over a width of 12 mm. The tin-lead cladding portion 16 was formed using an alloy strip. In this way, the lead end portion 12a of the lead frame 12 has a size of 1.25 mm x 1.5 mm.
A 28-pin lead frame 12 with a cladding part 16 of a tin-lead alloy having a composition of 60% by weight and 1% by weight and 40% by weight of tin was formed in the region of 28 by fM using the Ruth punching method.
上記リードフレーム１２の錫−鉛クラツド部１６に回ｎ
基板１０の端子部１０ａを重ね合わせ、２５ｇの荷重を
掛けた状態で２５０°Ｃにて５分間熱処理し、その後樹
脂封止した。こうして得られた混成集積回路装置は、従
来の組立製品率８０％に比して、組立作業不良品が皆無
と大幅な品質並びに生産性の向上を示した。to the tin-lead cladding portion 16 of the lead frame 12.
The terminal portions 10a of the substrates 10 were stacked one on top of the other, heat treated at 250° C. for 5 minutes under a load of 25 g, and then sealed with resin. The thus obtained hybrid integrated circuit device showed a significant improvement in quality and productivity, with no assembly defects, compared to the conventional assembly rate of 80%.
［発明の効果］
本発明の実施により、デュアルタイプの混成集積回路の
品質保証度が大幅に向上し、安定した品質で信頼性の高
い製品を大量に供給することが可能ニナった。また、イ
ンレイクラツド材の入手が容易であるから、本願発明の
採用により製造コストが上がることはない、したがって
、電子Ｒ械業界に寄与するところ極めて大なるものがあ
る。[Effects of the Invention] By carrying out the present invention, the degree of quality assurance of dual-type hybrid integrated circuits has been greatly improved, and it has become possible to supply a large quantity of highly reliable products with stable quality. Furthermore, since the inlay clad material is easily available, the manufacturing cost will not increase by adopting the present invention.Therefore, it will greatly contribute to the electronic R-machine industry.
第１図は、本願発明によるリードフレームのリード先端
部と回路基板のターミナル部の接合を示す断面図。
第２図は、従来方法による回路基板とリードフレームの
接合を示す断面図。
１０・・回路基板
１２・・リードフレーム
１２ａ・ ・リード先端部
１４・・極細線
１６・・錫−鉛合金クラッド部FIG. 1 is a cross-sectional view showing the joining of the lead end portion of the lead frame and the terminal portion of the circuit board according to the present invention. FIG. 2 is a sectional view showing bonding of a circuit board and a lead frame by a conventional method. 10...Circuit board 12...Lead frame 12a...Lead tip 14...Extra fine wire 16...Tin-lead alloy cladding part
Claims (5)
、リードフレームのリード先端部の中央に錫−鉛合金の
クラッド部を設けた事を特徴とするはんだクラッドリー
ドフレーム。(1) A solder clad lead frame for forming a hybrid integrated circuit, characterized in that a cladding part of a tin-lead alloy is provided at the center of the lead end of the lead frame.
０．２ｍｍである事を特徴とする請求項１記載のはんだ
クラッドリードフレーム。(2) The thickness of the tin-lead alloy cladding part is 0.05 mm or more
The solder clad lead frame according to claim 1, wherein the solder clad lead frame has a thickness of 0.2 mm.
造方法において、リードフレームの形成前にリードフレ
ーム素材の中央部に錫−鉛合金をクラッドした事を特徴
とするはんだクラッドリードフレームの製法。(3) A method for manufacturing a lead frame for forming a hybrid integrated circuit device, characterized in that the central portion of the lead frame material is clad with a tin-lead alloy before forming the lead frame.
２ｍｍである事を特徴とする請求項３記載のはんだクラ
ッドリードフレームの製法。(4) The thickness of the cladding tin-lead alloy is 0.05-0.
4. The method for manufacturing a solder clad lead frame according to claim 3, wherein the lead frame has a thickness of 2 mm.
ード先端部の中央に錫−鉛合金のクラッド部を設けるた
めに、リードフレームの形成前にリードフレーム素材の
中央部に錫−鉛合金をクラッドした事を特徴とする混成
集積回路装置の製法。(5) In order to provide a tin-lead alloy cladding part in the center of the lead tips of the leadframe forming a hybrid integrated circuit device, a tin-lead alloy is clad in the center of the lead frame material before the leadframe is formed. A method for manufacturing a hybrid integrated circuit device characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11812488A JPH01289150A (en) | 1988-05-17 | 1988-05-17 | Solder-clad lead frame and manufacture thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11812488A JPH01289150A (en) | 1988-05-17 | 1988-05-17 | Solder-clad lead frame and manufacture thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01289150A true JPH01289150A (en) | 1989-11-21 |
Family
ID=14728629
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11812488A Pending JPH01289150A (en) | 1988-05-17 | 1988-05-17 | Solder-clad lead frame and manufacture thereof |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01289150A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5973388A (en) * | 1998-01-26 | 1999-10-26 | Motorola, Inc. | Leadframe, method of manufacturing a leadframe, and method of packaging an electronic component utilizing the leadframe |
| JP2012209402A (en) * | 2011-03-29 | 2012-10-25 | Hitachi Cable Ltd | Lead component, manufacturing method of the lead component, and semiconductor package |
-
1988
- 1988-05-17 JP JP11812488A patent/JPH01289150A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5973388A (en) * | 1998-01-26 | 1999-10-26 | Motorola, Inc. | Leadframe, method of manufacturing a leadframe, and method of packaging an electronic component utilizing the leadframe |
| JP2012209402A (en) * | 2011-03-29 | 2012-10-25 | Hitachi Cable Ltd | Lead component, manufacturing method of the lead component, and semiconductor package |
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