JPH0565078B2 - - Google Patents
Info
- Publication number
- JPH0565078B2 JPH0565078B2 JP62242047A JP24204787A JPH0565078B2 JP H0565078 B2 JPH0565078 B2 JP H0565078B2 JP 62242047 A JP62242047 A JP 62242047A JP 24204787 A JP24204787 A JP 24204787A JP H0565078 B2 JPH0565078 B2 JP H0565078B2
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- semiconductor mounting
- circuit pattern
- layer
- etching resist
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62242047A JPS6484698A (en) | 1987-09-26 | 1987-09-26 | Manufacture of multilayer circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62242047A JPS6484698A (en) | 1987-09-26 | 1987-09-26 | Manufacture of multilayer circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6484698A JPS6484698A (en) | 1989-03-29 |
| JPH0565078B2 true JPH0565078B2 (enrdf_load_stackoverflow) | 1993-09-16 |
Family
ID=17083480
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62242047A Granted JPS6484698A (en) | 1987-09-26 | 1987-09-26 | Manufacture of multilayer circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6484698A (enrdf_load_stackoverflow) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5235211A (en) * | 1990-06-22 | 1993-08-10 | Digital Equipment Corporation | Semiconductor package having wraparound metallization |
| CN114080146B (zh) * | 2021-11-02 | 2023-12-05 | 中国电子科技集团公司第三十八研究所 | 一种低温无压的传感器金属外壳密封方法 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5967686A (ja) * | 1982-10-12 | 1984-04-17 | イビデン株式会社 | プリント配線基板とその製造方法 |
| JPS6167289A (ja) * | 1984-09-10 | 1986-04-07 | エルナ−株式会社 | プリント配線板の製造方法 |
| JPS6175596A (ja) * | 1984-09-20 | 1986-04-17 | イビデン株式会社 | スルホール多層回路基板の製造方法 |
| JPS61154096A (ja) * | 1984-12-26 | 1986-07-12 | 住友ベークライト株式会社 | 多層印刷配線板の製造方法 |
-
1987
- 1987-09-26 JP JP62242047A patent/JPS6484698A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6484698A (en) | 1989-03-29 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP4555852B2 (ja) | 回路基板の製造方法 | |
| US5198693A (en) | Aperture formation in aluminum circuit card for enhanced thermal dissipation | |
| KR100338908B1 (ko) | 인쇄회로기판및그의제조방법과전자구성부품패키지및그의제조방법 | |
| JP5997260B2 (ja) | 印刷回路基板及びその製造方法 | |
| WO2019181626A1 (ja) | 電子回路装置および回路基板の製造方法 | |
| JP2008300819A (ja) | プリント基板およびその製造方法 | |
| JPS60148188A (ja) | フレキシブルな基板部分に接点を形成する方法 | |
| US6101098A (en) | Structure and method for mounting an electric part | |
| JP2549393B2 (ja) | 回路基板の製造方法 | |
| JPH0565078B2 (enrdf_load_stackoverflow) | ||
| JPH1070363A (ja) | 印刷配線板の製造方法 | |
| JP2000261152A (ja) | プリント配線組立体 | |
| JP3107535B2 (ja) | 配線基板、回路部品実装体、および配線基板の製造方法 | |
| JP3736046B2 (ja) | 半導体装置用基板及びその製造方法 | |
| JP2002009440A (ja) | 複合配線基板 | |
| JPH0728124B2 (ja) | 両面回路基板の製造方法 | |
| KR101044133B1 (ko) | 인쇄회로기판 제조용 캐리어와 그 제조방법 및 이를 이용한 인쇄회로기판의 제조방법 | |
| JPS60111489A (ja) | 電子部品塔載用基板およびその製造方法 | |
| JPS6355236B2 (enrdf_load_stackoverflow) | ||
| JP3429743B2 (ja) | 配線基板 | |
| JP3868557B2 (ja) | Ｉｃ搭載用多層プリント配線板の製造方法 | |
| JP3979404B2 (ja) | 半導体装置 | |
| JP3247888B2 (ja) | 電子部品パッケージ及び、電子部品のパッケージの製造方法 | |
| JPS60124992A (ja) | プリント配線板およびその製造方法 | |
| JP2957747B2 (ja) | 回路部品搭載用端子を備えた回路基板の製造法 |