JPH0563955B2 - - Google Patents
Info
- Publication number
- JPH0563955B2 JPH0563955B2 JP59146035A JP14603584A JPH0563955B2 JP H0563955 B2 JPH0563955 B2 JP H0563955B2 JP 59146035 A JP59146035 A JP 59146035A JP 14603584 A JP14603584 A JP 14603584A JP H0563955 B2 JPH0563955 B2 JP H0563955B2
- Authority
- JP
- Japan
- Prior art keywords
- thin film
- film layer
- wiring board
- thickness
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000007747 plating Methods 0.000 claims description 28
- 238000005520 cutting process Methods 0.000 claims description 24
- 239000010409 thin film Substances 0.000 claims description 24
- 239000004020 conductor Substances 0.000 claims description 18
- 229910052751 metal Inorganic materials 0.000 claims description 12
- 239000002184 metal Substances 0.000 claims description 12
- 239000000758 substrate Substances 0.000 claims description 9
- 239000010410 layer Substances 0.000 description 41
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 26
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 22
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 16
- 229910052802 copper Inorganic materials 0.000 description 16
- 239000010949 copper Substances 0.000 description 16
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 14
- 229910052737 gold Inorganic materials 0.000 description 14
- 239000010931 gold Substances 0.000 description 14
- 229910052759 nickel Inorganic materials 0.000 description 13
- 238000000034 method Methods 0.000 description 11
- 229910052763 palladium Inorganic materials 0.000 description 11
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 6
- 229910052804 chromium Inorganic materials 0.000 description 6
- 239000011651 chromium Substances 0.000 description 6
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 229920002120 photoresistant polymer Polymers 0.000 description 4
- 239000010936 titanium Substances 0.000 description 4
- 229910052719 titanium Inorganic materials 0.000 description 4
- JVPLOXQKFGYFMN-UHFFFAOYSA-N gold tin Chemical compound [Sn].[Au] JVPLOXQKFGYFMN-UHFFFAOYSA-N 0.000 description 3
- 229910001120 nichrome Inorganic materials 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Landscapes
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Structure Of Printed Boards (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14603584A JPS6126282A (ja) | 1984-07-16 | 1984-07-16 | 多層配線基板 |
| FR858510660A FR2567709B1 (fr) | 1984-07-11 | 1985-07-11 | Ensemble a paillette comprenant un substrat de cablage multi-couche |
| FR8615585A FR2590105A1 (fr) | 1984-07-11 | 1986-11-07 | Ensemble a paillette comprenant un substrat de cablage multicouche |
| US07/115,565 US4840924A (en) | 1984-07-11 | 1987-10-29 | Method of fabricating a multichip package |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14603584A JPS6126282A (ja) | 1984-07-16 | 1984-07-16 | 多層配線基板 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6126282A JPS6126282A (ja) | 1986-02-05 |
| JPH0563955B2 true JPH0563955B2 (nl) | 1993-09-13 |
Family
ID=15398632
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14603584A Granted JPS6126282A (ja) | 1984-07-11 | 1984-07-16 | 多層配線基板 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6126282A (nl) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62239596A (ja) * | 1986-04-11 | 1987-10-20 | 株式会社日立製作所 | 配線基板 |
| JP2552159B2 (ja) * | 1987-02-02 | 1996-11-06 | セイコーエプソン株式会社 | 半導体装置及びその製造方法 |
| JP4890983B2 (ja) * | 2006-07-18 | 2012-03-07 | 矢崎総業株式会社 | コネクタ及びコネクタユニット |
| JP5439900B2 (ja) * | 2009-03-30 | 2014-03-12 | 株式会社村田製作所 | ランド構造 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5427956A (en) * | 1977-08-01 | 1979-03-02 | Nippon Electric Co | Method of making thick film integrated circuit |
| JPS5759473B2 (nl) * | 1973-07-25 | 1982-12-15 | Bosch Gmbh Robert |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS593588Y2 (ja) * | 1980-01-10 | 1984-01-31 | 株式会社精工舎 | 回路基板 |
| JPS5930551Y2 (ja) * | 1980-09-26 | 1984-08-31 | 株式会社日立製作所 | 配線補修用ラインを持った配線板 |
-
1984
- 1984-07-16 JP JP14603584A patent/JPS6126282A/ja active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5759473B2 (nl) * | 1973-07-25 | 1982-12-15 | Bosch Gmbh Robert | |
| JPS5427956A (en) * | 1977-08-01 | 1979-03-02 | Nippon Electric Co | Method of making thick film integrated circuit |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6126282A (ja) | 1986-02-05 |
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| JPH0563955B2 (nl) | ||
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |