JPH0562816B2 - - Google Patents
Info
- Publication number
- JPH0562816B2 JPH0562816B2 JP18629085A JP18629085A JPH0562816B2 JP H0562816 B2 JPH0562816 B2 JP H0562816B2 JP 18629085 A JP18629085 A JP 18629085A JP 18629085 A JP18629085 A JP 18629085A JP H0562816 B2 JPH0562816 B2 JP H0562816B2
- Authority
- JP
- Japan
- Prior art keywords
- etching
- metal layer
- wafer
- end point
- etched
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 229910052751 metal Inorganic materials 0.000 claims description 64
- 239000002184 metal Substances 0.000 claims description 64
- 238000005530 etching Methods 0.000 claims description 58
- 238000000034 method Methods 0.000 claims description 5
- 235000012431 wafers Nutrition 0.000 description 26
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 10
- 238000010586 diagram Methods 0.000 description 6
- 238000007654 immersion Methods 0.000 description 6
- 238000000866 electrolytic etching Methods 0.000 description 5
- 229910052697 platinum Inorganic materials 0.000 description 5
- 238000007796 conventional method Methods 0.000 description 4
- 238000003486 chemical etching Methods 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 238000000059 patterning Methods 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Landscapes
- Weting (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP18629085A JPS6246531A (ja) | 1985-08-23 | 1985-08-23 | 金属層のエツチング終点の検出方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP18629085A JPS6246531A (ja) | 1985-08-23 | 1985-08-23 | 金属層のエツチング終点の検出方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6246531A JPS6246531A (ja) | 1987-02-28 |
JPH0562816B2 true JPH0562816B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1993-09-09 |
Family
ID=16185722
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP18629085A Granted JPS6246531A (ja) | 1985-08-23 | 1985-08-23 | 金属層のエツチング終点の検出方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6246531A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108292567B (zh) * | 2015-11-30 | 2020-04-21 | 松下知识产权经营株式会社 | 电极箔的制造方法和电容器的制造方法 |
-
1985
- 1985-08-23 JP JP18629085A patent/JPS6246531A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS6246531A (ja) | 1987-02-28 |