JPH056277Y2 - - Google Patents
Info
- Publication number
- JPH056277Y2 JPH056277Y2 JP11074788U JP11074788U JPH056277Y2 JP H056277 Y2 JPH056277 Y2 JP H056277Y2 JP 11074788 U JP11074788 U JP 11074788U JP 11074788 U JP11074788 U JP 11074788U JP H056277 Y2 JPH056277 Y2 JP H056277Y2
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- wafers
- water tank
- shaped
- block
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 235000012431 wafers Nutrition 0.000 claims description 71
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 27
- 238000000926 separation method Methods 0.000 claims description 10
- 238000000605 extraction Methods 0.000 claims description 8
- 230000000694 effects Effects 0.000 description 9
- 238000001179 sorption measurement Methods 0.000 description 3
- 230000000452 restraining effect Effects 0.000 description 2
- 239000013013 elastic material Substances 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 230000000644 propagated effect Effects 0.000 description 1
- 230000001629 suppression Effects 0.000 description 1
Landscapes
- De-Stacking Of Articles (AREA)
- Sheets, Magazines, And Separation Thereof (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11074788U JPH056277Y2 (enrdf_load_stackoverflow) | 1988-08-23 | 1988-08-23 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11074788U JPH056277Y2 (enrdf_load_stackoverflow) | 1988-08-23 | 1988-08-23 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH0231236U JPH0231236U (enrdf_load_stackoverflow) | 1990-02-27 |
JPH056277Y2 true JPH056277Y2 (enrdf_load_stackoverflow) | 1993-02-18 |
Family
ID=31348188
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP11074788U Expired - Lifetime JPH056277Y2 (enrdf_load_stackoverflow) | 1988-08-23 | 1988-08-23 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH056277Y2 (enrdf_load_stackoverflow) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6395634B2 (ja) * | 2015-02-09 | 2018-09-26 | 株式会社ディスコ | ウエーハの生成方法 |
JP6395632B2 (ja) * | 2015-02-09 | 2018-09-26 | 株式会社ディスコ | ウエーハの生成方法 |
JP6395633B2 (ja) * | 2015-02-09 | 2018-09-26 | 株式会社ディスコ | ウエーハの生成方法 |
JP7034683B2 (ja) * | 2017-11-29 | 2022-03-14 | 株式会社ディスコ | 剥離装置 |
JP7446834B2 (ja) * | 2020-01-31 | 2024-03-11 | 株式会社荏原製作所 | 基板処理装置および基板処理方法 |
-
1988
- 1988-08-23 JP JP11074788U patent/JPH056277Y2/ja not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JPH0231236U (enrdf_load_stackoverflow) | 1990-02-27 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN111498579B (zh) | 剥离装置 | |
JPH056277Y2 (enrdf_load_stackoverflow) | ||
US6739588B2 (en) | Method and device for separating printing plates | |
JP4057527B2 (ja) | フラットな基板を収容容器内へ入れる方法および装置 | |
JP3733091B2 (ja) | 半導体ウエハ分離装置 | |
CN110921314A (zh) | 一种多金属片的埋入和取出装置 | |
JPS6244534Y2 (enrdf_load_stackoverflow) | ||
JPH08117882A (ja) | プレス金型の除塵装置 | |
JPS6011861Y2 (ja) | 板材分離装置 | |
CN221910951U (zh) | 一种用于卡托加工的cnc自动上料治具 | |
CN218416814U (zh) | 一种用于摄像头模组芯片切割的工作台 | |
KR102784034B1 (ko) | 공기 주입을 이용한 이형지 박리장치 | |
JPH11236136A (ja) | 吸引機構によるワーク分離装置 | |
JPS5812172B2 (ja) | 積層単板の分離方法 | |
KR102804842B1 (ko) | 반도체 칩의 분리 방법 | |
JPH0310511Y2 (enrdf_load_stackoverflow) | ||
JPH0977265A (ja) | 積層されたモールド済みリードフレームの切り出し方法及びその装置 | |
JPH0592807A (ja) | チツプバー端面整列装置 | |
JPH01104535A (ja) | ベニヤ単板の自動吸着供給装置 | |
KR960015817A (ko) | 다이 본딩방법 및 그 장치 | |
JP2569637B2 (ja) | 吸着盤 | |
JPS63224328A (ja) | 半導体ウエハ加熱装置 | |
JPS6165750A (ja) | ウエハ−の枚葉取出し装置 | |
JPH0210125Y2 (enrdf_load_stackoverflow) | ||
JP2003258041A (ja) | ワイヤボンディング方法 |