JPH0561791B2 - - Google Patents

Info

Publication number
JPH0561791B2
JPH0561791B2 JP57120636A JP12063682A JPH0561791B2 JP H0561791 B2 JPH0561791 B2 JP H0561791B2 JP 57120636 A JP57120636 A JP 57120636A JP 12063682 A JP12063682 A JP 12063682A JP H0561791 B2 JPH0561791 B2 JP H0561791B2
Authority
JP
Japan
Prior art keywords
resist film
photosensitive resist
heat treatment
minutes
weight
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP57120636A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5912434A (ja
Inventor
Koji Takeuchi
Kenji Tazawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Ohka Kogyo Co Ltd
Original Assignee
Tokyo Ohka Kogyo Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Ohka Kogyo Co Ltd filed Critical Tokyo Ohka Kogyo Co Ltd
Priority to JP12063682A priority Critical patent/JPS5912434A/ja
Publication of JPS5912434A publication Critical patent/JPS5912434A/ja
Publication of JPH0561791B2 publication Critical patent/JPH0561791B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
    • H05K3/184—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method using masks

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP12063682A 1982-07-13 1982-07-13 プリント配線板の製造方法 Granted JPS5912434A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12063682A JPS5912434A (ja) 1982-07-13 1982-07-13 プリント配線板の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12063682A JPS5912434A (ja) 1982-07-13 1982-07-13 プリント配線板の製造方法

Publications (2)

Publication Number Publication Date
JPS5912434A JPS5912434A (ja) 1984-01-23
JPH0561791B2 true JPH0561791B2 (enrdf_load_html_response) 1993-09-07

Family

ID=14791120

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12063682A Granted JPS5912434A (ja) 1982-07-13 1982-07-13 プリント配線板の製造方法

Country Status (1)

Country Link
JP (1) JPS5912434A (enrdf_load_html_response)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61109686A (ja) * 1984-11-02 1986-05-28 松下電器産業株式会社 産業用ロボツト及び関連装置
JPH0673396B2 (ja) * 1986-06-16 1994-09-14 株式会社日立製作所 プリント回路板の製造方法
JPS6364394A (ja) * 1986-09-05 1988-03-22 株式会社日立製作所 プリント配線板の製造方法
JPS6385538A (ja) * 1986-09-29 1988-04-16 Asahi Chem Ind Co Ltd 光硬化性積層体およびそれを用いた画像形成方法
JPH01109792A (ja) * 1987-10-23 1989-04-26 Hitachi Condenser Co Ltd プリント配線板
JPH0612536U (ja) * 1991-12-27 1994-02-18 修一 関本 基礎用型枠

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS515658B2 (enrdf_load_html_response) * 1971-11-15 1976-02-21
US4082891A (en) * 1976-05-04 1978-04-04 General Electric Company Polycarbonate coated with photocurable polythiol and different polyenes
DE2643883B1 (de) * 1976-09-29 1978-02-16 Industrieanlgen Gmbh Deutsche Anlage zur gewinnung von trink- und/oder brauchwasser aus meerwasser
US4054479A (en) * 1976-12-22 1977-10-18 E. I. Du Pont De Nemours And Company Additive process for producing printed circuit elements using a self-supported photosensitive sheet
JPS5638311A (en) * 1979-09-06 1981-04-13 Canon Inc Photosetting composition
JPS58199341A (ja) * 1982-05-17 1983-11-19 Tokyo Ohka Kogyo Co Ltd 耐熱性感光性樹脂組成物

Also Published As

Publication number Publication date
JPS5912434A (ja) 1984-01-23

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