JPH0561778B2 - - Google Patents

Info

Publication number
JPH0561778B2
JPH0561778B2 JP63173752A JP17375288A JPH0561778B2 JP H0561778 B2 JPH0561778 B2 JP H0561778B2 JP 63173752 A JP63173752 A JP 63173752A JP 17375288 A JP17375288 A JP 17375288A JP H0561778 B2 JPH0561778 B2 JP H0561778B2
Authority
JP
Japan
Prior art keywords
wire
lead wire
thin
thin lead
wires
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP63173752A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0225043A (ja
Inventor
Kazumi Takahata
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sanken Electric Co Ltd
Original Assignee
Sanken Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sanken Electric Co Ltd filed Critical Sanken Electric Co Ltd
Priority to JP63173752A priority Critical patent/JPH0225043A/ja
Publication of JPH0225043A publication Critical patent/JPH0225043A/ja
Publication of JPH0561778B2 publication Critical patent/JPH0561778B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H—ELECTRICITY
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    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/4501—Shape
    • H01L2224/45012—Cross-sectional shape
    • H01L2224/45015—Cross-sectional shape being circular
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    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
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    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45117—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 400°C and less than 950°C
    • H01L2224/45124—Aluminium (Al) as principal constituent
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    • H01L2224/45144—Gold (Au) as principal constituent
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    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
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    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
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Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
JP63173752A 1988-07-14 1988-07-14 リード細線の垂下防止構造を有する電子部品 Granted JPH0225043A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP63173752A JPH0225043A (ja) 1988-07-14 1988-07-14 リード細線の垂下防止構造を有する電子部品

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP63173752A JPH0225043A (ja) 1988-07-14 1988-07-14 リード細線の垂下防止構造を有する電子部品

Publications (2)

Publication Number Publication Date
JPH0225043A JPH0225043A (ja) 1990-01-26
JPH0561778B2 true JPH0561778B2 (enExample) 1993-09-07

Family

ID=15966477

Family Applications (1)

Application Number Title Priority Date Filing Date
JP63173752A Granted JPH0225043A (ja) 1988-07-14 1988-07-14 リード細線の垂下防止構造を有する電子部品

Country Status (1)

Country Link
JP (1) JPH0225043A (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2841921B2 (ja) * 1991-05-30 1998-12-24 トヨタ自動車株式会社 内燃機関の電子制御燃料噴射装置

Also Published As

Publication number Publication date
JPH0225043A (ja) 1990-01-26

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