JPH056176B2 - - Google Patents

Info

Publication number
JPH056176B2
JPH056176B2 JP61079143A JP7914386A JPH056176B2 JP H056176 B2 JPH056176 B2 JP H056176B2 JP 61079143 A JP61079143 A JP 61079143A JP 7914386 A JP7914386 A JP 7914386A JP H056176 B2 JPH056176 B2 JP H056176B2
Authority
JP
Japan
Prior art keywords
mask
masks
pattern
symbol
identification symbol
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP61079143A
Other languages
English (en)
Japanese (ja)
Other versions
JPS62235952A (ja
Inventor
Koichi Nishiuchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
National Institute of Advanced Industrial Science and Technology AIST
Original Assignee
Agency of Industrial Science and Technology
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Agency of Industrial Science and Technology filed Critical Agency of Industrial Science and Technology
Priority to JP61079143A priority Critical patent/JPS62235952A/ja
Publication of JPS62235952A publication Critical patent/JPS62235952A/ja
Publication of JPH056176B2 publication Critical patent/JPH056176B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/544—Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/38—Masks having auxiliary features, e.g. special coatings or marks for alignment or testing; Preparation thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/544—Marks applied to semiconductor devices or parts
    • H01L2223/54433—Marks applied to semiconductor devices or parts containing identification or tracking information
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/544—Marks applied to semiconductor devices or parts
    • H01L2223/54473—Marks applied to semiconductor devices or parts for use after dicing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Preparing Plates And Mask In Photomechanical Process (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
JP61079143A 1986-04-08 1986-04-08 半導体装置用マスク Granted JPS62235952A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP61079143A JPS62235952A (ja) 1986-04-08 1986-04-08 半導体装置用マスク

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP61079143A JPS62235952A (ja) 1986-04-08 1986-04-08 半導体装置用マスク

Publications (2)

Publication Number Publication Date
JPS62235952A JPS62235952A (ja) 1987-10-16
JPH056176B2 true JPH056176B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1993-01-26

Family

ID=13681738

Family Applications (1)

Application Number Title Priority Date Filing Date
JP61079143A Granted JPS62235952A (ja) 1986-04-08 1986-04-08 半導体装置用マスク

Country Status (1)

Country Link
JP (1) JPS62235952A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0650712B2 (ja) * 1988-11-10 1994-06-29 三洋電機株式会社 半導体装置の製造方法
DE10065537A1 (de) * 2000-12-28 2002-08-14 Infineon Technologies Ag Verfahren zur Identifikation einer auf einen Wafer projizierten Maske nach der Belichtung des Wafers
US7120884B2 (en) * 2000-12-29 2006-10-10 Cypress Semiconductor Corporation Mask revision ID code circuit
JP5285859B2 (ja) * 2007-02-20 2013-09-11 株式会社ソニー・コンピュータエンタテインメント 半導体装置の製造方法および半導体装置
JP2012063434A (ja) * 2010-09-14 2012-03-29 Ricoh Co Ltd フォトマスクの版数確認用半導体セル

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5587149A (en) * 1978-12-25 1980-07-01 Mitsubishi Electric Corp Photomask for preparation of semiconductor wafer
JPS57179849A (en) * 1981-04-30 1982-11-05 Nec Corp Photo mask

Also Published As

Publication number Publication date
JPS62235952A (ja) 1987-10-16

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term