JPH0559583B2 - - Google Patents

Info

Publication number
JPH0559583B2
JPH0559583B2 JP1736083A JP1736083A JPH0559583B2 JP H0559583 B2 JPH0559583 B2 JP H0559583B2 JP 1736083 A JP1736083 A JP 1736083A JP 1736083 A JP1736083 A JP 1736083A JP H0559583 B2 JPH0559583 B2 JP H0559583B2
Authority
JP
Japan
Prior art keywords
semiconductor device
package body
logic
semiconductor
semiconductor package
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1736083A
Other languages
English (en)
Japanese (ja)
Other versions
JPS59144161A (ja
Inventor
Takashi Ishida
Kunizo Sawara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP1736083A priority Critical patent/JPS59144161A/ja
Publication of JPS59144161A publication Critical patent/JPS59144161A/ja
Publication of JPH0559583B2 publication Critical patent/JPH0559583B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP1736083A 1983-02-07 1983-02-07 半導体装置 Granted JPS59144161A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1736083A JPS59144161A (ja) 1983-02-07 1983-02-07 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1736083A JPS59144161A (ja) 1983-02-07 1983-02-07 半導体装置

Publications (2)

Publication Number Publication Date
JPS59144161A JPS59144161A (ja) 1984-08-18
JPH0559583B2 true JPH0559583B2 (cs) 1993-08-31

Family

ID=11941871

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1736083A Granted JPS59144161A (ja) 1983-02-07 1983-02-07 半導体装置

Country Status (1)

Country Link
JP (1) JPS59144161A (cs)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5539156B2 (ja) * 2010-10-29 2014-07-02 ルネサスエレクトロニクス株式会社 半導体集積回路装置
JP2014179484A (ja) * 2013-03-15 2014-09-25 Toshiba Corp 半導体記憶装置

Also Published As

Publication number Publication date
JPS59144161A (ja) 1984-08-18

Similar Documents

Publication Publication Date Title
US6836007B2 (en) Semiconductor package including stacked semiconductor chips
KR100753415B1 (ko) 스택 패키지
US6365966B1 (en) Stacked chip scale package
US6452279B2 (en) Semiconductor device
US5166866A (en) Semiconductor package
JP4377269B2 (ja) 半導体装置
US5331200A (en) Lead-on-chip inner lead bonding lead frame method and apparatus
JPH0199248A (ja) 半導体装置
JPH0559583B2 (cs)
US20040238924A1 (en) Semiconductor package
US8410597B2 (en) Three dimensional semiconductor device
JP3124381B2 (ja) 半導体装置及び実装構造体
JPS6129140A (ja) 半導体装置
JPH01137660A (ja) 半導体装置
CN110416169A (zh) 半导体模块
JP3016049B2 (ja) 半導体装置
KR940005713B1 (ko) 반도체 패키지
KR20010058586A (ko) 반도체패키지 및 이를 이용한 실장방법
JPS63164261A (ja) 半導体装置
KR100368968B1 (ko) 스택형 패키지
JPS6016453A (ja) 集積回路装置用パツケ−ジ
JP3203806B2 (ja) 半導体装置の実装構造
JP2004228259A (ja) 半導体装置及びそれを用いた電子装置
JPS62210661A (ja) 半導体装置
JPH02310957A (ja) 半導体装置