JPH0558657B2 - - Google Patents

Info

Publication number
JPH0558657B2
JPH0558657B2 JP62240014A JP24001487A JPH0558657B2 JP H0558657 B2 JPH0558657 B2 JP H0558657B2 JP 62240014 A JP62240014 A JP 62240014A JP 24001487 A JP24001487 A JP 24001487A JP H0558657 B2 JPH0558657 B2 JP H0558657B2
Authority
JP
Japan
Prior art keywords
semiconductor chip
film carrier
lead
leads
bonding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP62240014A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6481330A (en
Inventor
Koichi Takegawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Electric Co Ltd filed Critical Nippon Electric Co Ltd
Priority to JP62240014A priority Critical patent/JPS6481330A/ja
Publication of JPS6481330A publication Critical patent/JPS6481330A/ja
Publication of JPH0558657B2 publication Critical patent/JPH0558657B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto

Landscapes

  • Wire Bonding (AREA)
JP62240014A 1987-09-24 1987-09-24 Film carrier semiconductor device Granted JPS6481330A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62240014A JPS6481330A (en) 1987-09-24 1987-09-24 Film carrier semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62240014A JPS6481330A (en) 1987-09-24 1987-09-24 Film carrier semiconductor device

Publications (2)

Publication Number Publication Date
JPS6481330A JPS6481330A (en) 1989-03-27
JPH0558657B2 true JPH0558657B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1993-08-27

Family

ID=17053177

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62240014A Granted JPS6481330A (en) 1987-09-24 1987-09-24 Film carrier semiconductor device

Country Status (1)

Country Link
JP (1) JPS6481330A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7198969B1 (en) 1990-09-24 2007-04-03 Tessera, Inc. Semiconductor chip assemblies, methods of making same and components for same
US5117275A (en) * 1990-10-24 1992-05-26 International Business Machines Corporation Electronic substrate multiple location conductor attachment technology
JP2674536B2 (ja) * 1993-12-16 1997-11-12 日本電気株式会社 チップキャリア半導体装置及びその製造方法
JP2647001B2 (ja) * 1994-05-31 1997-08-27 日本電気株式会社 テープキャリアならびに半導体デバイスの実装構造およびその製造方法
JP2768315B2 (ja) * 1994-09-22 1998-06-25 日本電気株式会社 半導体装置
JP3487524B2 (ja) 1994-12-20 2004-01-19 株式会社ルネサステクノロジ 半導体装置及びその製造方法
JP4528977B2 (ja) * 1994-12-20 2010-08-25 ルネサスエレクトロニクス株式会社 半導体装置の製造方法
JP2008277872A (ja) * 1994-12-20 2008-11-13 Renesas Technology Corp 半導体装置
JPH09252023A (ja) * 1996-03-15 1997-09-22 Nec Corp 半導体装置およびその製造方法
AU4571897A (en) * 1996-10-22 1998-05-15 Seiko Epson Corporation Film carrier tape, tape carrier semiconductor device assembly, semiconductor device, its manufacturing method, package substrate, and electronic appliance

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6395639A (ja) * 1986-10-09 1988-04-26 Mitsubishi Electric Corp テ−プキヤリア

Also Published As

Publication number Publication date
JPS6481330A (en) 1989-03-27

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