JPH0557757B2 - - Google Patents

Info

Publication number
JPH0557757B2
JPH0557757B2 JP62186091A JP18609187A JPH0557757B2 JP H0557757 B2 JPH0557757 B2 JP H0557757B2 JP 62186091 A JP62186091 A JP 62186091A JP 18609187 A JP18609187 A JP 18609187A JP H0557757 B2 JPH0557757 B2 JP H0557757B2
Authority
JP
Japan
Prior art keywords
film
conductive
paste
housing
conductive layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP62186091A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6428997A (en
Inventor
Shinichi Wakita
Fumio Nakaya
Hisatoshi Murakami
Tsunehiko Terada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tatsuta Electric Wire and Cable Co Ltd
Original Assignee
Tatsuta Electric Wire and Cable Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tatsuta Electric Wire and Cable Co Ltd filed Critical Tatsuta Electric Wire and Cable Co Ltd
Priority to JP18609187A priority Critical patent/JPS6428997A/ja
Publication of JPS6428997A publication Critical patent/JPS6428997A/ja
Publication of JPH0557757B2 publication Critical patent/JPH0557757B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14778—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles the article consisting of a material with particular properties, e.g. porous, brittle
    • B29C45/14811—Multilayered articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2995/00—Properties of moulding materials, reinforcements, fillers, preformed parts or moulds
    • B29K2995/0003—Properties of moulding materials, reinforcements, fillers, preformed parts or moulds having particular electrical or magnetic properties, e.g. piezoelectric
    • B29K2995/0011—Electromagnetic wave shielding material

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
JP18609187A 1987-07-24 1987-07-24 Electromagnetic wave shield molding Granted JPS6428997A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18609187A JPS6428997A (en) 1987-07-24 1987-07-24 Electromagnetic wave shield molding

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18609187A JPS6428997A (en) 1987-07-24 1987-07-24 Electromagnetic wave shield molding

Publications (2)

Publication Number Publication Date
JPS6428997A JPS6428997A (en) 1989-01-31
JPH0557757B2 true JPH0557757B2 (en, 2012) 1993-08-24

Family

ID=16182211

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18609187A Granted JPS6428997A (en) 1987-07-24 1987-07-24 Electromagnetic wave shield molding

Country Status (1)

Country Link
JP (1) JPS6428997A (en, 2012)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2612520B2 (ja) * 1991-11-15 1997-05-21 日本写真印刷株式会社 電磁波遮蔽成形体の製造方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61225900A (ja) * 1985-03-29 1986-10-07 大日本印刷株式会社 電磁波遮蔽用転写シ−ト

Also Published As

Publication number Publication date
JPS6428997A (en) 1989-01-31

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees