JPH0555580B2 - - Google Patents

Info

Publication number
JPH0555580B2
JPH0555580B2 JP20889486A JP20889486A JPH0555580B2 JP H0555580 B2 JPH0555580 B2 JP H0555580B2 JP 20889486 A JP20889486 A JP 20889486A JP 20889486 A JP20889486 A JP 20889486A JP H0555580 B2 JPH0555580 B2 JP H0555580B2
Authority
JP
Japan
Prior art keywords
wire
ball
bonding
ingot
ppm
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP20889486A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6365036A (ja
Inventor
Tooru Tanigawa
Shoji Shiga
Masaaki Kurihara
Kozo Okuda
Ichiro Kaga
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Furukawa Electric Co Ltd
Original Assignee
Furukawa Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Furukawa Electric Co Ltd filed Critical Furukawa Electric Co Ltd
Priority to JP61208894A priority Critical patent/JPS6365036A/ja
Publication of JPS6365036A publication Critical patent/JPS6365036A/ja
Publication of JPH0555580B2 publication Critical patent/JPH0555580B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/43—Manufacturing methods
    • H—ELECTRICITY
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    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/43—Manufacturing methods
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    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/43—Manufacturing methods
    • H01L2224/432—Mechanical processes
    • H01L2224/4321—Pulling
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    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
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    • H01L2224/438—Post-treatment of the connector
    • H01L2224/43848—Thermal treatments, e.g. annealing, controlled cooling
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    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
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    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
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    • H01L2224/45001—Core members of the connector
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    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45147—Copper (Cu) as principal constituent
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    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Conductive Materials (AREA)
  • Wire Bonding (AREA)
JP61208894A 1986-09-05 1986-09-05 銅細線とその製造方法 Granted JPS6365036A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP61208894A JPS6365036A (ja) 1986-09-05 1986-09-05 銅細線とその製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP61208894A JPS6365036A (ja) 1986-09-05 1986-09-05 銅細線とその製造方法

Publications (2)

Publication Number Publication Date
JPS6365036A JPS6365036A (ja) 1988-03-23
JPH0555580B2 true JPH0555580B2 (ko) 1993-08-17

Family

ID=16563889

Family Applications (1)

Application Number Title Priority Date Filing Date
JP61208894A Granted JPS6365036A (ja) 1986-09-05 1986-09-05 銅細線とその製造方法

Country Status (1)

Country Link
JP (1) JPS6365036A (ko)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2726939B2 (ja) * 1989-03-06 1998-03-11 日鉱金属 株式会社 加工性，耐熱性の優れた高導電性銅合金
JP3364336B2 (ja) * 1994-09-08 2003-01-08 ティーディーケイ株式会社 光ディスクおよび被記録材
JP2009153851A (ja) * 2007-12-27 2009-07-16 Konica Minolta Medical & Graphic Inc 超音波診断装置およびそれに用いる配線の製造方法
JP6056876B2 (ja) 2015-01-07 2017-01-11 三菱マテリアル株式会社 超伝導安定化材
JP6299802B2 (ja) 2016-04-06 2018-03-28 三菱マテリアル株式会社 超伝導安定化材、超伝導線及び超伝導コイル
JP6299803B2 (ja) 2016-04-06 2018-03-28 三菱マテリアル株式会社 超伝導線、及び、超伝導コイル
CN107799496B (zh) * 2017-09-01 2020-05-22 华南理工大学 一种电子封装用高可靠性铜合金键合丝及其制备方法
CN111910102B (zh) * 2020-07-14 2021-08-03 中南大学 一种铜银复合材料导线及其制备方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62102551A (ja) * 1985-10-30 1987-05-13 Toshiba Corp 半導体装置
JPS62253745A (ja) * 1986-04-25 1987-11-05 Mitsubishi Metal Corp 伸線加工性および導電性の良好なＣｕ合金超極細線

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62102551A (ja) * 1985-10-30 1987-05-13 Toshiba Corp 半導体装置
JPS62253745A (ja) * 1986-04-25 1987-11-05 Mitsubishi Metal Corp 伸線加工性および導電性の良好なＣｕ合金超極細線

Also Published As

Publication number Publication date
JPS6365036A (ja) 1988-03-23

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