JPH0553260U - Circuit board structure - Google Patents
Circuit board structureInfo
- Publication number
- JPH0553260U JPH0553260U JP10262591U JP10262591U JPH0553260U JP H0553260 U JPH0553260 U JP H0553260U JP 10262591 U JP10262591 U JP 10262591U JP 10262591 U JP10262591 U JP 10262591U JP H0553260 U JPH0553260 U JP H0553260U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- metal plate
- wiring layer
- heat dissipation
- insulating layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Insulated Metal Substrates For Printed Circuits (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Structure Of Printed Boards (AREA)
Abstract
(57)【要約】
【目的】 電気部品を実装した回路基板の放熱特性を向
上させる。
【構成】 回路基板を構成する金属板１に電気部品の電
極を除く底面の形状と同様の形状を持った突起２を形成
する。金属板１の突起２以外の表面に絶縁層３，配線層
４を積層する。実装された電気部品の熱は突起２を介し
て回路基板に伝達されて基板の温度分布を均一化させ、
放熱特性を向上させる。
(57) [Abstract] [Purpose] To improve the heat dissipation characteristics of a circuit board on which electrical components are mounted. [Structure] A protrusion 2 having a shape similar to the shape of the bottom surface of an electric component excluding the electrodes is formed on a metal plate 1 constituting a circuit board. The insulating layer 3 and the wiring layer 4 are laminated on the surface of the metal plate 1 other than the protrusions 2. The heat of the mounted electrical components is transferred to the circuit board via the protrusions 2 to make the temperature distribution of the board uniform,
Improves heat dissipation characteristics.
Description
【０００１】[0001]
本考案は電気部品を実装して電気回路を形成する回路基板に関し、特に実装さ れた電気部品の放熱特性を向上させた回路基板の構造に関する。 The present invention relates to a circuit board on which electric parts are mounted to form an electric circuit, and more particularly, to a structure of a circuit board having improved heat dissipation characteristics of the mounted electric parts.
【０００２】[0002]
従来の金属板と有機材料を組み合わせた回路基板は、この回路基板の全表面が 有機材料で被覆されていた。このため、回路基板に実装された電気部品は有機材 料と接触或いは近接するように搭載されていた。 In the conventional circuit board in which a metal plate and an organic material are combined, the entire surface of the circuit board is covered with the organic material. For this reason, the electric components mounted on the circuit board are mounted so as to come into contact with or come close to the organic material.
【０００３】[0003]
上記従来の回路基板では、全表面が有機材料で被覆されているため、金属板へ の熱伝導による放熱が阻害されるという問題があった。 In the above-mentioned conventional circuit board, since the entire surface is covered with the organic material, there is a problem that the heat dissipation to the metal plate due to heat conduction is hindered.
【０００４】 本考案の目的は、放熱特性を構造させた回路基板の構造を提供することにある 。An object of the present invention is to provide a structure of a circuit board having a structured heat dissipation characteristic.
【０００５】[0005]
本考案は、部品を実装して電気回路を形成する回路基板において、実装される 部品の底面形状と同様な形状を持った突起を形成した金属板を備え、かつ金属板 の突起以外の表面に積層された絶縁層および配線層を備えている。 The present invention provides a circuit board on which components are mounted to form an electric circuit, which includes a metal plate on which a protrusion having a shape similar to the bottom face of the component to be mounted is formed, and the surface of the metal plate other than the protrusion is formed. It has a laminated insulating layer and a wiring layer.
【０００６】[0006]
次に本考案について図面を参照して説明する。 Next, the present invention will be described with reference to the drawings.
【０００７】 図１は本考案の一実施例に係る回路基板の構造を示す正面図、図２は一部を破 断した状態を示す斜視図である。FIG. 1 is a front view showing a structure of a circuit board according to an embodiment of the present invention, and FIG. 2 is a perspective view showing a partially broken state.
【０００８】 図に示すように、回路基板を構成する金属板１の表面には複数の突起２が形成 されている。この突起２は回路基板の放熱特性を向上させる機能を有するもので あり、実装される電気部品の電極部分を除いた底面の形状と同様な形状に形成さ れると共に、電気部品の実装位置に対応して配置されている。As shown in the figure, a plurality of protrusions 2 are formed on the surface of a metal plate 1 which constitutes a circuit board. The protrusion 2 has the function of improving the heat dissipation characteristics of the circuit board, and is formed in the same shape as the bottom surface of the electrical component to be mounted excluding the electrode part, and it corresponds to the mounting position of the electrical component. It is arranged.
【０００９】 金属板１の突起２を除く全表面には絶縁層３が形成され、この絶縁層３に配線 層４が形成されている。絶縁層３および配線層４は露光方式、或いはエッチング ，メッキ等の方法によって形成することが可能である。また予め製作した絶縁層 ３および配線層４を接触部３を金属板１の表面に接着して形成することも可能で ある。An insulating layer 3 is formed on the entire surface of the metal plate 1 excluding the protrusions 2, and a wiring layer 4 is formed on the insulating layer 3. The insulating layer 3 and the wiring layer 4 can be formed by an exposure method or a method such as etching or plating. It is also possible to form the prefabricated insulating layer 3 and wiring layer 4 by bonding the contact portion 3 to the surface of the metal plate 1.
【００１０】 上記回路基板において、電気部品は突起２に対向して実装され、この電気部品 の熱は突起２を介して金属板１に伝達される。従って、従来の金属板の全表面を 有機材料を被覆した回路基板と比較して放熱特性を向上させることが可能である 。In the above circuit board, the electric component is mounted so as to face the protrusion 2, and the heat of the electric component is transferred to the metal plate 1 via the protrusion 2. Therefore, it is possible to improve the heat dissipation characteristics as compared with the conventional circuit board in which the entire surface of the metal plate is coated with the organic material.
【００１１】 また、金属板１の形状又は材質を適宜選択することで放熱量を変えることが可 能であり、より放熱特性を向上させることが可能となる。Further, by appropriately selecting the shape or material of the metal plate 1, it is possible to change the heat radiation amount, and it is possible to further improve the heat radiation characteristics.
【００１２】[0012]
以上説明したように、本考案は突起を形成した金属板に絶縁層を介して配線層 を形成したので、実装された電気部品の熱は突起を介して回路基板に伝達される 。このため、回路基板の温度分布を均一化することができ、放熱特性を向上させ ることができるという効果を有する。 As described above, according to the present invention, since the wiring layer is formed on the metal plate having the protrusions via the insulating layer, the heat of the mounted electric components is transferred to the circuit board via the protrusions. Therefore, there is an effect that the temperature distribution of the circuit board can be made uniform and the heat dissipation characteristics can be improved.
【図面の簡単な説明】[Brief description of drawings]
【図１】本考案の一実施例に係る回路基板の構造を示す
正面図である。FIG. 1 is a front view showing a structure of a circuit board according to an embodiment of the present invention.
【図２】本考案の一実施例に係る回路基板の一部を破断
した状態を示す斜視図である。FIG. 2 is a perspective view showing a state in which a part of a circuit board according to an embodiment of the present invention is cut away.
１ 金属板 ２ 突起 ３ 絶縁層 ４ 配線層 1 metal plate 2 protrusion 3 insulating layer 4 wiring layer
Claims (2)
路基板において、前記回路基板を構成する金属板に電気
部品の電極を除く底面部分の形状と同様の形状を持った
突起を形成したことを特徴とする回路基板の構造。1. A circuit board on which electric parts are mounted to form an electric circuit, wherein a projection having a shape similar to the shape of the bottom surface of the electric part except the electrodes is formed on a metal plate forming the circuit board. A structure of a circuit board characterized by the above.
び配線層を積層すると共に、前記配線層の表面を突起の
表面と同一面に形成したことを特徴とする請求項２記載
の回路基板構造。2. The circuit according to claim 2, wherein an insulating layer and a wiring layer are laminated on the surface of the metal plate other than the projections, and the surface of the wiring layer is formed flush with the surface of the projections. Substrate structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10262591U JPH0553260U (en) | 1991-12-13 | 1991-12-13 | Circuit board structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10262591U JPH0553260U (en) | 1991-12-13 | 1991-12-13 | Circuit board structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0553260U true JPH0553260U (en) | 1993-07-13 |
Family
ID=14332426
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10262591U Pending JPH0553260U (en) | 1991-12-13 | 1991-12-13 | Circuit board structure |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0553260U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPWO2005094144A1 (en) * | 2004-03-29 | 2008-02-14 | 三洋電機株式会社 | Circuit device and manufacturing method thereof |
| JP6263301B1 (en) * | 2017-06-15 | 2018-01-17 | 西村陶業株式会社 | Ceramic substrate and semiconductor module |
-
1991
- 1991-12-13 JP JP10262591U patent/JPH0553260U/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPWO2005094144A1 (en) * | 2004-03-29 | 2008-02-14 | 三洋電機株式会社 | Circuit device and manufacturing method thereof |
| JP6263301B1 (en) * | 2017-06-15 | 2018-01-17 | 西村陶業株式会社 | Ceramic substrate and semiconductor module |
| JP2018093163A (en) * | 2017-06-15 | 2018-06-14 | 西村陶業株式会社 | Ceramic substrate and semiconductor module |
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