JPH02249293A - Metal base substrate - Google Patents
Metal base substrateInfo
- Publication number
- JPH02249293A JPH02249293A JP7086989A JP7086989A JPH02249293A JP H02249293 A JPH02249293 A JP H02249293A JP 7086989 A JP7086989 A JP 7086989A JP 7086989 A JP7086989 A JP 7086989A JP H02249293 A JPH02249293 A JP H02249293A
- Authority
- JP
- Japan
- Prior art keywords
- metal base
- insulating layers
- inorganic
- insulating layer
- components
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 title claims abstract description 30
- 239000000758 substrate Substances 0.000 title claims abstract description 23
- 229910010272 inorganic material Inorganic materials 0.000 claims description 7
- 239000011147 inorganic material Substances 0.000 claims description 7
- 239000011368 organic material Substances 0.000 claims description 6
- 238000009413 insulation Methods 0.000 claims description 2
- 239000004020 conductor Substances 0.000 abstract description 10
- 239000011347 resin Substances 0.000 abstract description 4
- 229920005989 resin Polymers 0.000 abstract description 4
- 238000010438 heat treatment Methods 0.000 abstract 2
- 230000017525 heat dissipation Effects 0.000 description 6
- 230000000694 effects Effects 0.000 description 4
- 239000011810 insulating material Substances 0.000 description 3
- 230000020169 heat generation Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 1
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明は、多数の部品を実装して電気回路を形成するメ
タルベース基板に関するものである。DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a metal base substrate on which a large number of components are mounted to form an electric circuit.
従来の技術
近年、回路基板の高密度化に伴ないメタルベース基板の
利用範囲が広がっている。中でも、モーターの駆動用基
板等のハイパワーを必要とする基板をはじめ、ハイブリ
ッ）ＩＣを形成する基板においては、その基板の放熱性
が基板の材質選択の重要な要素のひとつとなっておシ、
メタルベース基板はその放熱性と機械的強度の点で重要
視されている。BACKGROUND OF THE INVENTION In recent years, the range of uses for metal-based substrates has expanded as the density of circuit boards has increased. In particular, for substrates that require high power such as motor drive substrates, and substrates that form hybrid ICs, the heat dissipation of the substrate is one of the important factors in selecting the substrate material. ,
Metal-based substrates are valued for their heat dissipation and mechanical strength.
以下１図面を参照しながら、従来のメタルベース基板の
一例について説明する。An example of a conventional metal base substrate will be described below with reference to one drawing.
第２図は従来例のメタルベース基板の断面図を示すもの
である。第２図において、１はメタルベースである。２
は無機質からなる絶縁層で、導体の配線パターンとメタ
ルベース１との絶縁の役割を果たしている。３はヌル−
ホールで表面と裏面の導体４を電気的に接続している。FIG. 2 shows a cross-sectional view of a conventional metal base substrate. In FIG. 2, 1 is a metal base. 2
is an insulating layer made of inorganic material, which plays the role of insulating the conductor wiring pattern and the metal base 1. 3 is null-
The conductor 4 on the front and back surfaces are electrically connected through the hole.
４は導体の配線パターンである。4 is a conductor wiring pattern.
このようなメタルベース基板は、まず、メタルベーク１
上に絶縁層となる無機質からなる絶縁材料が焼き付けら
れ、最初の層が形成される。次に。First, metal bake 1 is used to create such a metal base board.
An inorganic insulating material is baked on top to form the first layer. next.
その層の表面に導体４が回路パターンとして形成されて
回路基板として使用されるようになされている。A conductor 4 is formed as a circuit pattern on the surface of the layer so that it can be used as a circuit board.
発明が解決しようとする課題
しかしながら、上記のような構成では、メタルベー７１
の表面全体が無機材料で覆われているので、発熱量の少
ない部品の実装部分にも無機質の絶縁層によって絶縁処
理されておシ、そのために全体の厚みが厚くなυ、コス
トが必要以上にかかつてしまうという問題点を有してい
た。Problems to be Solved by the Invention However, in the above configuration, the metal base 71
Since the entire surface of the device is covered with an inorganic material, the parts where components with low heat generation are mounted are also insulated with an inorganic insulating layer, which increases the overall thickness and the cost. This had the problem that it would get old.
本発明は上記問題点に鑑み、部品の種類によって、絶縁
層の種類を発熱量の多い部品の部分には無機質の絶縁材
料を用い、発熱量の少ない部品の部分にはコストの安い
有機質の絶縁層を用い、放熱効果が良好で、コストの安
いメタルベース基板を提供するものである。In view of the above-mentioned problems, the present invention changes the type of insulating layer depending on the type of parts, using an inorganic insulating material for parts that generate a large amount of heat, and using a low-cost organic insulating material for parts that generate a small amount of heat. The present invention provides a metal base substrate that uses a layer, has a good heat dissipation effect, and is inexpensive.
課題を解決するだめの手段
上記問題点を解決するために、本発明のメタルベース基
板は、メタルベースの上に、無機質からなる絶縁層と、
コストの安い有機質からなる絶縁層とが、部分的に区分
して設けられたものである。Means for Solving the Problems In order to solve the above problems, the metal base substrate of the present invention includes an insulating layer made of an inorganic material on a metal base,
An insulating layer made of an inexpensive organic material is provided in a partially divided manner.
作用
上記した構成によって、このメタルベース基板を用いる
と、発熱量の大きい部品が実装される部分には無機質か
らなる絶縁層を設けることにより部品からの発熱を効率
的に放熱することができ。Effect With the above-described configuration, when this metal base board is used, an insulating layer made of an inorganic material is provided in a portion where a component that generates a large amount of heat is mounted, so that heat generated from the component can be efficiently dissipated.
発熱量の少い部品が実装される部分には有機質からなる
絶縁層を設けることによりコストの低減を図ることがで
きて、基板に対する部品の実装に応じて絶縁層を無機質
と有機質に使い分けることにより大幅なコストダウンを
図りながら放熱効果の良い基板を実現することができる
こととなる。Costs can be reduced by providing an insulating layer made of an organic material in the area where components with low heat generation are mounted, and by using inorganic and organic insulating layers depending on the mounting of components on the board This means that it is possible to realize a substrate with good heat dissipation effect while achieving a significant cost reduction.
実施例
以下、本発明の一実施例のメタルベース基板について１
図面を参照しながら説明する。Example 1 Below is a description of a metal base substrate according to an example of the present invention.
This will be explained with reference to the drawings.
第１図は本発明の一実施例におけるメタルベース基板の
断面を示すものである。FIG. 1 shows a cross section of a metal base substrate in one embodiment of the present invention.
第１図において、１はメタルベースである。２は無機質
の絶縁層（ガラヌ質）で、導体４とメタルベー７１との
絶縁の役割を果たしている。３はスルーホールで表面と
裏面の導体４を接続している。５は有機質からなる樹脂
系の絶縁層で、印刷によって形成され、比較的発ｆＰ、
量の少ない部品が実装されている部分に用いられる。In FIG. 1, 1 is a metal base. Reference numeral 2 denotes an inorganic insulating layer (galanic material), which plays the role of insulating the conductor 4 and the metal base 71. A through hole 3 connects the conductor 4 on the front and back sides. 5 is a resin-based insulating layer made of organic material, formed by printing, and has a relatively high fP,
Used in areas where a small number of components are mounted.
上記のように構成されたメタルベース基板において、メ
タルベース１と導体４との間には、無機質（ガラヌ質）
からなる絶縁層２と有機質からなる樹脂系の絶縁層５が
部分的に区別されて存在する。発熱量の多い部品や高周
波に関係する部品は、絶縁層が無機質の方に実装し、そ
の他の部品については、有機質の絶縁層の方に実装する
。こうすることで、メタルベース基板のノイズに対する
特性が生かせ、基板の放熱もさらに良くなることが期待
できる。In the metal base substrate configured as described above, there is an inorganic material (galanium) between the metal base 1 and the conductor 4.
An insulating layer 2 made of a resin-based insulating layer 5 made of an organic material is partially differentiated from each other. Components that generate a large amount of heat or components related to high frequencies are mounted on an inorganic insulating layer, and other components are mounted on an organic insulating layer. By doing this, it is expected that the metal-based substrate's noise-resistance characteristics will be utilized and the heat dissipation of the substrate will be even better.
尚、無機質の絶縁層をガラヌとしたが、特に限定するも
のではなく、セラミックヌとしても良い。Although the inorganic insulating layer is made of galanium, it is not particularly limited and may be made of ceramic.
発明の効果
以上のように１本発明によれば、メタルベースと導体層
の絶縁に、そこに実装される部品の種類によって無機質
からなる絶縁層と有機質からなる絶縁層の異なった２種
類の絶縁層を区分して設けるようにしたことにより、発
熱量の違う部品を基板に効率的に実装することで基板か
らの放熱を改善でき、しかも回路全体のコストダウンを
達成することができる。Effects of the Invention As described above, 1. According to the present invention, two different types of insulation are used to insulate the metal base and the conductor layer, an insulating layer made of an inorganic material and an insulating layer made of an organic material, depending on the type of parts mounted thereon. By arranging the layers separately, it is possible to improve heat dissipation from the board by efficiently mounting components with different amounts of heat on the board, and it is also possible to reduce the cost of the entire circuit.
第１図は本発明の一実施例におけるメタルベース基板の
断面図、第２図は従来例のメタルベース基板の断面図で
ある。
１・・・・・・メタルベース、２・・・・・無機質（ガ
ラヌ質）の絶縁層、３・・・・・・フルーホール、４・
・・・・・導体＋５・・・・・・有機質（樹脂系）の絶
縁層。FIG. 1 is a sectional view of a metal base substrate according to an embodiment of the present invention, and FIG. 2 is a sectional view of a conventional metal base substrate. 1...metal base, 2...inorganic (galanium) insulating layer, 3...full hole, 4...
...Conductor +5...Organic (resin-based) insulating layer.
Claims (1)
設けられた部分と、有機質からなる絶縁層が設けられた
部分とが並設されてなるメタルベース基板。A metal base substrate in which a part provided with an insulating layer made of an inorganic material for insulation and a part provided with an insulating layer made of an organic material are arranged side by side on a metal base.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7086989A JPH02249293A (en) | 1989-03-23 | 1989-03-23 | Metal base substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7086989A JPH02249293A (en) | 1989-03-23 | 1989-03-23 | Metal base substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02249293A true JPH02249293A (en) | 1990-10-05 |
Family
ID=13443996
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7086989A Pending JPH02249293A (en) | 1989-03-23 | 1989-03-23 | Metal base substrate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02249293A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013026416A (en) * | 2011-07-20 | 2013-02-04 | Toyoda Gosei Co Ltd | Element mounting substrate and light emitting device including the same |
| JPWO2013046617A1 (en) * | 2011-09-28 | 2015-03-26 | パナソニックＩｐマネジメント株式会社 | Device mounting substrate, semiconductor module, and device mounting substrate manufacturing method |
-
1989
- 1989-03-23 JP JP7086989A patent/JPH02249293A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013026416A (en) * | 2011-07-20 | 2013-02-04 | Toyoda Gosei Co Ltd | Element mounting substrate and light emitting device including the same |
| JPWO2013046617A1 (en) * | 2011-09-28 | 2015-03-26 | パナソニックＩｐマネジメント株式会社 | Device mounting substrate, semiconductor module, and device mounting substrate manufacturing method |
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