JPH0563380A - Package mounting system - Google Patents

Package mounting system

Info

Publication number
JPH0563380A
JPH0563380A JP24700391A JP24700391A JPH0563380A JP H0563380 A JPH0563380 A JP H0563380A JP 24700391 A JP24700391 A JP 24700391A JP 24700391 A JP24700391 A JP 24700391A JP H0563380 A JPH0563380 A JP H0563380A
Authority
JP
Japan
Prior art keywords
metal plate
conductive
flexible board
attached
metal sheet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP24700391A
Other languages
Japanese (ja)
Inventor
Fushimi Yamauchi
節美 山内
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP24700391A priority Critical patent/JPH0563380A/en
Publication of JPH0563380A publication Critical patent/JPH0563380A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate

Landscapes

  • Mounting Of Printed Circuit Boards And The Like (AREA)

Abstract

PURPOSE:To form an arbitrarily shaped package structure wherein its heat- dissipating effect is increased and its grounding action is ensured sufficiently by a method wherein a metal sheet and a flexible board are pasted by using a conductive adhesive. CONSTITUTION:A metal sheet 2 is provided with a function as a grounding action and with a function to perform a heat-dissipating action. It is bent and shaped to various arbitrary shapes. A flexible board 1 is provided with flexibility, and a plurality of components 3, 3,... are attached. The flexible board 1 is attached to the metal sheet 2 in an arbitrary shape along its surface by utilizing the flexibility by means of a conductive adhesive or a conductive magic tape 5. A conductivity is ensured between the metal sheet 2 and the flexible board 1 by means of the conductive adhesive or the conductive magic tape 5.

Description

【発明の詳細な説明】Detailed Description of the Invention

【０００１】[0001]

【産業上の利用分野】本発明は電子部品を搭載したパッ
ケージに関し、特に、その構造に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a package having electronic parts mounted thereon, and more particularly to the structure thereof.

【０００２】[0002]

【従来の技術】従来のパッケージは図２に示すように、
ガラスエポキシ基板又はベーク基板１０上に部品１１を
半田付にて実装した構造を有している。2. Description of the Related Art A conventional package, as shown in FIG.
It has a structure in which a component 11 is mounted on a glass epoxy substrate or a bake substrate 10 by soldering.

【０００３】[0003]

【発明が解決しようとする課題】この従来のパッケージ
では、放熱効果が少なく、しかもＧＮＤが多くとれな
い。In this conventional package, the heat radiation effect is small, and moreover, the GND cannot be increased.

【０００４】また、変形することができないという問題
点があった。There is also a problem that it cannot be deformed.

【０００５】本発明の目的は前記課題を解決したパッケ
ージ実装方式を提供することにある。An object of the present invention is to provide a package mounting method that solves the above problems.

【０００６】[0006]

【課題を解決するための手段】前記目的を達成するた
め、本発明に係るパッケージ実装方式においては、金属
板とフレキシブル基板とを組合せてなるパッケージ実装
方式であって、金属板は、任意形状に成形されたもので
あり、フレキシブル基板は、部品が実装されたものであ
り、可撓性を有し、前記金属板の表面に電気的に導通さ
せて貼付けられたものである。In order to achieve the above object, the package mounting method according to the present invention is a package mounting method in which a metal plate and a flexible substrate are combined, and the metal plate has an arbitrary shape. The flexible board is formed by mounting components, has flexibility, and is attached to the surface of the metal plate so as to be electrically conductive.

【０００７】また、前記金属板とフレキシブル基板と
は、導電性接着剤又は導電性マジックテープにより貼り
合されたものである。The metal plate and the flexible substrate are attached to each other with a conductive adhesive or a conductive magic tape.

【０００８】[0008]

【作用】本発明では、部品をフレキシブル基板に取付
け、該フレキシブル基板を種々形状の金属板に貼付ける
ようにしたものである。According to the present invention, the component is attached to the flexible board and the flexible board is attached to the metal plate of various shapes.

【０００９】[0009]

【実施例】以下、本発明の一実施例を図により説明す
る。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings.

【００１０】図１は、本発明の一実施例を示す斜視図で
ある。FIG. 1 is a perspective view showing an embodiment of the present invention.

【００１１】図１において、金属板２は、ＧＮＤとして
の機能と、放熱作用を行う機能とを備えており、種々の
任意形状に折曲成形されている。４は、金属板２の端縁
に開口された取付孔である。In FIG. 1, the metal plate 2 has a function as a GND and a function for radiating heat, and is bent and formed into various arbitrary shapes. Reference numeral 4 is a mounting hole opened at the edge of the metal plate 2.

【００１２】フレキシブル基板１は、可撓性を有してお
り、複数の部品３，３…が取付けられている。The flexible substrate 1 is flexible and has a plurality of components 3, 3 ... Attached thereto.

【００１３】フレキシブル基板１は、可撓性を利用し
て、任意形状の金属板２の表面形状に沿って導電性接着
剤又は導電性マジックテープ５により取付けられてい
る。The flexible substrate 1 is attached by a conductive adhesive or a conductive magic tape 5 along the surface shape of the metal plate 2 having an arbitrary shape by utilizing flexibility.

【００１４】導電性接着剤又は導電性マジックテープ５
により金属板２とフレキシブル基板１との間の導電性が
確保されている。Conductive adhesive or conductive magic tape 5
Thereby, the conductivity between the metal plate 2 and the flexible substrate 1 is secured.

【００１５】[0015]

【発明の効果】以上説明したように本発明は、金属板と
フレキシブル基板とを導電性接着剤で貼り合せたことに
より、金属板を利用して放熱効果を高めることができ、
しかも、ＧＮＤを十分に確保できる。As described above, according to the present invention, since the metal plate and the flexible substrate are bonded with the conductive adhesive, the heat dissipation effect can be enhanced by using the metal plate.
Moreover, the GND can be sufficiently secured.

【００１６】さらにフレキシブル基板の可撓性を利用す
ることにより、任意形状のパッケージ構造にできるとい
う効果を有するFurther, by utilizing the flexibility of the flexible substrate, there is an effect that a package structure having an arbitrary shape can be formed.

【図面の簡単な説明】[Brief description of drawings]

【図１】本発明の一実施例を示す斜視図である。FIG. 1 is a perspective view showing an embodiment of the present invention.

【図２】従来例を示す斜視図である。FIG. 2 is a perspective view showing a conventional example.

【符号の説明】[Explanation of symbols]

１ フレキシブル基板 ２ 金属板 ３ 部品 ４ 取付孔 ５ 導電性接着剤又は導電性マジックテープ 1 flexible substrate 2 metal plate 3 parts 4 mounting hole 5 conductive adhesive or conductive magic tape

Claims (2)

【特許請求の範囲】[Claims] 【請求項１】 金属板とフレキシブル基板とを組合せて
なるパッケージ実装方式であって、 金属板は、任意形状に成形されたものであり、 フレキシブル基板は、部品が実装されたものであり、可
撓性を有し、前記金属板の表面に電気的に導通させて貼
付けられたものであることを特徴とするパッケージ実装
方式。1. A package mounting method comprising a combination of a metal plate and a flexible substrate, wherein the metal plate is molded into an arbitrary shape, and the flexible substrate is a component mounted, A package mounting method having flexibility and being attached to the surface of the metal plate so as to be electrically conductive. 【請求項２】 前記金属板とフレキシブル基板とは、導
電性接着剤又は導電性マジックテープにより貼り合され
たことを特徴とする請求項１に記載のパッケージ実装方
式。2. The package mounting method according to claim 1, wherein the metal plate and the flexible substrate are attached to each other with a conductive adhesive or a conductive magic tape.
JP24700391A 1991-08-31 1991-08-31 Package mounting system Pending JPH0563380A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP24700391A JPH0563380A (en) 1991-08-31 1991-08-31 Package mounting system

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP24700391A JPH0563380A (en) 1991-08-31 1991-08-31 Package mounting system

Publications (1)

Publication Number Publication Date
JPH0563380A true JPH0563380A (en) 1993-03-12

Family

ID=17156938

Family Applications (1)

Application Number Title Priority Date Filing Date
JP24700391A Pending JPH0563380A (en) 1991-08-31 1991-08-31 Package mounting system

Country Status (1)

Country Link
JP (1) JPH0563380A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008071844A (en) * 2006-09-12 2008-03-27 Stanley Electric Co Ltd Method for fixing flexible board and lighting apparatus
JP2008235887A (en) * 2000-10-25 2008-10-02 Velcro Industries Bv Securing electrical conductor

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008235887A (en) * 2000-10-25 2008-10-02 Velcro Industries Bv Securing electrical conductor
JP2008071844A (en) * 2006-09-12 2008-03-27 Stanley Electric Co Ltd Method for fixing flexible board and lighting apparatus

Similar Documents

Publication Publication Date Title
JPH04368155A (en) Semiconductor device and electronic apparatus
JPH0563380A (en) Package mounting system
JP2734318B2 (en) Manufacturing method of hybrid integrated circuit device
JPH03132059A (en) Ic mounting
JPH05327249A (en) Electronic circuit module and manufacture thereof
JPS5935018Y2 (en) Electronic component mounting device
JPH06112361A (en) Hybrid integrated circuit
JP2900085B2 (en) Electronic component mounting board with heat dissipation member
JPS58225688A (en) Electric circuit part and method of producing same
JPH06181395A (en) Heat dissipation printed-wiring board
JPH0758430A (en) Connection structure of board
JPS609147A (en) Hybrid integrated circuit
JPH0134360Y2 (en)
JP2001210984A (en) Radiating structure of part
SE513630C2 (en) Method and apparatus for shielding electronic components
JPS6214718Y2 (en)
JPH0238471Y2 (en)
JPS63107194A (en) Radio frequency circuit device
JPS5855797Y2 (en) Chassis device
JPH06244511A (en) Printed wiring board
JPS6125251Y2 (en)
JPH032670U (en)
JPS6142880B2 (en)
JPS5954946U (en) hybrid integrated circuit
JPS6138997U (en) Board for mounting electronic components