JPS5935018Y2 - Electronic component mounting device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an electronic component mounting device, and more particularly to an electronic component mounting device that uses a metal substrate, has good heat dissipation properties, and is bendable.

2. Description of the Related Art In general, electronic devices such as electronic devices equipped with a large number of electronic components employ a so-called printed circuit board method.

First, this conventional printed circuit board method uses a printed circuit board with conductive lands made of thin metal foil such as copper on an insulating substrate such as phenol resin or epoxy resin, and electronic components such as resistors and transistors are mounted on this printed circuit board. This is the one with the attached.

However, in such electronic devices, the printed circuit board is made of resin and has poor thermal conductivity, making it unsuitable for mounting high-power components.

In addition, when mounting to a box such as a chassis, it is necessary to use a chassis designed in advance to a predetermined size to match the printed circuit board, resulting in poor space utilization efficiency.

Generally, when a power supply device is included in a high-power high-frequency circuit, the power supply circuit may pick up noise from the high-frequency circuit and malfunction, but there are drawbacks such as difficulty in shielding the printed circuit board.

The present invention was proposed in view of the above, and it uses a metal board as a printed circuit board to make it possible to mount high-power components, and also makes it bendable so that it can be easily mounted on a chassis, etc., and shielded the required parts. The present invention provides an electronic component mounting device.

Embodiments of the present invention will be described in detail below with reference to the drawings.

FIG. 1 is a perspective view of an embodiment of an electronic component mounting device according to the present invention, and FIG. 2 is a sectional view taken along the line ■-■ in FIG.
In the figure, 2 is a metal substrate such as an iron plate or an aluminum plate.

Reference numeral 3 denotes a plurality of insulating lands formed at a distance from each other, each consisting of an enamel insulating layer coated with a glass lining such as a low melting point glass or a resin insulating layer coated with a resin lining.

4 is a conductive land made of Ag paste that is printed and wired in a predetermined pattern on the insulating land 3, and electronic components 5 such as diodes, transistors, resistors, etc. are attached between each conductive land 4 by soldering or printed wiring, etc. It will be done.

Next, after the electronic component mounting device 1 configured in this way has the electronic component 5 mounted, it is bent at the mechanically weak portion 6 between each insulating land 3, 3, as shown in FIG. The mechanically weak part 6 between the insulating lands 3 and 3 is attached to the box 7 of the shear A1 etc.
As shown in the figure, the insulating land 3 is formed to be thinner than the part of the metal substrate 2 to which the insulating land 3 is attached, or it is formed to be bendable.
Or, it is constructed so that it can be easily bent by press-cutting a piece (not shown) to weaken its bending strength.

FIG. 4 shows another embodiment of the present invention, showing an electronic component mounting device 8 in which a metal substrate 2 on which a number of insulating lands 3 are formed is bent into a box shape.

That is, this electronic component mounting device 8 forms insulating lands 3 spaced apart from each other by depositing an insulating material layer on each developed surface of a metal substrate 2 which is not shown but is shaped like a bottomless rectangular parallelepiped. After printing and wiring conductive lands 4 with Ag paste on each insulating land 3 and attaching circuit components 5 such as diodes and resistors, bend the metal board 2 side outward and attach it to a box 7 such as a chassis. This is what I did.

Therefore, by incorporating a high-power high-frequency circuit into this mounting device 8, the high-power high-frequency circuit can be completely shielded from the outside, and magnetic induction and electromagnetic waves from the outside can be shielded, thereby ensuring reliable operation.

Although the metal substrate 2 side is bent outward in FIG. 4, it is also possible to bend the metal substrate 2 side inward to form a box shape. In this case, the box-shaped printed circuit board 8 is used as a shield plate. As a result, it is possible to lose internally.

As described above, the present invention provides a plurality of independent insulating lands separated from each other by depositing an insulating layer on a metal substrate having locally mechanically weak parts while avoiding the mechanically weak parts. was formed, electronic components were mounted on this insulating land in a state insulated from the metal substrate, and the mechanically weak parts between the insulating lands were bent. Therefore, a conductive land was provided on a conventional insulating substrate such as resin. It has significantly superior thermal conductivity compared to printed circuit boards, making it possible not only to attach high-power components to it, but also to freely attach it to a case such as a chassis, making effective use of the space in the case.

Furthermore, by bending and shaping it into a box shape, there is a practical effect that the interior can be easily shielded.

[Brief explanation of drawings]

Figure 1 is a perspective view of the electronic component mounting device of the present invention, Figure 2 is a schematic diagram taken from lines ■ to ■ in Figure 1, and Figure 3 is the electronic component mounting device of Figure 2 installed on the chassis. FIG. 4 is a sectional view corresponding to FIG. 3 of another embodiment of the present invention. 1.8...Electronic component mounting device, 2°° bent metal board, 3...Insulated land, 5...Electronic component, 6...Mechanical A weak part.

Claims (1)

[Scope of utility model registration request] A plurality of insulating lands spaced apart from each other are formed by depositing an insulating layer on a metal substrate having a locally mechanically weak portion, avoiding the mechanically weak portion, and forming a plurality of insulating lands spaced apart from each other. An electronic component mounting device characterized in that the electronic component is mounted in a state insulated from a metal substrate and bent at a mechanically weak portion between the insulating lands.