JPH0134360Y2 - - Google Patents
Info
- Publication number
- JPH0134360Y2 JPH0134360Y2 JP1981082785U JP8278581U JPH0134360Y2 JP H0134360 Y2 JPH0134360 Y2 JP H0134360Y2 JP 1981082785 U JP1981082785 U JP 1981082785U JP 8278581 U JP8278581 U JP 8278581U JP H0134360 Y2 JPH0134360 Y2 JP H0134360Y2
- Authority
- JP
- Japan
- Prior art keywords
- board
- rigid
- conductive layer
- flexible
- flexible board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000758 substrate Substances 0.000 claims description 7
- 229910000679 solder Inorganic materials 0.000 claims description 6
- 239000004020 conductor Substances 0.000 claims 1
- 230000000694 effects Effects 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000009434 installation Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Landscapes
- Multi-Conductor Connections (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Combinations Of Printed Boards (AREA)
Description
【考案の詳細な説明】
本考案は高密度実装基板装置に関するもので、
各基板相互の取付に対する信頼度を高めると共に
遮蔽効果を良くすることを目的とする。[Detailed description of the invention] This invention relates to a high-density mounting board device.
The purpose is to increase the reliability of the mutual attachment of each board and to improve the shielding effect.
たとえば、第１図のように、リジツド板１上に
接着剤２でもつてフレキシブル基板３を固定し、
そのパターン４に電気部品５を半田デイツプ等に
より取付た状態で第２図のように折曲げる。次
に、この状態でのリジツド板１を第３図のよう
に、マザー基板６の導電部に半田デイツプ等によ
り取付ることにより、マザー基板６を形成するこ
とができる。 For example, as shown in FIG. 1, a flexible board 3 is fixed on a rigid board 1 with an adhesive 2,
The electrical component 5 is attached to the pattern 4 using a solder dip or the like and then bent as shown in FIG. Next, as shown in FIG. 3, the mother board 6 can be formed by attaching the rigid board 1 in this state to the conductive portion of the mother board 6 using a solder dip or the like.
ここで第２図において電気部品５が取付られる
２つの面（すなわち表面と裏面）をＡ面、Ｂ面と
すれば双方の面間において電気的干渉がおきない
ように配慮しなければならない。 Here, in FIG. 2, if the two surfaces (that is, the front and back surfaces) on which the electrical component 5 is attached are surface A and surface B, care must be taken to prevent electrical interference between both surfaces.
そのためにリジツド板１に導電層７を設けてお
くことにより、これがＡ，Ｂ面間のシールド材と
なり干渉の防止がはかれる。 For this purpose, by providing the conductive layer 7 on the rigid plate 1, this serves as a shield material between the A and B surfaces, and interference can be prevented.
しかし、単に導電層７を設けただけではマザー
基板６とのアースがとりにくく、場合によつては
折曲げられフレキシブル基板３のＡ面、Ｂ面間
に、単にシールド材を設けているにすぎず、確実
なシールド効果は得られないという欠点があつ
た。 However, simply providing the conductive layer 7 makes it difficult to ground the motherboard 6, and in some cases, simply providing a shielding material between the A side and B side of the bent flexible board 3 is sufficient. First, the drawback was that a reliable shielding effect could not be obtained.
本考案は、このような欠点を除去するものであ
る。 The present invention eliminates these drawbacks.
以下、本考案の一実施例を第４図、第５図によ
り説明する。ここで、１〜７は第１図〜第３図に
示すものと同じである。図中９は、マザー基板６
に設けた高密度実装基板装着用の装着孔、８は切
欠き部、１１〜１３は半田によるマザー基板６の
パターン１０とフレキシブル基板３のパターン４
およびリジツド板１の導電層７との結合部であ
る。 An embodiment of the present invention will be described below with reference to FIGS. 4 and 5. Here, 1 to 7 are the same as shown in FIGS. 1 to 3. 9 in the figure is the mother board 6
8 is a notch, 11 to 13 are solder pattern 10 of the motherboard 6 and pattern 4 of the flexible board 3.
and a joint portion of the rigid plate 1 with the conductive layer 7.
本実施例は、表面をフレキシブル基板３でおお
つたリジツド基板１の装着部の一部に導電層７を
露出させるための切欠き部８を１個あるいは数個
設け、従来同様にマザー基板６に取付時に結合部
１１，１２部分の半田による固定の他に、結合部
１３の部分も半田による固定部としたものであ
る。 In this embodiment, one or several notches 8 are provided in a part of the attachment part of the rigid board 1 whose surface is covered with the flexible board 3 to expose the conductive layer 7, and the mother board 6 is covered with the flexible board 3 as in the conventional case. In addition to fixing the joint parts 11 and 12 with solder during installation, the joint part 13 is also fixed with solder.
以上のように本考案によればマザー基板とリジ
ツド板の導電層との結合がおこなえるようにシー
ルド効果を高めることができると共にマザー基板
への半田による固定部が増えるために、基板相互
の取付けに対する信頼性を高めることができる。 As described above, according to the present invention, it is possible to improve the shielding effect by bonding the conductive layer of the motherboard and the rigid board, and since the number of parts fixed to the motherboard by soldering increases, it is difficult to attach the boards to each other. Reliability can be increased.
第１図は従来の高密度基板装置の部分展開図、
第２図は同基板装置の部分斜視図、第３図は同基
板装置の部分断面図、第４図は本考案の一実施例
における高密度基板装置の分解斜視図、第５図は
同基板装置の部分断面図である。
１……リジツド板、２……接着剤、３……フレ
キシブル基板、４，１０……パターン、５……電
気部品、６……マザー基板、７……導電層、８…
…切欠き部、９……装着孔、１１，１２，１３…
…結合部。
Figure 1 is a partial exploded view of a conventional high-density substrate device.
2 is a partial perspective view of the same substrate device, FIG. 3 is a partial sectional view of the same substrate device, FIG. 4 is an exploded perspective view of a high-density substrate device in an embodiment of the present invention, and FIG. 5 is a partial perspective view of the same substrate device. FIG. 3 is a partial cross-sectional view of the device. DESCRIPTION OF SYMBOLS 1... Rigid board, 2... Adhesive, 3... Flexible board, 4, 10... Pattern, 5... Electrical component, 6... Mother board, 7... Conductive layer, 8...
...Notch, 9...Mounting hole, 11, 12, 13...
...joint part.
Claims (1)
フレキシブル基板の片面に所定の間隔隔てて固定
するとともに、上記フレキシブル基板を上記第
１、第２のリジツド板間で折曲げ上記第１、第２
のリジツド板を重ねてなる折曲フレキシブル基板
と、 上記折曲フレキシブル基板のリジツド板の導電
層が露出するように上記リジツド板に形成された
切欠き部と、 上記折曲フレキシブル基板の端部が挿入される
装着孔が形成されたマザー基板とを有し、 上記折曲フレキシブル基板の端部を上記マザー
基板の装着孔に装着し、上記リジツド板の切欠き
部より露出した上記導電層と上記マザー基板の導
体部とを半田により電気接続してなる高密度実装
基板装置。[Claims for Utility Model Registration] First and second rigid plates provided with conductive layers are fixed to one side of a flexible substrate at a predetermined interval, and the flexible substrate is attached to the first and second rigid plates. Fold between the first and second
a bent flexible board formed by stacking rigid boards; a notch formed in the rigid board so that the conductive layer of the rigid board of the bent flexible board is exposed; and an end part of the bent flexible board. and a mother board formed with a mounting hole into which the flexible board is inserted, and an end of the bent flexible board is mounted in the mounting hole of the mother board, and the conductive layer exposed from the notch of the rigid board and the A high-density mounting board device that is electrically connected to the conductor part of the motherboard using solder.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1981082785U JPH0134360Y2 (en) | 1981-06-04 | 1981-06-04 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1981082785U JPH0134360Y2 (en) | 1981-06-04 | 1981-06-04 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS57195872U JPS57195872U (en) | 1982-12-11 |
| JPH0134360Y2 true JPH0134360Y2 (en) | 1989-10-19 |
Family
ID=29878246
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1981082785U Expired JPH0134360Y2 (en) | 1981-06-04 | 1981-06-04 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0134360Y2 (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5448074A (en) * | 1977-09-21 | 1979-04-16 | Matsushita Electric Ind Co Ltd | Electronic circuit device |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS52120353U (en) * | 1976-03-09 | 1977-09-12 |
-
1981
- 1981-06-04 JP JP1981082785U patent/JPH0134360Y2/ja not_active Expired
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5448074A (en) * | 1977-09-21 | 1979-04-16 | Matsushita Electric Ind Co Ltd | Electronic circuit device |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS57195872U (en) | 1982-12-11 |
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