JP2008071844A - Method for fixing flexible board and lighting apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To reduce the risk of peeling from a metal plate 4 of a flexible board 2 while supprissing an assembling cost, and to reduce stress applied to solder sections of LEDs 1a, 1b and 1c. <P>SOLUTION: A stepped base member 5 and the approximately-complementary shaped metal plate 4 are supplied. The rear of the flexible board 2 at places (2a, 2b and 2c) mounting the LEDs 1a, 1b and 1c on its surface in the rear of the flexible board 2 mounting the LEDs 1a, 1b and 1c is joined with the surface of the metal plate 4. The rear of the flexible board 2 at the places (2a' and 2b') mounting no LED 1a, 1b and 1c on its surface is not joined with the surface of the metal plate 4 in this case. The metal plate 4 joining the flexible board 2 is fixed to the base member 5. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a flexible substrate fixing method for fixing a flexible substrate on which a plurality of electronic components are mounted to a stepped base member, and a lighting device manufactured using the method, and in particular, while suppressing assembly costs. The present invention relates to a flexible substrate fixing method and an illuminating device capable of reducing the risk of peeling of a flexible substrate from a metal plate and reducing stress applied to an electronic component.

  2. Description of the Related Art Conventionally, a flexible substrate fixing method for fixing a flexible substrate on which a plurality of electronic components are mounted to a stepped base member is known. As an example of this type of flexible substrate fixing method, for example, there is one described in JP-A-2005-116972.

  In the flexible substrate fixing method described in JP-A-2005-116972, a flexible substrate (flat cable) on which a plurality of electronic components (LEDs) are mounted is formed into a stepped base member (support base) by fixing claws. Fixed.

  By the way, Japanese Patent Application Laid-Open No. 2005-116972 describes that a flexible substrate is fixed to each step of the stepped base member by a fixing claw, but is described in Japanese Patent Application Laid-Open No. 2005-116972. In the method of fixing the flexible substrate, in reality, when the flexible substrate is bent stepwise and fixed to the base member of the step by the fixing claws, the flexible substrate is bent stepwise by the elasticity of the flexible substrate. The squeezed flexible substrate tries to return to a flat shape.

  Therefore, in the method for fixing a flexible substrate described in JP-A-2005-116972, before the flexible substrate is fixed to the base member by the fixing claws, the flexible substrate bent in a step shape is held in that state. In addition, the flexible substrate must be temporarily fixed to each step of the stepped base member.

  That is, in the method for fixing a flexible substrate described in Japanese Patent Application Laid-Open No. 2005-116972, when a large number of steps are provided on the stepped base member, a large number of temporarily fixing the flexible substrate to the base member is provided. This process becomes necessary.

  In particular, when a number of processes for temporarily fixing the flexible substrate to the base member are performed in a factory having a relatively high assembly cost per process, in the flexible substrate fixing method described in JP-A-2005-116972, There is a possibility that the entire assembly cost for fixing the flexible substrate to the base member increases.

  Furthermore, in another conventional flexible substrate fixing method, among the back surfaces of the flexible substrate on which a plurality of electronic components are mounted, the “backing” is performed on the back surface of the flexible substrate at the position where the electronic components are mounted on the front surface. Are joined by, for example, a double-sided tape or an adhesive. On the other hand, the backing is not bonded to the back surface of the flexible substrate at a position where no electronic component is mounted on the front surface. That is, in this flexible substrate fixing method, the same number of backings as the electronic components mounted on the flexible substrate are bonded to the flexible substrate.

  Next, in this flexible substrate fixing method, each backing is fixed to each step of the base member by, for example, screwing or heat caulking.

  Also in this flexible substrate fixing method, as in the flexible substrate fixing method described in Japanese Patent Application Laid-Open No. 2005-116972, before the backing is fixed to the base member by, for example, screwing or heat caulking, a stepped shape is used. In order to hold the flexible substrate bent in this state, the flexible substrate must be temporarily fixed to each step of the stepped base member.

  That is, also in this flexible substrate fixing method, when a large number of steps are provided on the stepped base member, a number of steps for temporarily fixing the flexible substrate to the base member are required.

  Therefore, especially when a number of processes for temporarily fixing the flexible board to the base member are performed at a factory where the assembly cost per process is relatively high, this flexible board fixing method also fixes the flexible board to the base member. This may increase the overall assembly cost.

  In still another conventional method of fixing a flexible substrate, the entire back surface of the flexible substrate on which a plurality of electronic components are mounted is bonded to a planar metal plate using, for example, a double-sided tape or an adhesive. Next, the planar metal plate is bent into a shape substantially complementary to the stepped base member. Accordingly, the flexible substrate joined to the metal plate is also bent stepwise.

  Next, in this flexible substrate fixing method, the metal plate is fixed to each step of the base member by, for example, screwing or heat caulking.

  By the way, in this flexible substrate fixing method, as described above, after the entire back surface of the flexible substrate is bonded to the surface of the planar metal plate, the flexible substrate and the metal plate are bent stepwise.

  Therefore, in this flexible substrate fixing method, when the flexible substrate and the metal plate are bent stepwise, the relative position of the back surface of the flexible substrate with respect to the surface of the metal plate is shifted, and the flexible substrate is easily peeled off from the metal plate. There is a risk of becoming.

  Further, in this flexible substrate fixing method, when the flexible substrate and the metal plate are bent stepwise, a tensile stress is applied to the flexible substrate, and the flexible substrate may extend. As a result, tensile stress is also applied to the solder part of the electronic component mounted on the flexible substrate, and the electronic component may be disconnected.

JP 2005-116972 A

  In view of the above-described problems, the present invention reduces the risk that a flexible substrate is peeled off from a metal plate while suppressing assembly costs, and can also reduce a stress applied to an electronic component and a lighting device. The purpose is to provide.

  According to the first aspect of the present invention, in the flexible substrate fixing method for fixing the flexible substrate on which the plurality of electronic components are mounted to the stepped base member, the metal plate substantially complementary to the stepped base member. Bonding the back surface of the flexible substrate at a position where the electronic component is mounted on the front surface of the back surface of the flexible substrate on which a plurality of electronic components are mounted to the surface of the metal plate, Including a step of not joining the back surface of the flexible substrate at a position where no electronic component is mounted to the surface of the metal plate, and a step of fixing the metal plate to which the flexible substrate is joined to the base member. A flexible substrate fixing method is provided.

  According to the second aspect of the present invention, the stepped metal plate is formed by bending a flat metal plate having a thickness of about 0.3 to 0.8 mm. Item 8. A flexible substrate fixing method according to Item 1, is provided.

  According to a third aspect of the present invention, there is provided the flexible substrate fixing method according to the first or second aspect, wherein the stepped metal plate made of aluminum or copper is used.

  According to invention of Claim 4, the back surface of the said flexible substrate of the position in which the electronic component is mounted in the surface is joined to the surface of the said metal plate so that the part which is not joined to the said metal plate has slack. The fixing method of the flexible substrate as described in any one of Claims 1-3 characterized by the above-mentioned is provided.

  According to invention of Claim 5, the illuminating device manufactured using the fixing method of the flexible substrate as described in any one of Claims 1-4 is provided.

  In the flexible substrate fixing method according to the first aspect of the invention, first, a step-like base member and a substantially complementary metal plate are supplied. That is, a stepped metal plate is supplied. Next, of the back surface of the flexible substrate on which a plurality of electronic components are mounted, the back surface of the flexible substrate at the position where the electronic component is mounted on the front surface is bonded to the surface of the metal plate by, for example, double-sided tape or adhesive. . At this time, the back surface of the flexible substrate at the position where the electronic component is not mounted on the surface is not bonded to the surface of the metal plate. Next, the stepped metal plate to which the flexible substrate is bonded is fixed to the stepped base member by, for example, screwing, heat caulking, ultrasonic caulking, or the like. Thereby, the flexible substrate on which a plurality of electronic components are mounted is fixed to the stepped base member.

  In other words, in the flexible substrate fixing method according to the first aspect, the flexible substrate is bonded to the metal plate bent in a step shape. Therefore, according to the method for fixing a flexible substrate according to claim 1, the flexible substrate and the metal plate are bent stepwise after the flexible substrate is joined to the planar metal plate. It is possible to reduce the possibility of peeling from the metal plate or applying tensile stress to the solder portion of the electronic component mounted on the flexible substrate.

  Furthermore, in the flexible substrate fixing method according to the first aspect, there is no need to temporarily fix the flexible substrate to the base member when the flexible substrate is fixed to the base member. Therefore, according to the fixing method of the flexible substrate according to claim 1, the entire assembly for fixing the flexible substrate to the base member is more than the conventional fixing method of the flexible substrate which has to be temporarily fixed to the base member. Cost can be suppressed.

  In other words, according to the method for fixing a flexible substrate according to claim 1, it is possible to reduce the stress applied to the electronic component while reducing the risk of the flexible substrate peeling from the metal plate while suppressing the assembly cost. it can.

  Preferably, in the flexible substrate fixing method according to claim 1, the back surface of the flexible substrate at a position where the electronic component is mounted on the surface is bonded to the surface of the stepped metal plate by, for example, a double-sided tape or an adhesive. The process is performed in a factory with a relatively low assembly cost per process, and the process of fixing the metal plate to which the flexible substrate is bonded to the base member by, for example, screwing, heat caulking, ultrasonic caulking, etc. It is carried out in a factory with a relatively high assembly cost per process.

  In the flexible substrate fixing method according to the second aspect, the stepped metal plate is formed by bending a planar metal plate having a plate thickness of about 0.3 to 0.8 mm.

  In other words, in the flexible substrate fixing method according to claim 2, when the stepped metal plate is attached to the stepped base member, the stepped metal plate has a thickness that can be slightly deformed. A metal plate is used.

  Therefore, according to the fixing method of the flexible substrate according to claim 2, the metal plate is attached when the metal plate is attached to the base member even when there is variation in the bending dimension of the stepped metal plate. By slightly deforming, the metal plate can be attached to a desired position of the base member.

  In the flexible substrate fixing method according to the third aspect, a stepped metal plate made of aluminum or copper having high heat dissipation is used. Therefore, according to the fixing method of the flexible substrate according to claim 3, when the metal plate is not disposed at all on the back surface of the flexible substrate, or the metal plate is disposed on the back surface of the flexible substrate at the position where the electronic component is mounted on the surface. Although disposed, the heat dissipation of the electronic component can be improved as compared with the case where the metal plate is not disposed on the back surface of the flexible substrate at the position where the electronic component is not mounted on the front surface.

  5. The flexible substrate fixing method according to claim 4, wherein the back surface of the flexible substrate at the position where the electronic component is mounted on the surface is the surface of the stepped metal plate so that the portion not joined to the metal plate has a slack. To be joined.

  Therefore, according to the fixing method of the flexible board | substrate of Claim 4, the possibility that a thermal stress may arise in a flexible board | substrate by the difference in the thermal expansion coefficient of a flexible board | substrate and a stair-like metal plate can be reduced.

  According to the illumination device of the fifth aspect, it is possible to reduce the stress applied to the electronic component while reducing the possibility of the flexible substrate peeling from the metal plate while suppressing the assembly cost.

  Hereinafter, a first embodiment of the illumination device of the present invention will be described. FIG. 1 is a perspective view of a main part of the lighting device according to the first embodiment, FIG. 2 is a cross-sectional view of the main part of the lighting device according to the first embodiment shown in FIG. 1, and FIG. It is component drawing of an illuminating device. Specifically, FIG. 3A is a perspective view of the flexible substrate 2 on which the LEDs 1a, 1b, and 1c are mounted, FIG. 3B is a perspective view of the stepped base member 5, and FIG. 3C is a flexible substrate. 2 is a perspective view of a metal plate 4 used for fixing 2 to a base member 5. FIG.

  1-3, 2a has shown the part in which LED1a is mounted among the flexible substrates 2, 2b has shown the part in which LED1b is mounted, 2c has mounted LED1c. Shows the part. Reference numerals 2a 'and 2b' denote portions of the flexible substrate 2 where the LEDs 1a, 1b and 1c are not mounted. 2a1, 2a2 indicate holes formed in the portion 2a, 2b1, 2b2 indicate holes formed in the portion 2b, and 2c1, 2c2 indicate holes formed in the portion 2c.

  In the lighting device of the first embodiment, the LEDs 1a, 1b, and 1c are mounted on the flexible substrate 2. However, in the lighting device of the second embodiment, any electronic device such as a transistor or a capacitor is used instead. It is also possible to mount the component on the flexible substrate 2.

  Further, in FIGS. 1 to 3, reference numerals 5 a, 5 b, and 5 c denote steps constituting the step-like base member 5. Reference numerals 5a1 and 5a2 denote protrusions formed on the step 5a, 5b1 and 5b2 denote protrusions formed on the step 5b, and 5c1 and 5c2 denote protrusions formed on the step 5c.

  In the lighting device of the first embodiment, the base member 5 is formed of, for example, resin. However, in the lighting device of the third embodiment, the base member 5 can be formed of a material other than resin instead. It is.

  Moreover, in FIGS. 1-3, 4a has shown the step corresponding to the step 5a of the base member 5 among the metal plates 4, 4b has shown the step corresponding to the step 5b of the base member 5, Reference numeral 4 c denotes a step corresponding to the step 5 c of the base member 5. Reference numeral 4a1 denotes a hole that can be fitted with the protrusion 5a1 of the base member 5, reference numeral 4a2 denotes a hole that can be fitted with the protrusion 5a2 of the base member 5, and reference numeral 4b1 denotes a fitting with the protrusion 5b1 of the base member 5. 4b2 indicates a hole that can be fitted with the protrusion 5b2 of the base member 5, 4c1 indicates a hole that can be fitted with the protrusion 5c1 of the base member 5, and 4c2 indicates a base member 5 This shows a hole that can be fitted to the projection 5c2.

  1 to 3, reference numeral 3 denotes a double-sided tape for joining the flexible substrate 2 to the metal plate 4. In the lighting device of the first embodiment, the flexible substrate 2 is joined to the metal plate 4 by the double-sided tape 3. However, in the lighting device of the fourth embodiment, instead of the flexible substrate 2 by the adhesive, the metal plate 4 is bonded. It is also possible to join them.

  FIG. 4 is a diagram showing a process in which the flexible substrate 2 on which the LEDs 1a, 1b, and 1c are mounted is fixed to the base member 5. Specifically, FIG. 4A is a diagram illustrating a process in which the flexible substrate 2 is bonded to the metal plate 4 by the double-sided tape 3, and FIG. 4B is a diagram illustrating the flexible substrate 2 on which the LEDs 1a, 1b, and 1c are mounted. FIG. 6 is a view showing a process in which an assembly 6 composed of a double-sided tape 3 and a metal plate 4 is fixed to a base member 5.

  In the illuminating device of the first embodiment, a planar sheet metal having an outer shape substantially the same as the outer shape of the flexible substrate 2 shown in FIG. 3A and a thickness of about 0.3 to 0.8 mm. However, it is bent in a step (not shown), and as a result, a step-like metal plate 4 as shown in FIGS. 3C and 4A is formed. Specifically, as shown in FIGS. 3B, 3 </ b> C, and 4 </ b> B, the metal plate 4 is formed so as to be substantially complementary to the stepped base member 5.

  In the illuminating device of the first embodiment, an inexpensive steel plate is used as the metal plate 4, but in the illuminating device of the fifth embodiment, in order to improve the heat dissipation of the LEDs 1a, 1b, 1c instead. It is also possible to form the metal plate 4 from aluminum or copper.

  Next, in the lighting device of the first embodiment, as shown in FIG. 4A, the flexible substrate 2 is joined to the metal plate 4 by the double-sided tape 3 to form the assembly 6. Specifically, in the lighting device of the first embodiment, the portion 2a of the flexible substrate 2 and the step 4a of the metal plate 4 are joined by the double-sided tape 3, and the portion 2b of the flexible substrate 2 and the step 4b of the metal plate 4 Are joined by the double-sided tape 3, and the portion 2c of the flexible substrate 2 and the step 4c of the metal plate 4 are joined by the double-sided tape 3, but the portions 2a ′ and 2b ′ of the flexible substrate 2 (see FIG. 3A). Is not bonded to the metal plate 4.

  More specifically, in the illuminating device of the first embodiment, as shown in FIGS. 4A and 4B, the flexible substrate 2 has a flexible substrate 2a ′ and 2b ′ that are loose. The two portions 2a, 2b, 2c are joined to the steps 4a, 4b, 4c of the metal plate 4.

  Next, in the illumination device of the first embodiment, as shown in FIG. 4B, the assembly 6 is placed on the base member 5, and as a result, the state shown in FIGS. 1 and 2 is obtained. Specifically, as shown in FIGS. 3B and 3C, the hole 4 a 1 of the metal plate 4 is fitted with the protrusion 5 a 1 of the base member 5, and the hole 4 a 2 of the metal plate 4 is fitted to the base member 5. The metal plate 4 is fitted with the projection 4 a 2, the hole 4 b 1 of the metal plate 4 is fitted with the projection 5 b 1 of the base member 5, and the hole 4 b 2 of the metal plate 4 is fitted with the projection 5 b 2 of the base member 5. The hole 4c1 is fitted with the projection 5c1 of the base member 5, and the hole 4c2 of the metal plate 4 is fitted with the projection 5c2 of the base member 5.

  More specifically, in the illumination device according to the first embodiment, even if there is a variation in the bending dimension of the metal plate 4 processed into a staircase shape, the metal plate 4 is slightly deformed to change the metal The holes 4a1, 4a2, 4b1, 4b2, 4c1, 4c2 of the plate 4 and the protrusions 5a1, 5a2, 5b1, 5b2, 5c1, 5c2 of the base member 5 are fitted. In other words, the lighting device of the first embodiment has a plate thickness of about 0.3 to 0.8 mm so that the metal plate 4 can be slightly deformed, that is, appropriate elasticity and rigidity. The metal plate 4 is used.

  Next, in the illumination device of the first embodiment, the tips of the protrusions 5a1, 5a2, 5b1, 5b2, 5c1, and 5c2 of the base member 5 are deformed by caulking such as heat caulking and ultrasonic caulking. The assembly 6 (see FIG. 4B) is fixed to the base member 5. In other words, the assembly 6 is prevented from rattling against the base member 5 by the deformed portions of the tips of the protrusions 5a1, 5a2, 5b1, 5b2, 5c1, and 5c2 of the base member 5.

  In the lighting device of the first embodiment, the assembly 6 is fixed to the base member 5 by caulking. However, in the lighting device of the sixth embodiment, instead, the assembly 6 is fixed to the base member 5 by screwing. It is also possible to fix to.

  In the lighting apparatus of the first embodiment, the assembly process shown in FIG. 4A, which requires a relatively long time, is preferably performed in a factory with a relatively low assembly cost per process, and can be performed in a relatively short time. The assembly process and the caulking process shown in FIG. 4B are performed in a factory having a relatively high assembly cost per process.

  In the illuminating device of 1st Embodiment, as shown to FIG. 4 (A), the back surface of the flexible substrate 2 in which LED1a, 1b, 1c as an electronic component was mounted (the lower side and right side of FIG. 4 (A)). Surface) (on the upper surface of FIG. 4A), the back surface of the flexible substrate 2 at the position (2a, 2b, 2c) where the LEDs 1a, 1b, 1c are mounted (below FIG. 4A). Side surface) is bonded to the surface of the metal plate 4 (upper surface in FIG. 4A) by a double-sided tape. On the other hand, the back surface (the right surface in FIG. 4A) of the flexible substrate 2 at the positions (2a ′, 2b ′) where the LEDs 1a, 1b, 1c as electronic components are not mounted on the surface is the surface of the metal plate 4. It is not joined to (the left side surface in FIG. 4A).

  In other words, in the lighting device of the first embodiment, as shown in FIG. 4A, the flexible substrate 2 is joined to the metal plate 4 bent in a step shape. Therefore, according to the lighting device of the first embodiment, the flexible substrate is bent from the metal plate as the flexible substrate and the metal plate are bent stepwise after the flexible substrate is joined to the planar metal plate. It is possible to reduce the possibility that peeling easily occurs or a tensile stress is applied to the solder portion of the LED mounted on the flexible substrate.

  Furthermore, in the illumination device of the first embodiment, as shown in FIGS. 4A and 4B, the flexible substrate 2 is temporarily fixed to the base member 5 when the flexible substrate 2 is fixed to the base member 5. The process to do is not necessary. Therefore, according to the illuminating device of 1st Embodiment, the whole assembly cost which fixes the flexible substrate 2 to the base member 5 can be suppressed rather than the case where a flexible substrate must be temporarily fixed to a base member. .

  Hereinafter, a seventh embodiment of the illumination device of the present invention will be described. The illumination device of the seventh embodiment is configured in substantially the same manner as the illumination device of the first embodiment described above, except for points described below. Therefore, according to the illuminating device of 7th Embodiment, except the point mentioned later, there can exist an effect substantially the same as the illuminating device of 1st Embodiment mentioned above.

  5 to 7 are component diagrams of the illumination device according to the seventh embodiment. Specifically, FIG. 5 is a perspective view of the flexible substrate 12 on which the LEDs 11a, 11b, 11c, 11d, and 11e are mounted, FIG. 6 is a perspective view of the stepped base member 15, and FIG. It is a perspective view of the metal plate 14 used in order to fix to.

  In the illumination device of the first embodiment, as shown in FIG. 3A, three LEDs 1a, 1b, and 1c are arranged on a straight line on a flexible substrate 2 developed in a planar shape. In the illumination device of the seventh embodiment, as shown in FIG. 5, for example, five LEDs 11a, 11b, 11c, 11d, and 11e are arranged in a non-linear manner on a flexible substrate 12 developed in a planar shape. Specifically, in the illumination device of the seventh embodiment, as shown in FIG. 5, a straight line connecting the three LEDs 11a, 11b, and 11c and a straight line connecting the two LEDs 11b and 11d are orthogonal to each other. The straight line connecting the LEDs 11a, 11b, and 11c and the straight line connecting the two LEDs 11c and 11e are orthogonal to each other.

  In the illumination device of the seventh embodiment, a planar sheet metal having an outer shape substantially the same as the outer shape of the flexible substrate 2 shown in FIG. 5 and a plate thickness of about 0.3 to 0.8 mm is illustrated. Bending is performed in the step that does not, and as a result, a stepped metal plate 14 as shown in FIG. 7 is formed. Specifically, as shown in FIGS. 6 and 7, the metal plate 14 is formed so as to be approximately complementary to the stepped base member 15.

  Next, in the illumination device of the seventh embodiment, the flexible substrate 12 is joined to the metal plate 14 by a double-sided tape (not shown), as in the illumination device of the first embodiment, and an assembly (not shown). Is formed. Specifically, in the illumination device of the seventh embodiment, as shown in FIGS. 5 and 7, the portion 12 a of the flexible substrate 12 and the step 14 a of the metal plate 14 are joined by a double-sided tape, and the portion of the flexible substrate 12 is joined. 12b and the step 14b of the metal plate 14 are joined by double-sided tape, the portion 12c of the flexible substrate 12 and the step 14c of the metal plate 14 are joined by double-sided tape, and the portion 12d of the flexible substrate 12 and the step 14d of the metal plate 14 are joined. Are joined by a double-sided tape, and the portion 12e of the flexible substrate 12 and the step 14e of the metal plate 14 are joined by a double-sided tape. On the other hand, the portions 12 a ′, 12 b ′, 12 b ″, 12 c ′ of the flexible substrate 12 are not joined to the metal plate 4.

  More specifically, in the illumination device according to the seventh embodiment, as shown in FIGS. 5 and 7, the flexible substrate 12 has a slack in the portions 12 a ′, 12 b ′, 12 b ″, 12 c ′ of the flexible substrate 12. Twelve portions 12a, 12b, 12c, 12d, and 12e are joined to the steps 14a, 14b, 14c, 14d, and 14e of the metal plate 14, respectively.

  Next, in the illumination device of the seventh embodiment, an assembly (not shown) composed of the flexible substrate 12 on which the LEDs 11a, 11b, 11c, 11d, and 11e are mounted, the metal plate 14, and the double-sided tape is a base member 15 ( (See FIG. 6). Specifically, as shown in FIGS. 6 and 7, the hole 14a1 of the metal plate 14 is fitted with the projection 15a1 of the base member 15, and the hole 14a2 of the metal plate 14 is fitted with the projection 15a2 of the base member 15. The hole 14b1 of the metal plate 14 is fitted with the protrusion 15b1 of the base member 15, the hole 14b2 of the metal plate 14 is fitted with the protrusion 15b2 of the base member 15, and the hole 14c1 of the metal plate 14 is fitted with the base member 15. The hole 14c2 of the metal plate 4 is fitted with the projection 15c2 of the base member 15, the hole 14d1 of the metal plate 14 is fitted with the projection 15d1 of the base member 15, and the metal plate 14 is fitted. Hole 14d2 is fitted into the protrusion 15d2 of the base member 15, the hole 14e1 of the metal plate 14 is fitted into the protrusion 15e1 of the base member 15, Hole 14e2 of the genus plate 14 is brought into engagement with the projections 15e2 of the base member 15.

  More specifically, in the illuminating device of the seventh embodiment, even if there is a variation in the bending dimension of the metal plate 14 processed into a staircase shape, the metal plate 14 is slightly deformed to change the metal plate 14. Holes 14a1, 14a2, 14b1, 14b2, 14c1, 14c2, 14d1, 14d2, 14e1, 14e2 of the plate 14 and protrusions 15a1, 15a2, 15b1, 15b2, 15c1, 15c2, 15d1, 15d2, 15e1, 15e2 of the base member 15 Can be fitted. In other words, the lighting device of the seventh embodiment has a plate thickness of about 0.3 to 0.8 mm so that the metal plate 14 can be slightly deformed, that is, moderate elasticity and rigidity. A metal plate 14 is used.

  Next, in the illumination device of the seventh embodiment, the tips of the protrusions 15a1, 15a2, 15b1, 15b2, 15c1, 15c2, 15d1, 15d2, 15e1, and 15e2 of the base member 15 are, for example, heat caulked, ultrasonic caulked, etc. The assembly is fixed to the base member 15 by being deformed by caulking. In other words, the assembly rattles against the base member 15 by the deformed portions of the tips of the protrusions 15a1, 15a2, 15b1, 15b2, 15c1, 15c2, 15d1, 15d2, 15e1, and 15e2 of the base member 15. Is prevented.

  In the eighth embodiment, the above-described first to seventh embodiments can be appropriately combined. In the first to eighth embodiments described above, the flexible substrate fixing method of the present invention is applied to a lighting device. However, the flexible substrate fixing method of the present invention is applied to devices other than the lighting device. It is also possible to do.

It is a perspective view of the principal part of the illuminating device of 1st Embodiment. It is sectional drawing of the principal part of the illuminating device of 1st Embodiment shown in FIG. It is a component diagram of the illuminating device of 1st Embodiment. It is the figure which showed the process in which the flexible substrate 2 in which LED1a, 1b, 1c was mounted is fixed to the base member 5. FIG. It is a perspective view of the flexible board | substrate 12 with which LED11a, 11b, 11c, 11d, and 11e were mounted. 3 is a perspective view of a stepped base member 15. FIG. 2 is a perspective view of a metal plate 14 used for fixing a flexible substrate 12 to a base member 15. FIG.

Explanation of symbols

1a, 1b, 1c LED
2 Flexible substrate 2a, 2a ', 2b, 2b', 2c Part 2a1, 2a2, 2b1, 2b2, 2c1, 2c2 Hole 3 Double-sided tape 4 Metal plate 4a, 4b, 4c Stage 4a1, 4a2, 4b1, 4b2, 4c1, 4c2 Hole 5 Base member 5a, 5b, 5c Step 5a1, 5a2, 5b1, 5b2, 5c1, 5c2 Protrusion 6 Assembly

Claims (5)

In the fixing method of the flexible substrate for fixing the flexible substrate on which a plurality of electronic components are mounted to the stepped base member,
Supplying a metal plate having a shape substantially complementary to the stepped base member;
Among the back surface of the flexible substrate on which a plurality of electronic components are mounted, the back surface of the flexible substrate at a position where the electronic component is mounted on the front surface is joined to the surface of the metal plate, and the electronic component is mounted on the surface. Not bonding the back surface of the flexible substrate at the position where it is not to the surface of the metal plate;
A step of fixing the metal plate to which the flexible substrate is bonded to the base member.   2. The flexible substrate fixing method according to claim 1, wherein the stepped metal plate is formed by bending a planar metal plate having a plate thickness of about 0.3 to 0.8 mm.   The method for fixing a flexible substrate according to claim 1 or 2, wherein the stepped metal plate made of aluminum or copper is used.   The back surface of the flexible substrate at a position where an electronic component is mounted on the front surface is bonded to the front surface of the metal plate so that a portion not bonded to the metal plate has a slack. The fixing method of the flexible substrate as described in any one of Claims.   The illuminating device manufactured using the fixing method of the flexible substrate as described in any one of Claims 1-4.

Images