JP3497232B2 - Printed circuit board assembly equipment - Google Patents
Printed circuit board assembly equipmentInfo
- Publication number
- JP3497232B2 JP3497232B2 JP09179894A JP9179894A JP3497232B2 JP 3497232 B2 JP3497232 B2 JP 3497232B2 JP 09179894 A JP09179894 A JP 09179894A JP 9179894 A JP9179894 A JP 9179894A JP 3497232 B2 JP3497232 B2 JP 3497232B2
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- chassis
- heat sink
- holes
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Description
【発明の詳細な説明】
【０００１】
【産業上の利用分野】本発明は、プリント基板とヒート
シンクとシャーシとからなるプリント基板組立装置に関
するもので、プリント基板とヒートシンクをシャーシに
ビスで共締め固定する際に、目視による位置の調整をす
ることなしに容易に位置決め固定作業を行なおうとする
ものである。
【０００２】
【従来の技術】図４及び、図５は従来のプリント基板組
立装置の要部を示す。図４はシャーシ３の全ての基板取
付け用ネジ穴にプリント基板の全ての穴が一致するよう
にプリント基板１をシャーシ３に設置し、次にシャーシ
３の全てのヒートシンク取付け用ネジ穴にヒートシンク
２の全ての穴が一致するようにヒートシンク２をプリン
ト基板１を介してシャーシ３に設置した後、ヒートシン
ク２及びプリント基板１をシャーシ３にビス４にて取付
ける構造である。図５は、ヒートシンク２をあらかじめ
プリント基板１に取付けた後、該プリント基板１をシャ
ーシ３の全てのプリント基板取付け用ネジ穴にプリント
基板１の穴が一致するようシャーシ３に設置後ビス４に
て固定する構造である。
【０００３】
【発明が解決しようとする課題】従来の課題を説明する
ために、上記図４、図５と共に図７に従来の構造のシャ
ーシ基板取付け部の断面構造を、図１０に従来の構造の
シャーシ３とヒートシンク２の上面から見た構造を示
す。従来の構造は図７のような構造であるため、シャー
シの基板取付け用ネジ穴にプリント基板１の穴を一致す
るようにプリント基板１をシャーシ３に設置するために
は目視で注意深く作業しなければならず、又、設置後も
プリント基板１が横すべりしてプリント基板１の穴とシ
ャーシ３の基板取付け用ネジ穴とがずれないようにプリ
ント基板１を保持しながらシャーシ３にネジで固定しな
ければならず作業性が悪い。又、図４のようにヒートシ
ンク２とプリント基板１をネジ４で共締めする従来の構
造では、ヒートシンク２とシャーシ３の関係は図１０の
ように重なっているのでヒートシンク２はシャーシ３に
対して左右前後にずれ易く、穴の位置を合わせ、これを
保持しながらビス４で固定しなければならず作業性が悪
い。図５は図４の上述の課題の内、ヒートシンク２とシ
ャーシ３の位置決め作業性の課題を解決した構造である
が、ヒートシンク２をあらかじめプリント基板１に取付
ける余分の作業が発生し、かつ、プリント基板１とシャ
ーシ２は図７の状態のため、プリント基板１とシャーシ
３の穴の位置を合わせ、これを保持しながらビス４で固
定しなければならず作業性が悪い等の問題があった。
【０００４】
【課題を解決するための手段】本発明は、上述の課題を
解決したものであり、図６の断面図のように、シャーシ
切り起こし部５に突起６を設け、プリント基板１の外周
を該突起６に合わせるようにはめ込むだけでプリント基
板１の穴とシャーシ３の穴とが一致し、該突起６によっ
てプリント基板１がずれない役目を該突起６が果たすと
共に、図８及び図９の上面図のようにシャーシ３に断面
がコの字すなわちレール状の溝７を設け、この溝７にヒ
ートシンク２を滑り込ませるだけでシャーシ３とヒート
シンク２との穴の位置が一致し、ヒートシンク２がシャ
ーシ３に対して左右前後にずれない役目を該溝７が果た
すことにより作業性を改善しようとするものである。す
なわち、プリント基板１と、該プリント基板１上に重ね
て固定する穴（９）をもつ取付片８および該プリント基
板１上の半導体を放熱するための放熱板とを有するヒー
トシンク２と、該プリント基板１と該ヒートシンク２と
を固定するＬ字型シャーシ３とからなるプリント基板組
立装置において、プリント基板１をビス４で固定するた
めの支柱用のシャーシ３の切り起こし部５に突起６を設
け、該突起６がプリント基板１の外周に接触することに
よりプリント基板１の位置が定まり、かつヒートシンク
２とプリント基板１とシャーシ３とを固定する取付穴の
位置が一致するようにＬ字型シャーシ３の切り起こし部
（５）の面に対して垂直方向の面にヒートシンク２の位
置決めのためのレール状の溝７を設けたことを特徴とす
るプリント基板組立装置である。
【０００５】
【作用】本発明は、上述のように構成されているので、
ヒートシンク２とプリント基板１とシャーシ３との穴の
位置を簡単に一致させることができ、かつ該各取付穴の
位置ずれの心配がないので作業性を高めることができ
る。
【０００６】
【実施例】図１は、本発明の一実施例のプリント基板組
立装置の要部説明図で、シャーシ３の切り起こし部５に
斜線で示す突起６を設け、該突起６同志の囲む間隙がプ
リント基板１のタテ、ヨコの寸法と同等かやや大なる寸
法になるように設計することにより、プリント基板１を
シャーシ切り起こし部５の突起６の囲む中にはめ込むだ
けで、プリント基板１とシャーシ切り起こし部５のビス
穴とを全て一致させることができ、上記穴がずれないよ
うに保持する必要がなくなると共に、シャーシ３のレー
ル状の溝７にヒートシンク２を滑り込ませるだけで、ヒ
ートシンク２に設けた取付片８の穴とプリント基板１の
穴とシャーシ３の穴の位置を合わせることができるた
め、ビス４による固定が容易になり作業性を高めること
ができた。図６は図１の断面図で、突起６同志の囲む寸
法がプリント基板１の寸法と同等かやや大なる寸法に設
計することにより、プリント基板１の穴とシャーシ３の
切り起こし部５の穴とを一致させ、プリント基板１が左
右にずれないことを示し、図８は図１のヒートシンク２
を上面から見た図で、ヒートシンク２が左右前後に位置
ずれすることなしにシャーシ３に保持されることを示す
ものである。図２及び図３は、プリント基板１をシャー
シ３に位置決めするための図１の応用例で、いづれもシ
ャーシ３の切り起こし部５の突起６がプリント基板１の
外周のＡ面とＢ面に接することによりプリント基板１の
位置決めと位置ずれ防止をしようとするものである。
又、図９はヒートシンク２をシャーシ３に位置決めする
ための図８の応用例である。図１の実施例では、プリン
ト基板１は長方形を示しているが、プリント基板の形が
長方形以外の形であっても、プリント基板の外周の面に
シャーシ３の切り起こし部５の突起６が接するように設
計すれば、図１の実施例と同様の効果が得られ、作業性
を高めることができる。
【０００７】
【発明の効果】本発明のプリント基板組立装置は、以上
のようにヒートシンク２とプリント基板１のシャーシ３
への位置決めが容易になり、かつ、位置ずれの心配が無
いので作業性を高める効果がある。Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printed circuit board assembling apparatus comprising a printed circuit board, a heat sink, and a chassis. In doing so, the positioning and fixing operation is easily performed without visually adjusting the position. 2. Description of the Related Art FIGS. 4 and 5 show a main part of a conventional printed circuit board assembling apparatus. FIG. 4 shows that the printed circuit board 1 is installed on the chassis 3 so that all the holes of the printed circuit board coincide with all the screw holes for mounting the board on the chassis 3, and then the heat sink 2 is inserted into all the screw holes for mounting the heat sink on the chassis 3. After the heat sink 2 is installed on the chassis 3 via the printed circuit board 1 so that all of the holes coincide with each other, the heat sink 2 and the printed circuit board 1 are attached to the chassis 3 with screws 4. FIG. 5 shows that after the heat sink 2 is mounted on the printed circuit board 1 in advance, the printed circuit board 1 is mounted on the chassis 3 so that the holes of the printed circuit board 1 are aligned with all the screw holes for mounting the printed circuit board on the chassis 3 and then the screws 4 are mounted. It is a structure to fix. In order to explain the conventional problems, FIG. 7 together with FIGS. 4 and 5 show a cross-sectional structure of a chassis substrate mounting portion having a conventional structure, and FIG. 10 shows a conventional structure. 2 shows the structure viewed from the top surfaces of the chassis 3 and the heat sink 2. Since the conventional structure is as shown in FIG. 7, it is necessary to visually and carefully work to install the printed circuit board 1 on the chassis 3 so that the holes of the printed circuit board 1 match the screw holes for mounting the board on the chassis. Further, even after installation, the printed circuit board 1 is fixed to the chassis 3 with screws while holding the printed circuit board 1 so that the holes of the printed circuit board 1 do not slip off from the holes for mounting the board on the chassis 3. Workability is poor. In a conventional structure in which the heat sink 2 and the printed circuit board 1 are fastened together with screws 4 as shown in FIG. 4, the relationship between the heat sink 2 and the chassis 3 overlaps as shown in FIG. It is easy to shift right and left and back and forth, and the holes must be aligned and fixed with screws 4 while holding the holes, resulting in poor workability. FIG. 5 shows a structure in which the problem of the workability of positioning the heat sink 2 and the chassis 3 among the above-mentioned problems in FIG. 4 has been solved. However, extra work for attaching the heat sink 2 to the printed circuit board 1 in advance occurs, and Since the board 1 and the chassis 2 are in the state shown in FIG. 7, the holes of the printed board 1 and the chassis 3 must be aligned and fixed with the screws 4 while holding the holes, and there is a problem that workability is poor. . The present invention has solved the above-mentioned problem. As shown in the sectional view of FIG. 6, a protrusion 6 is provided on a cut-and-raised portion 5 of a chassis, and a printed circuit board 1 is formed. The holes of the printed circuit board 1 and the holes of the chassis 3 match just by fitting the outer periphery to the protrusions 6, and the protrusions 6 serve to prevent the printed circuit board 1 from shifting due to the protrusions 6. As shown in the top view of FIG. 9, the chassis 3 is provided with a groove 7 having a U-shaped cross section, that is, a rail-shaped groove. The groove 7 serves to prevent the chassis 2 from being shifted left, right, front and rear with respect to the chassis 3 so as to improve workability. That is, a heat sink 2 having a printed board 1, a mounting piece 8 having a hole (9) to be fixed on the printed board 1 and a heat radiating plate for radiating a semiconductor on the printed board 1, In a printed circuit board assembling apparatus including an L-shaped chassis 3 for fixing the substrate 1 and the heat sink 2, a projection 6 is provided on a cut-and-raised portion 5 of a support chassis 3 for fixing the printed circuit board 1 with screws 4. The L-shaped chassis is formed such that the position of the printed circuit board 1 is determined by the contact of the projection 6 with the outer periphery of the printed circuit board 1 and the positions of the mounting holes for fixing the heat sink 2, the printed circuit board 1 and the chassis 3 coincide. A printed circuit board provided with a rail-shaped groove for positioning the heat sink on a surface perpendicular to a surface of the cut-and-raised portion of the heat sink; It is an elevation apparatus. Since the present invention is configured as described above,
The positions of the holes in the heat sink 2, the printed circuit board 1, and the chassis 3 can be easily matched, and there is no need to worry about the displacement of the mounting holes, so that the workability can be improved. FIG. 1 is an explanatory view of a main part of a printed circuit board assembling apparatus according to one embodiment of the present invention. A cut-and-raised portion 5 of a chassis 3 is provided with a projection 6 indicated by oblique lines. By designing the surrounding gap to be equal to or slightly larger than the size of the vertical and horizontal dimensions of the printed circuit board 1, the printed circuit board 1 is simply fitted into the surroundings of the projection 6 of the cut-and-raised portion 5 of the chassis, so that the printed circuit board 1 and the screw holes of the cut-and-raised portion 5 of the chassis can all be made to coincide with each other, so that it is not necessary to hold the holes so that the holes do not shift, and the heat sink 2 is simply slid into the rail-shaped groove 7 of the chassis 3. Since the positions of the holes of the mounting pieces 8 provided on the heat sink 2, the holes of the printed circuit board 1, and the holes of the chassis 3 can be matched, the fixing with the screws 4 becomes easy and the workability can be improved. Was. FIG. 6 is a cross-sectional view of FIG. 1. By designing the dimensions of the projections 6 to be equal to or slightly larger than the dimensions of the printed circuit board 1, the holes in the printed circuit board 1 and the cut-and-raised portions 5 in the chassis 3 are formed. FIG. 8 shows that the printed circuit board 1 does not shift left and right, and FIG.
Is a view from above, showing that the heat sink 2 is held by the chassis 3 without being displaced in the left, right, front and rear directions. 2 and 3 are application examples of FIG. 1 for positioning the printed circuit board 1 on the chassis 3. In each case, the projections 6 of the cut-and-raised portion 5 of the chassis 3 are provided on the A surface and the B surface on the outer periphery of the printed circuit board 1. The contact is intended to position the printed circuit board 1 and to prevent the printed board 1 from being displaced.
FIG. 9 is an application example of FIG. 8 for positioning the heat sink 2 on the chassis 3. In the embodiment of FIG. 1, the printed board 1 has a rectangular shape. However, even if the printed board has a shape other than a rectangle, the protrusion 6 of the cut-and-raised portion 5 of the chassis 3 is formed on the outer peripheral surface of the printed board. If they are designed to be in contact with each other, the same effect as in the embodiment of FIG. 1 can be obtained, and workability can be improved. As described above, the printed circuit board assembling apparatus of the present invention provides the heat sink 2 and the chassis 3 of the printed circuit board 1 as described above.
Positioning is easy, and there is no need to worry about positional displacement, which has the effect of improving workability.
【図面の簡単な説明】
【図１】本発明の一実施例のプリント基板組立装置にお
ける要部の説明図である。
【図２】本発明に係るプリント基板の位置決めのための
突起形状の異なる他の実施例の説明図である。
【図３】本発明に係るプリント基板の位置決めのための
突起形状の異なる他の実施例の説明図である。
【図４】従来のプリント基板組立装置における要部の説
明図である。
【図５】従来のプリント基板組立装置における要部の説
明図である。
【図６】本発明のプリント基板組立装置の取付け要部の
断面図である。
【図７】従来のプリント基板組立装置の取付け要部の断
面図である。
【図８】本発明に係るヒートシンクをシャーシの溝に差
し込んだ状態のプリント基板組立装置要部の説明図であ
る。
【図９】本発明に係るヒートシンクをシャーシの溝に差
し込んだ状態のプリント基板組立装置要部の説明図であ
る。
【図１０】従来に係るヒートシンクとシャーシを重ね合
わせた状態のプリント基板組立装置要部の説明図であ
る。
【符号の説明】
１ プリント基板
２ ヒートシンク
３ シャーシ
４ ビス
５ 切り起こし部
６ 突起
７ 溝
８ 取付片
９ 穴BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is an explanatory diagram of a main part in a printed circuit board assembling apparatus according to one embodiment of the present invention. FIG. 2 is an explanatory view of another embodiment having a different projection shape for positioning a printed circuit board according to the present invention. FIG. 3 is an explanatory view of another embodiment having a different projection shape for positioning a printed circuit board according to the present invention. FIG. 4 is an explanatory diagram of a main part in a conventional printed circuit board assembling apparatus. FIG. 5 is an explanatory diagram of a main part in a conventional printed circuit board assembling apparatus. FIG. 6 is a cross-sectional view of an essential part of a printed circuit board assembling apparatus according to the present invention. FIG. 7 is a sectional view of a main part of a conventional printed circuit board assembling apparatus. FIG. 8 is an explanatory diagram of a main part of a printed circuit board assembling apparatus in a state where a heat sink according to the present invention is inserted into a groove of a chassis. FIG. 9 is an explanatory diagram of a main part of a printed circuit board assembling apparatus in a state where a heat sink according to the present invention is inserted into a groove of a chassis. FIG. 10 is an explanatory view of a main part of a printed circuit board assembling apparatus in a state where a heat sink and a chassis according to the related art are overlapped. [Description of Signs] 1 Printed circuit board 2 Heat sink 3 Chassis 4 Screw 5 Cut-and-raised portion 6 Projection 7 Groove 8 Mounting piece 9 Hole
───────────────────────────────────────────────────── フロントページの続き (56)参考文献 実開 平１−97593（ＪＰ，Ｕ) 実開 平２−21791（ＪＰ，Ｕ) 実公 昭48−22529（ＪＰ，Ｙ１) (58)調査した分野(Int.Cl.7，ＤＢ名) H05K 7/04 H05K 7/14 ──────────────────────────────────────────────────続 き Continuation of the front page (56) References Japanese Utility Model 1-97593 (JP, U) Japanese Utility Model 2-21791 (JP, U) Japanese Utility Model 48-22529 (JP, Y1) (58) Survey Field (Int.Cl. 7 , DB name) H05K 7/04 H05K 7/14
Claims (1)
（１）上に重ねて固定する穴（９）をもつ取付片（８）
および該プリント基板（１）上の半導体を放熱するため
の放熱板とを有するヒートシンク（２）と、該プリント
基板（１）と該ヒートシンク（２）とを固定するＬ字型
シャーシ（３）とからなるプリント基板組立装置におい
て、プリント基板（１）をビス（４）で固定するための
支柱用のシャーシ（３）の切り起こし部（５）に突起
（６）を設け、該突起（６）がプリント基板（１）の外
周に接触することによりプリント基板（１）の位置が定
まり、かつヒートシンク（２）とプリント基板（１）と
シャーシ（３）とを固定する取付用穴（９）の位置が一
致するようにＬ字型シャーシ（３）の切り起こし部
（５）の面に対して垂直方向の面にヒートシンク（２）
の位置決めのためのレール状の溝７を設けたことを特徴
とするプリント基板組立装置。(1) A mounting piece (8) having a printed circuit board (1) and a hole (9) to be fixed on the printed circuit board (1) by being overlapped therewith.
A heat sink (2) having a heat sink for radiating heat on the printed board (1); and an L-shaped chassis (3) for fixing the printed board (1) and the heat sink (2). In the printed circuit board assembling apparatus, a projection (6) is provided on a cut-and-raised portion (5) of a support chassis (3) for fixing the printed circuit board (1) with a screw (4). Contacts the outer periphery of the printed circuit board (1) to determine the position of the printed circuit board (1), and the mounting holes (9) for fixing the heat sink (2), the printed circuit board (1) and the chassis (3). The heat sink (2) is provided on a surface perpendicular to the surface of the cut-and-raised portion (5) of the L-shaped chassis (3) so that the positions match.
A printed circuit board assembling apparatus, comprising a rail-shaped groove 7 for positioning the printed circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP09179894A JP3497232B2 (en) | 1994-04-28 | 1994-04-28 | Printed circuit board assembly equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP09179894A JP3497232B2 (en) | 1994-04-28 | 1994-04-28 | Printed circuit board assembly equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH07297572A JPH07297572A (en) | 1995-11-10 |
| JP3497232B2 true JP3497232B2 (en) | 2004-02-16 |
Family
ID=14036641
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP09179894A Expired - Fee Related JP3497232B2 (en) | 1994-04-28 | 1994-04-28 | Printed circuit board assembly equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3497232B2 (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100612278B1 (en) | 2004-05-18 | 2006-08-11 | 삼성에스디아이 주식회사 | Plasma display device |
| JP4539468B2 (en) * | 2005-07-07 | 2010-09-08 | パナソニック株式会社 | Sheet metal chassis |
| JP4555213B2 (en) * | 2005-11-11 | 2010-09-29 | カヤバ工業株式会社 | Board protection structure |
| JP4888161B2 (en) * | 2007-03-06 | 2012-02-29 | 船井電機株式会社 | Substrate positioning structure and thin display device |
| JP4974977B2 (en) * | 2007-08-07 | 2012-07-11 | パナソニック株式会社 | Board attachment plate mounting structure |
-
1994
- 1994-04-28 JP JP09179894A patent/JP3497232B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH07297572A (en) | 1995-11-10 |
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