JP2007305649A - Means for fixing radiator - Google Patents

Means for fixing radiator Download PDF

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JP2007305649A
JP2007305649A JP2006130002A JP2006130002A JP2007305649A JP 2007305649 A JP2007305649 A JP 2007305649A JP 2006130002 A JP2006130002 A JP 2006130002A JP 2006130002 A JP2006130002 A JP 2006130002A JP 2007305649 A JP2007305649 A JP 2007305649A
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radiator
fixing
screw
heat
circuit board
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Japanese (ja)
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Shinji Arimoto
伸治 有本
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Panasonic Holdings Corp
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Matsushita Electric Industrial Co Ltd
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Priority to JP2006130002A priority Critical patent/JP2007305649A/en
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Abstract

<P>PROBLEM TO BE SOLVED: To provide an inexpensive, reliable, and easily attaching/detaching means for fixing a radiator where a load to a circuit board is reduced, and restriction in the arrangement of a circuit pattern is reduced. <P>SOLUTION: The means comprises: the circuit board 105 connected to an electronic component 10, a means for transmitting the heat generated from the electronic component 101 to a heat receiver in a radiator 103, the heat receiver of the radiator 103, the circuit board 105, a fixing tool 106, and a fixing screw 104. A complete screw 104b of the fixing screw 104 passes through a fixing tool screw hole 106c for racing at a fixing screw incomplete screw 104a for adhering the electronic component to the radiator with a fixed load, thus reducing the load to the circuit board and the restriction in the arrangement of the circuit pattern. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

本発明は電子部品に取り付けられた放熱器の固定手段に関するものである。   The present invention relates to a fixing means for a radiator attached to an electronic component.

近年、電子部品の高密な集積化や動作の高速化に伴い、電子部品の発熱量が増大する傾向にある。発熱による電子部品の不安定な動作を防止するための手段として、電子部品と放熱器を接続することが一般的である。発熱を効率よく放熱器に伝えるためには、電子部品と放熱器の隙間を減じ、しっかりと固定されることが肝要であり、且つサービスやメンテナンス性または電子部品の交換による性能の向上などを考慮して、放熱器が取り外せる構造が求められている。   In recent years, the amount of heat generated by electronic components tends to increase as the electronic components are densely integrated and the operation speed is increased. As a means for preventing an unstable operation of the electronic component due to heat generation, it is common to connect the electronic component and a radiator. In order to efficiently transmit heat to the heatsink, it is important to reduce the gap between the electronic component and the heatsink and fix it firmly, and consider service and maintenance, or improving performance by replacing electronic components. Thus, there is a demand for a structure in which the radiator can be removed.

そのための放熱器固定手段として、段付ネジで回路基板と放熱器と電子部品とコイルバネを貫通しナットで締付けることにより、コイルバネによって放熱器を電子部品表面に押し付けて密着性を良くし、段付ネジの段の径が大きくなっている部分が放熱器の穴を貫通できないことによりナットがコイルバネを圧縮しすぎるのを防ぎ、その結果コイルバネの荷重を設定値に安定させ、放熱器を均一に電子部品へ密着させた放熱器の固定手段がある(例えば特許文献1参照。)。   As a means for fixing the radiator, the circuit board, radiator, electronic component, and coil spring are passed through with a stepped screw and tightened with a nut. The portion where the diameter of the screw step is large cannot penetrate the hole of the radiator, so the nut prevents the coil spring from compressing too much, and as a result, the coil spring load is stabilized at the set value, and the radiator is uniformly electronic. There is a fixing means for the radiator that is in close contact with the component (for example, see Patent Document 1).

また、特許文献1と同様であるが、放熱器と回路基板の間に支持部材を介した固定手段がある(例えば特許文献2参照。)。   Moreover, although it is the same as that of patent document 1, there exists a fixing means via a supporting member between a heat radiator and a circuit board (for example, refer patent document 2).

さらに、回路基板に電子部品と共に実装された支持部にフック状の係止爪を2ヶ所設け、線状バネまたは板状バネにて放熱器と固定することで放熱器を電子部品に密着させた固定手段がある(例えば特許文献3参照。)。
特開平5−243439号公報(段落(0014〜0015)、図1、図2) 特開2004−235481号公報(段落(0023〜0033)、図1〜図8) 特開2002−217345号公報(段落(0025〜0043)、図1〜図13)
Furthermore, two hook-shaped locking claws are provided on the support portion mounted with the electronic component on the circuit board, and the heat sink is brought into close contact with the electronic component by being fixed to the heat radiator with a linear spring or a plate spring. There is a fixing means (see, for example, Patent Document 3).
JP-A-5-243439 (paragraphs (0014-0015), FIGS. 1 and 2) Japanese Unexamined Patent Publication No. 2004-235482 (paragraphs (0023 to 0033), FIGS. 1 to 8) JP 2002-217345 A (paragraphs (0025 to 0043), FIGS. 1 to 13)

しかしながら、特許文献1のコイルバネを用いて段付ネジで回路基板とともに放熱器を固定した構成では、コイルバネの荷重により発生する回路基板の反りが電子部品と回路基板の接続部の信頼性を悪化させ製品不良増加や製品寿命を短くするという問題点を有していた。また、放熱器のネジ頭が回路基板に直接接することで、配線パターンを配置する面積を減少せしめているという問題点を有していた。   However, in the configuration in which the heat sink is fixed together with the circuit board using a stepped screw using the coil spring of Patent Document 1, the warpage of the circuit board caused by the load of the coil spring deteriorates the reliability of the connection part between the electronic component and the circuit board. There were problems of increased product defects and shortened product life. In addition, the screw head of the radiator is in direct contact with the circuit board, thereby reducing the area for arranging the wiring pattern.

また、特許文献2、特許文献3の放熱器固定手段においてはバネによる負荷は支持部材によって軽減されるが、支持部材によるコスト増加の課題があり、更には支持部材による回路基板上の配線パターン面積の減少や部品配置に制限が生じるという問題点を有していた。   Further, in the radiator fixing means of Patent Document 2 and Patent Document 3, the load due to the spring is reduced by the support member, but there is a problem of an increase in cost due to the support member. There is a problem that the reduction of the number of parts and the arrangement of parts are limited.

また、高密度な電子部品周辺は回路基板の配線パターンも高密度に配されており、これら配線面積の減少により配線パターンが配置できない場合、回路基板を多層化する必要が生じコストが増加するという問題点を有していた。   In addition, the circuit board wiring pattern is also densely arranged around the high-density electronic components, and if the wiring pattern cannot be arranged due to the reduction of the wiring area, the circuit board needs to be multi-layered and the cost increases. Had problems.

特に回路基板における銅箔の幅や配線長または銅箔間の間隔を考慮する必要があるような電子部品の場合では、実績のある配線パターンをそのまま転用する場合も多いが、ネジ頭や支持部材を避けて配置することができない場合、配線パターンの設計と検証を新たに初めからやり直さなければならないため多くの時間と労力が必要となり、最悪の場合には部品配置ができなくなるという問題点を有していた。   Especially in the case of electronic components that need to consider the copper foil width and wiring length on the circuit board or the distance between the copper foils, the proven wiring pattern is often used as it is, but the screw head and supporting member If it is not possible to avoid placement, it will be necessary to redesign and verify the wiring pattern from the beginning, which will require a lot of time and effort. Was.

本発明は上記従来の問題点を解決するもので、回路基板への負荷を減らし、回路パターンの配置制限を減らした、安価で信頼性が高く、容易に取付け取外しが可能な放熱器固定手段を提供することを目的とする。   The present invention solves the above-mentioned conventional problems by providing a heat-dissipating fixing means that reduces the load on the circuit board, reduces the circuit pattern placement limit, is inexpensive, highly reliable, and can be easily attached and detached. The purpose is to provide.

この目的を達成するために本発明の放熱器固定手段は、固定具と、前記固定具の固定具支持部上に配置された回路基板と、前記回路基板上に配置された電子部品と、前記電子部品の発熱部上に配置された伝熱体と、前記伝熱体上に受熱部が配置された放熱器と、固定ねじ頭が前記放熱器の放熱器固定用孔で係止され固定ねじ完全ねじ部が前記放熱器の放熱器固定用孔および前記回路基板の回路基板固定孔および前記固定具の固定具ねじ孔部を挿通し固定ねじ不完全ねじ部が空転可能状態にある固定ねじとを備えた構成を有している。   In order to achieve this object, the radiator fixing means of the present invention comprises a fixture, a circuit board disposed on a fixture support portion of the fixture, an electronic component disposed on the circuit board, A heat transfer body disposed on the heat generating portion of the electronic component, a radiator having the heat receiving portion disposed on the heat transfer body, and a fixing screw head locked by a radiator fixing hole of the heat radiator A fixing screw in which the complete screw portion is inserted through the radiator fixing hole of the radiator, the circuit board fixing hole of the circuit board, and the fixing screw hole portion of the fixing tool, and the fixing screw incomplete screw portion is idle It has the composition provided with.

また、前記固定具ねじ孔部はスピードナットである構成を有している。   The fixing screw hole is a speed nut.

さらに、前記固定具は前記固定具支持部の周囲に複数の固定具弾性部を備えた構成を有している。   Furthermore, the fixture has a configuration in which a plurality of fixture elastic portions are provided around the fixture support portion.

また、前記固定具を固定する場合に前記固定具弾性部に変形を生じさせ、前記変形の復元力により前記放熱器または前記放熱器の前記受熱部を前記電子部品に付勢する構成を有している。   Further, when fixing the fixture, the fixture elastic portion is deformed, and the radiator or the heat receiving portion of the radiator is biased to the electronic component by the restoring force of the deformation. ing.

さらに、前記放熱器は前記受熱部と放熱部とが一体である構成を有している。   Furthermore, the heat radiator has a configuration in which the heat receiving portion and the heat radiating portion are integrated.

また、前記放熱器は前記受熱部と放熱部が伝熱手段を介して接続される構成を有している。   Moreover, the said heat radiator has the structure by which the said heat receiving part and a thermal radiation part are connected through a heat-transfer means.

以上のように本発明は、回路基板への負荷を減らし、回路パターンの配置制限を減らした、安価で信頼性が高く、容易に取付け取外しが可能な放熱器固定手段を提供することができるという優れた効果が得られる。   As described above, the present invention can provide a heat-dissipating means that can reduce the load on the circuit board and reduce the restrictions on the arrangement of circuit patterns, is inexpensive, highly reliable, and can be easily mounted and removed. Excellent effect is obtained.

以下本発明を実施するための最良の形態について、図面を参照しながら説明する。各図において同じ構成要素をあらわす場合は同じ符号を用い、説明を省略する。
(実施の形態1)
図1は本発明の実施の形態1における放熱器固定手段の構成を示す斜視図である。図1における電子部品101は半導体からなる集積回路であり、伝熱体102は電子部品101の発熱を効率よく放熱器103の受熱部へ伝えるためのシートである。伝熱体102の素材はシリコンラバーのように、電子部品101との密着性を高めるため柔らかく、熱をよく伝えるために熱抵抗の低い素材が良い。放熱器103はアルミまたは銅等の熱伝導性の高い金属からなり、固定ネジ104を貫通するための放熱器固定用孔103aが設けられており、熱を効率よく周囲へ放出するために放熱部103bが設けられている。回路基板105は電子部品101と電気的に接続され所望の働きをする電気回路が配置されており、固定ネジ104が貫通するための回路基板固定孔105aが設けられている。回路基板105の、電子部品101が実装されている真裏には伝熱体107が配置されており、この伝熱体107は回路基板105と固定具106の固定具支持部106aとに密着している。固定具106は放熱器103が充分な放熱能力を持つ場合には必ずしも放熱性に優れた素材である必要はなく、従って回路基板の裏側に配置された伝熱体107は電子部品101と回路基板105との接続部より伝わる熱を固定具106へ伝える目的としては補助的な役割とすることもでき、必ずしも必要では無い。但し固定具106を金属で構成し且つ回路基板105と接する部分にGND以外の回路パターンが存在する場合には電気的絶縁を目的に配置する場合もある。固定具106は固定具支持部106aと固定具弾性部106bと固定具ねじ孔部106cからなり、固定具ねじ孔部106cは固定ねじ104とねじ締めされる。固定ねじ104は固定ねじ不完全ねじ部104aと固定ねじ完全ねじ部104bと固定ねじ頭104cと固定ねじ太軸104dからなり、この固定ねじ104は放熱器固定用孔103aと回路基板固定用孔105aを貫通して固定具ねじ孔部106cにねじ締めされている。
The best mode for carrying out the present invention will be described below with reference to the drawings. In the drawings, the same components are denoted by the same reference numerals and the description thereof is omitted.
(Embodiment 1)
FIG. 1 is a perspective view showing the configuration of the radiator fixing means according to Embodiment 1 of the present invention. The electronic component 101 in FIG. 1 is an integrated circuit made of a semiconductor, and the heat transfer body 102 is a sheet for efficiently transmitting the heat generated by the electronic component 101 to the heat receiving portion of the radiator 103. The material of the heat transfer body 102 is soft, such as silicon rubber, to improve the adhesion to the electronic component 101, and a material with low thermal resistance is preferable to transfer heat well. The radiator 103 is made of a metal having a high thermal conductivity such as aluminum or copper, and is provided with a radiator fixing hole 103a for penetrating the fixing screw 104. 103b is provided. The circuit board 105 is provided with an electric circuit that is electrically connected to the electronic component 101 and performs a desired function, and is provided with a circuit board fixing hole 105a through which the fixing screw 104 passes. A heat transfer body 107 is disposed directly behind the circuit board 105 on which the electronic component 101 is mounted. The heat transfer body 107 is in close contact with the circuit board 105 and the fixture support portion 106 a of the fixture 106. Yes. The fixing device 106 does not necessarily need to be a material with excellent heat dissipation when the radiator 103 has a sufficient heat dissipation capability. Therefore, the heat transfer body 107 disposed on the back side of the circuit board includes the electronic component 101 and the circuit board. For the purpose of transmitting the heat transmitted from the connecting portion to 105 to the fixture 106, it may be an auxiliary role and is not always necessary. However, when the fixture 106 is made of metal and a circuit pattern other than GND exists in a portion in contact with the circuit board 105, the fixture 106 may be arranged for the purpose of electrical insulation. The fixture 106 includes a fixture support portion 106 a, a fixture elastic portion 106 b, and a fixture screw hole portion 106 c, and the fixture screw hole portion 106 c is screwed to the fixation screw 104. The fixing screw 104 includes a fixing screw incomplete screw portion 104a, a fixing screw complete screw portion 104b, a fixing screw head 104c, and a fixing screw thick shaft 104d. The fixing screw 104 includes a radiator fixing hole 103a and a circuit board fixing hole 105a. And is screwed to the fixture screw hole 106c.

図2、図3にて更に詳細に説明する。図2は本発明の実施の形態1における放熱器固定部の断面図であり、図1の構成にて放熱器を固定する場合を示す。図2の電子部品101は小基板101aと半田ボール101bによって回路基板105に実装されている。固定ねじ不完全ねじ部104aは固定ねじ完全ねじ部104bおよび固定ねじ太軸104dよりも細く形成されている。図2は固定ねじ104は放熱器固定用孔103aと回路基板固定用孔105aを貫通し、固定ねじ完全ねじ部104bが固定具ねじ孔部106cを通過中に固定ねじ頭104cが放熱器固定用孔103aに接触した状態である。   This will be described in more detail with reference to FIGS. FIG. 2 is a cross-sectional view of the radiator fixing portion according to Embodiment 1 of the present invention, and shows a case where the radiator is fixed with the configuration of FIG. 2 is mounted on the circuit board 105 by a small board 101a and solder balls 101b. The fixing screw incomplete screw portion 104a is formed thinner than the fixing screw complete screw portion 104b and the fixing screw thick shaft 104d. In FIG. 2, the fixing screw 104 penetrates the radiator fixing hole 103a and the circuit board fixing hole 105a, and the fixing screw head 104c is used for fixing the radiator while the fixing screw complete screw portion 104b passes through the fixing screw hole portion 106c. It is in a state in contact with the hole 103a.

図3は本発明の実施の形態1における放熱器固定部の断面図であり、図2の場合より更に固定ねじ104をねじ締める場合の放熱器固定部の断面図である。固定具弾性部106bが弾性変形し、固定具ねじ孔部106cが固定ねじ不完全ねじ部104aに達することで、固定ねじ104をねじ締めしても空転する状態である。固定ねじ104を4ヶ所、空転するまでねじ締めすることにより電子部品101に放熱器103を固定する。このとき固定具106の弾性部106bの材質、厚み、幅、長さ、形状、変形量により所望のばね力を決定する。すなわち電子部品101と伝熱体102の密着強度を適度に設定することが可能となる。図1の固定具106の例では、一般的な板ばねであり、その計算は容易であるが、電子部品101や放熱器103の大きさや、その他の都合により固定具弾性部106bの強度が不足する場合にはフランジ曲げを追加するなどして適宜強度を増せば良い。   FIG. 3 is a cross-sectional view of the radiator fixing portion according to Embodiment 1 of the present invention, and is a cross-sectional view of the radiator fixing portion when the fixing screw 104 is further tightened as compared with the case of FIG. The fixture elastic portion 106b is elastically deformed, and the fixture screw hole portion 106c reaches the fixed screw incomplete screw portion 104a. The radiator 103 is fixed to the electronic component 101 by tightening the fixing screws 104 at four places until they are idle. At this time, a desired spring force is determined by the material, thickness, width, length, shape, and deformation amount of the elastic portion 106b of the fixture 106. That is, the adhesion strength between the electronic component 101 and the heat transfer body 102 can be set appropriately. The example of the fixture 106 in FIG. 1 is a general leaf spring and its calculation is easy, but the strength of the fixture elastic portion 106b is insufficient due to the size of the electronic component 101 and the radiator 103 and other reasons. In that case, the strength may be increased appropriately by adding flange bending or the like.

なお、伝熱体102のシート材は一般に取り扱い性に優れる反面、熱抵抗が高いかコストが高いため、代わりに熱伝導性の良いグリスを薄く塗ったり、熱溶融性素材を薄く貼って更に熱抵抗を低くすることが可能である。   Although the sheet material of the heat transfer body 102 is generally excellent in handleability, it has high thermal resistance or high cost. Instead, it is coated with a thin film of heat conductive material or a thin film of a heat-meltable material. It is possible to reduce the resistance.

また、図1では放熱器103と放熱部103bは一体に形成されているが、同種金属を溶着または圧接または接着により接続しても良い。   In FIG. 1, the heat radiator 103 and the heat radiating portion 103b are integrally formed, but the same kind of metal may be connected by welding, pressure welding, or adhesion.

さらに、電子部品101から離れた場所で放熱したい場合や、より周囲温度が低い場所で放熱したい場合には放熱部103bを放熱器103とは別々に構成し、電子部品101から離れた場所で放熱することが可能である。その場合放熱器103と放熱部103bはヒートパイプまたはヒートレーンまたは銅等の高い熱伝達手段により接続することが望ましい。   Further, when it is desired to dissipate heat at a location away from the electronic component 101, or to dissipate heat at a location where the ambient temperature is lower, the heat dissipating part 103b is configured separately from the radiator 103, and heat is dissipated at a location away from the electronic component 101. Is possible. In that case, it is desirable to connect the heat radiator 103 and the heat radiating portion 103b by a high heat transfer means such as a heat pipe, a heat lane, or copper.

また、図4は本発明の実施の形態1における他の放熱器固定部の断面図であり、固定ねじ104は、図2の固定ねじ太軸104dを無くし不完全ねじ部404aを直接固定ねじ頭104cへ繋がる形状としても良い。図4は本発明の実施の形態1における放熱器固定部の断面図である。   4 is a cross-sectional view of another radiator fixing portion according to Embodiment 1 of the present invention. The fixing screw 104 eliminates the fixing screw thick shaft 104d of FIG. 2 and directly fixes the incomplete screw portion 404a. It is good also as a shape connected to 104c. FIG. 4 is a cross-sectional view of the radiator fixing portion according to Embodiment 1 of the present invention.

また、図2の固定具ねじ孔部106cはプレスによるバーリング加工を施したものであるが、固定ねじ完全ねじ部104bをタッピングねじもしくはタップタイトねじとすれば、特にねじ加工をあらかじめ施す必要は無い。もちろんあらかじめタップ加工によりねじ孔を形成しておいても良い。   Further, the fixing tool screw hole portion 106c in FIG. 2 is subjected to burring processing by a press. However, if the fixing screw complete screw portion 104b is a tapping screw or a tap tight screw, it is not necessary to perform the screw processing in advance. . Of course, screw holes may be formed in advance by tapping.

また、図5は本発明の実施の形態1における他の放熱器固定部の断面図であり、固定具孔部106cは、図5に示す固定具ねじ孔部506cのように固定ねじ完全ねじ部104bのピッチに合わせた絞り形状と貫通孔のみで形成してもよい。   FIG. 5 is a cross-sectional view of another radiator fixing portion according to Embodiment 1 of the present invention, and the fixture hole portion 106c is a fixed screw complete screw portion like the fixture screw hole portion 506c shown in FIG. You may form only with the aperture shape and the through-hole matched with the pitch of 104b.

図6は本発明の実施の形態1における他の放熱器固定手段の構成を示す斜視図である。固定具孔部106cは、図6の固定具ねじ孔部606cに代表されるようなスピードナット形状としても差し支えない。   FIG. 6 is a perspective view showing a configuration of another radiator fixing unit according to Embodiment 1 of the present invention. The fixture hole 106c may have a speed nut shape represented by the fixture screw hole 606c of FIG.

また、図7は本発明の実施の形態1における他の放熱器固定部の断面図であり、固定ねじ太軸104dと固定ねじ不完全ねじ部104aの境界部を回路基板固定孔105aより固定ねじ頭104c側に構成し、回路基板固定孔105aの直径を固定ねじ太軸104dの直系よりも細くすれば、一時的に放熱器103に偏った負荷が発生した場合にも、固定ねじ太軸104dがストッパーとなり、より安定して放熱器103を電子部品101と伝熱体102に密着させておくことが可能となる。   FIG. 7 is a cross-sectional view of another radiator fixing portion according to the first embodiment of the present invention. The boundary between the fixing screw thick shaft 104d and the fixing screw incomplete screw portion 104a is fixed to the fixing screw from the circuit board fixing hole 105a. If it is configured on the head 104c side and the diameter of the circuit board fixing hole 105a is made narrower than the direct system of the fixed screw thick shaft 104d, the fixed screw thick shaft 104d can be used even if a temporary load is applied to the radiator 103. Becomes a stopper, and the radiator 103 can be more closely attached to the electronic component 101 and the heat transfer body 102 in a stable manner.

なお固定具弾性部106bは弾性を意図した形状ではなく、物質の元々持つ弾性のみを利用しても良い。   Note that the fixture elastic portion 106b may use only the elasticity inherent in the substance, not the shape intended for elasticity.

以上のように、放熱器と電子部品と伝熱体を密着させることにより熱抵抗を小さくできる。   As described above, the thermal resistance can be reduced by bringing the radiator, the electronic component, and the heat transfer member into close contact with each other.

そして、固定ねじを空転可能状態にすることにより、下記特徴を有する放熱器固定手段を提供することができる。
(1)固定による負荷を一定に保つ。
(2)弾性変形するのは固定具であるため、回路基板を反らせる負荷を与えず、電子部品の実装部における長期信頼性が良い。
(3)回路基板上のデッドスペースは固定ねじが貫通する穴のみとなり、パターン設計の制限を軽減する。
(4)弾性ばねにより部品の高さ方向のバラツキに対し許容性がある。
(5)ねじ締めによる過剰な負荷が加わらないため作業管理が容易となり作業性が良い。(6)放熱器はねじにより固定されているため振動、衝撃により容易に外れず、かつ取り外しには一般的な工具により容易に可能である。
(7)部品点数が少ない。
(8)部品自体も一般的なプレス加工や鍛造加工により安価に生産が可能であり経済的である。
(9)材質を金属で構成可能した場合には電子部品の発熱や放熱器の密着による負荷に対し長期信頼性が良く、経年変化特性が良い。
And the heat radiator fixing means which has the following characteristic can be provided by making a fixing screw idle.
(1) A fixed load is kept constant.
(2) Since it is the fixture that is elastically deformed, a long-term reliability in the mounting part of the electronic component is good without applying a load that warps the circuit board.
(3) The dead space on the circuit board is only a hole through which the fixing screw penetrates, thereby reducing the restrictions on the pattern design.
(4) Due to the elastic spring, there is tolerance for variations in the height direction of the parts.
(5) Since an excessive load due to screw tightening is not applied, work management becomes easy and workability is good. (6) Since the radiator is fixed by screws, it cannot be easily detached by vibration or impact, and can be easily removed by a general tool.
(7) The number of parts is small.
(8) The parts themselves can be produced at low cost by general pressing or forging, and are economical.
(9) When the material can be made of metal, long-term reliability is good with respect to a load caused by heat generation of electronic parts and adhesion of a radiator, and aging characteristics are good.

以上のように本実施の形態1によれば、回路基板への負荷を減らし、回路パターンの配置制限を減らした、安価で信頼性が高く、容易に取付け取外しが可能な放熱器の固定手段を提供することができる。   As described above, according to the first embodiment, the fixing means for the radiator that reduces the load on the circuit board and reduces the circuit pattern arrangement restriction, is inexpensive, reliable, and can be easily attached and detached. Can be provided.

本発明の放熱器固定手段は、回路基板への負荷を減らし、回路パターンの配置制限を減らした、安価で信頼性が高く、容易に取付け取外しが可能な放熱器固定手段を提供することができるという優れた効果を有しているため、放熱器固定手段等において有用である。   The radiator fixing means of the present invention can provide an inexpensive and highly reliable radiator fixing means that can reduce the load on the circuit board and reduce the circuit pattern arrangement restriction, and can be easily mounted and removed. Therefore, it is useful in a radiator fixing means or the like.

本発明の実施の形態1における放熱器固定手段の構成を示す斜視図The perspective view which shows the structure of the radiator fixing means in Embodiment 1 of this invention. 本発明の実施の形態1における放熱器固定部の断面図Sectional drawing of the radiator fixing part in Embodiment 1 of this invention 本発明の実施の形態1における放熱器固定部の断面図Sectional drawing of the radiator fixing part in Embodiment 1 of this invention 本発明の実施の形態1における他の放熱器固定部の断面図Sectional drawing of the other heat sink fixing | fixed part in Embodiment 1 of this invention 本発明の実施の形態1における他の放熱器固定部の断面図Sectional drawing of the other heat sink fixing | fixed part in Embodiment 1 of this invention 本発明の実施の形態1における他の放熱器固定手段の構成を示す斜視図The perspective view which shows the structure of the other heat radiator fixing means in Embodiment 1 of this invention. 本発明の実施の形態1における他の放熱器固定部の断面図Sectional drawing of the other heat sink fixing | fixed part in Embodiment 1 of this invention

符号の説明Explanation of symbols

101 電子部品
101a 小基板
101b 半田ボール
102、107 伝熱体
103 放熱器
103a 放熱器固定用孔
103b 放熱部
104 固定ねじ
104a、704a 固定ねじ不完全ねじ部
104b 固定ねじ完全ねじ部
104c 固定ねじ頭
104d、704d 固定ねじ軸
105 回路基板
105a 回路基板固定孔
106 固定具
106a 固定具支持部
106b 固定具弾性部
106c 固定具孔部
506c、606c 固定具ねじ孔部
DESCRIPTION OF SYMBOLS 101 Electronic component 101a Small board | substrate 101b Solder ball | bowl 102,107 Heat-transfer body 103 Radiator 103a Radiator fixing hole 103b Heat sink 104 Fixing screw 104a, 704a Fixing screw incomplete screw part 104b Fixing screw complete screw part 104c Fixing screw head 104d 704d Fixing screw shaft 105 Circuit board 105a Circuit board fixing hole 106 Fixing tool 106a Fixing tool supporting part 106b Fixing tool elastic part 106c Fixing tool hole part 506c, 606c Fixing tool screw hole part

Claims (6)

固定具と、
前記固定具の固定具支持部上に配置された回路基板と、
前記回路基板上に配置された電子部品と、
前記電子部品の発熱部上に配置された伝熱体と、
前記伝熱体上に受熱部が配置された放熱器と、
固定ねじ頭が前記放熱器の放熱器固定用孔で係止され固定ねじ完全ねじ部が前記放熱器の放熱器固定用孔および前記回路基板の回路基板固定孔および前記固定具の固定具ねじ孔部を挿通し固定ねじ不完全ねじ部が空転可能状態にある固定ねじと、
を有する放熱器固定手段。
A fixture,
A circuit board disposed on a fixture support portion of the fixture;
An electronic component disposed on the circuit board;
A heat transfer body disposed on the heat generating portion of the electronic component;
A radiator in which a heat receiving portion is disposed on the heat transfer body;
The fixing screw head is locked in the radiator fixing hole of the radiator, and the fixing screw complete screw portion is the radiator fixing hole of the radiator, the circuit board fixing hole of the circuit board, and the fixing screw hole of the fixing tool. A fixing screw that passes through the part and the fixing screw incomplete thread part is idled,
A radiator fixing means.
前記固定具ねじ孔部はスピードナットである請求項1に記載の放熱器固定手段。 The radiator fixing means according to claim 1, wherein the fixing screw hole is a speed nut. 前記固定具は前記固定具支持部の周囲に複数の固定具弾性部を備えた請求項1乃至2の何れかに記載の放熱器固定手段。 The radiator fixing means according to claim 1, wherein the fixture includes a plurality of fixture elastic portions around the fixture support portion. 前記固定具を固定する場合に前記固定具弾性部に変形を生じさせ、前記変形の復元力により前記放熱器または前記放熱器の前記受熱部を前記電子部品に付勢する請求項3に記載の放熱器固定手段。 The fixing device elastic portion is deformed when the fixing device is fixed, and the radiator or the heat receiving portion of the radiator is urged to the electronic component by a restoring force of the deformation. A radiator fixing means. 前記放熱器は前記受熱部と放熱部とが一体である請求項1乃至4の何れかに記載の放熱器固定手段。 The radiator fixing means according to any one of claims 1 to 4, wherein in the radiator, the heat receiving portion and the heat radiating portion are integrated. 前記放熱器は前記受熱部と放熱部が伝熱手段を介して接続される請求項1乃至4の何れかに記載の放熱器固定手段。 The heat radiator fixing means according to any one of claims 1 to 4, wherein the heat receiving section and the heat radiation section are connected via a heat transfer section.
JP2006130002A 2006-05-09 2006-05-09 Means for fixing radiator Pending JP2007305649A (en)

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JP2011129739A (en) * 2009-12-18 2011-06-30 Fujitsu Ltd Electronic device and method of manufacturing the same
JP2013077781A (en) * 2011-09-30 2013-04-25 Fujitsu Ltd Electronic apparatus
JP2014116375A (en) * 2012-12-07 2014-06-26 Maruwa Co Ltd Heat dissipation structure
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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011129739A (en) * 2009-12-18 2011-06-30 Fujitsu Ltd Electronic device and method of manufacturing the same
JP2013077781A (en) * 2011-09-30 2013-04-25 Fujitsu Ltd Electronic apparatus
JP2014116375A (en) * 2012-12-07 2014-06-26 Maruwa Co Ltd Heat dissipation structure
WO2016035600A1 (en) * 2014-09-05 2016-03-10 株式会社オートネットワーク技術研究所 Circuit structure, electrical junction box, and spacer
JP2016059095A (en) * 2014-09-05 2016-04-21 株式会社オートネットワーク技術研究所 Circuit structure, electric connection box, and spacer
CN106575863A (en) * 2014-09-05 2017-04-19 株式会社自动网络技术研究所 Circuit structure, electrical junction box, and spacer
US10187969B2 (en) 2014-09-05 2019-01-22 Autonetworks Technologies, Ltd. Circuit structure, electrical junction box, and spacer
JP2020025138A (en) * 2015-04-03 2020-02-13 株式会社ソニー・インタラクティブエンタテインメント Electronic apparatus
JP2018026458A (en) * 2016-08-10 2018-02-15 Kyb株式会社 Heat radiation structure
CN107820375A (en) * 2016-09-14 2018-03-20 北京航天计量测试技术研究所 One kind is for matching somebody with somebody electric loading device fixing structure of radiator
JP2020120084A (en) * 2019-01-28 2020-08-06 日本電気株式会社 Device and assembling method
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