JP2010205832A - Semiconductor element mounting structure - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a semiconductor element mounting structure for easily mounting a semiconductor element to a radiation fin and easily removing it from the fin, without being affected by surrounding electronic components. <P>SOLUTION: This semiconductor element mounting structure is characterized in that a support member 45, which supports an elastic pressing member 47, is arranged, with some distance away from the side surface, on the side surface of a radiation fin 37 mounted on a printed circuit board 39; that a semiconductor element 31 is disposed between the elastic pressing member and the side surface of the radiation fin; that the elastic pressing member is connected with the semiconductor element by putting pressure, because of pressing operation from the upper part of the elastic pressing member; and that the semiconductor element is pressed to and held by the side surface of the radiation fin. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a structure for attaching a semiconductor element to a radiation fin.

  As shown in Patent Document 1 or FIG. 11, conventionally, a semiconductor element 1 has three linear lead terminals 5 arranged in parallel at the same pitch P on the lower side of an element body 3 made of synthetic resin. The semiconductor element 3 is attached to the substrate 7 by providing through holes 9 in the printed circuit board 7 in accordance with the pitch P of the lead terminals 5, inserting the lead terminals 5 into the through holes 9, and connecting the lead terminals from the back side of the printed circuit board 7. 5 is soldered.

  By the way, in the structural design of electronic equipment, heat dissipation of the heat generating component is an important issue, and conventionally, a structure in which the heat generating component is attached to the heat radiating fin is widely adopted as a heat dissipation measure.

  And the semiconductor element as a heat-generating component is also radiated by attaching it to the radiating fin. Conventionally, when the semiconductor element is attached to the radiating fin, it is screwed to the printed circuit board 7 as shown in FIG. While the back surface 3a side of the element body 3 is brought into contact with the side surface 11a of the radiation fin 11, the lead terminal is inserted into the through hole, and the semiconductor element 1 is screwed to the radiation fin 11 with a screwdriver from the lateral direction.

JP-A-8-46106 JP 2008-78216 A

  However, among electronic devices that require small size and high density, the mounting / removal of semiconductor elements on the printed circuit board cannot be used by the driver because the surrounding electronic components (peripheral devices) interfere with each other. In mounting / removing the element, the heat dissipating fins had to be removed from the printed circuit board, and much labor and man-hours were required.

  Further, in Patent Document 2, as shown in FIG. 13, in a mounting structure in which a first heat radiating plate 13 and a second heat radiating plate 15 are mounted on a printed board 17 so as to face each other, a driver is attached to the first heat radiating plate 13. When the semiconductor element 25 is attached / detached to / from the second heat sink 15, the first heat sink 13 or the second heat sink 15 is provided. A mounting structure for a heat sink is disclosed in which the semiconductor element 25 can be attached / detached without being removed.

  However, in this conventional structure, it takes time to provide the notch 21 and the hole 23 in the first heat radiating plate 13, and the semiconductor element 25 is attached to the part where the notch 21 and the hole 23 are provided. There was a drawback that could not.

  The present invention has been devised in view of such circumstances, and an object of the present invention is to provide a semiconductor element mounting structure in which a semiconductor element can be easily attached to / detached from a heat radiating fin without being affected by surrounding electronic components. To do.

  In order to achieve such an object, a semiconductor element mounting structure according to claim 1 is provided on a side surface of a heat radiation fin mounted on a printed circuit board by attaching a support member that supports an elastic pressing member apart from the side surface. A semiconductor element is disposed between the elastic pressing member and the side surface, the elastic pressing member is pressed against the semiconductor element by a pressing operation from above on the elastic pressing member, and the semiconductor element is pressed against the side surface of the radiation fin, It is characterized by holding.

  According to a second aspect of the present invention, in the semiconductor element mounting structure according to the first aspect, the support member is attached to a side surface of the heat radiation fin, and a clamping screw is screwed from above so that the semiconductor element can be inserted. A substantially U-shaped support fitting in plan view, and a rectangular presser plate in plan view that is fixed to the support fitting and screwed to the tightening screw, between the presser plate and the support fitting, The elastic pressing member into which a tightening screw is inserted is disposed, and the pressing plate presses and deforms the elastic pressing member with a support fitting and press-contacts the semiconductor element by a tightening operation from above the tightening screw. To do.

  Furthermore, the invention according to claim 3 is the semiconductor element mounting structure according to claim 1 or 2, wherein the elastic pressing member is in pressure contact with the vertical center of the element body of the semiconductor element. According to a fourth aspect of the present invention, in the semiconductor element mounting structure according to any one of the first to third aspects, the elastic pressing member is formed in a cylindrical shape, and the side surface of the radiation fin. It is arrange | positioned in the width direction of this.

  According to a fifth aspect of the present invention, there is provided the semiconductor element mounting structure according to any one of the first to fourth aspects, wherein the element is disposed between the elastic pressing member and the element body of the semiconductor element. A plate that is in pressure contact with the main body is disposed.

  According to the invention according to each claim, even if many electronic components are already mounted on the printed circuit board, by using the support member incorporating the elastic pressing member, it is possible to move to the side surface of the radiating fin by the pressing operation from above. Thus, it is possible to easily attach / remove the semiconductor element. As a result, it has become possible to reduce the conventional labor and man-hour required for attaching / detaching the semiconductor element.

  According to the invention of claim 3, the elastic pressing member presses the center in the vertical direction of the element body, and according to the invention of claim 4, the cylindrical elastic pressing member extends in the longitudinal direction. Since the element body is pressed, there is no gap between the semiconductor element and the radiation fin, and there is an advantage that good heat radiation of the semiconductor element can be achieved.

  Further, if a plate that widely presses the surface of the element main body is disposed between the elastic pressing member and the semiconductor element as in the invention according to claim 5, the surface of the element main body can be expanded over the elastic pressing member. Therefore, there is an advantage that the semiconductor element can be pressed and held on the radiating fin more favorably.

5 is a side view of a semiconductor element mounting structure according to an embodiment of the present invention. FIG. It is a side view of the attachment structure of a semiconductor element. It is a top view of the attachment structure of a semiconductor element. It is a front view of the attachment structure of a semiconductor element. It is a whole perspective view of a pressing plate. It is the whole pipe material perspective view. It is a side view of the attachment structure which shows the attachment method of a semiconductor element. It is a side view of the attachment structure which shows the attachment method of a semiconductor element. It is a side view of the attachment structure which shows the attachment method of a semiconductor element. It is a side view of the attachment structure which shows the removal method of a semiconductor element. It is explanatory drawing of the attachment method of the conventional semiconductor element. It is a side view of the conventional semiconductor element mounting structure. It is explanatory drawing of the attachment structure of the other conventional semiconductor element.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

  1 to 10 relate to a semiconductor element mounting structure according to one embodiment of claims 1 to 4. In FIG. 1, reference numeral 31 denotes a lower part of the element body 33, similar to the semiconductor element 1 of FIG. A semiconductor element having three lead terminals 35 arranged side by side at the same pitch on the side, 37 is a heat radiation fin fixed on a printed circuit board 39 with a fixing screw 41, and a support member 45 is attached to a side surface 43 of the heat radiation fin 37 The semiconductor element 31 is pressed and held on the side surface 43 of the radiation fin 37 by a pipe material (elastic pressing member) 47 supported by the support member 45.

  2 to 6 show details of the support member 45, in which 49 is a substantially U-shaped support fitting in a plan view fixed to the side surface 43 with fixing screws 53 via mounting flanges 51 at both left and right ends. A top plate 55 is formed in the left-right direction, and the semiconductor element 31 can be disposed along the side surface 43 of the heat radiation fin 37 between the top plate 55 and the left and right side plates 61, 63 of the support bracket 49. Yes. A fastening screw 59 is screwed into the mounting screw hole 57 formed at the center of the top plate 55 from above. Although not shown, a mounting screw hole for the fixing screw 53 is provided on the side surface 43 of the radiating fin 37.

  Further, as shown in FIGS. 1, 2 and 4, a pressing plate 65 having a rectangular shape in plan view shown in FIG. 5 is arranged between the side plates 61 and 63 below the top plate 55. The width dimension between the side plates 61 and 63 is set to be approximately the same length. An attachment screw hole 67 into which the fastening screw 59 is screwed is provided at the center of the holding plate 65. When the fastening screw 59 is tightened from above, the holding plate 65 is prevented from rotating by the left and right side plates 61 and 63. Thus, it moves upward along the fastening screw 59 without idling.

  A cylindrical pipe member 47 of FIG. 6 through which the fastening screw 59 is inserted in the radial direction is disposed between the presser plate 65 and the top plate 55 (support metal fitting 49).

  The pipe material 47 is formed of an elastic material such as stainless steel, phosphor bronze, heat-resistant rubber, etc. as an example, and a screw insertion hole 69 through which the fastening screw 59 is inserted is provided in the center as shown in FIG. It has been. Then, as shown in FIG. 9, between the presser plate 65 and the top plate 55, the fastening screw 59 is inserted into the screw insertion hole 69 and the pipe material 47 is arranged, and then the fastening screw 59 is screwed with a screwdriver 71 from above. When tightened with a predetermined torque, as shown in FIG. 1, the pressing plate 65 moving upward along the tightening screw 59 presses and deforms the pipe material 47 in the radial direction with the top plate 55 (support metal fitting 49). It has become.

  Then, the pipe material 47 deformed in this way presses the center in the vertical direction of the element main body 33 over the longitudinal direction, and the semiconductor element 31 is pressed and held by the side surface 43 of the radiating fin 37. ing.

  In addition, in the state of FIG. 1, when the tightening screw 59 is loosened with a screwdriver 71 from above as shown in FIG. 10, the holding plate 65 moves downward along the tightening screw 59, and the pipe material 47 is restored to its original restoring force. Since it returns to the shape and is separated from the center of the element body 33, the pressing and holding force against the semiconductor element 31 is released, and the semiconductor element 31 can be removed.

  This embodiment is configured as described above. Next, a method for attaching / detaching the semiconductor element 31 using the support member 45 will be described.

  First, when attaching the radiating fin 37 to the printed circuit board 39 using the fixing screw 41, the support fitting 49 is fixed to the side surface 43 of the radiating fin 37 with the fixing screw 53. Further, the pipe material 47 and the pressing plate 65 are assembled in advance to the support fitting 49 by using the tightening screw 59 screwed into the attachment screw hole 57 of the support fitting 49.

  In the case where no electronic component is mounted in the surrounding area, the support metal fitting 49 may be attached to the side surface 43 after the heat radiation fin 37 is fixed to the printed circuit board 39.

  Thus, after the radiation fins 37 are attached to the printed circuit board 39 in this manner, the semiconductor element 31 is inserted between the top plate 55 of the support bracket 49 and the left and right side plates 61 and 63 as shown in FIG. As shown in FIG. 8, the lead terminal 35 is inserted into a through hole (not shown) of the printed circuit board 39 while adjusting the vertical position of the element body 33 by bringing the element body 33 into contact with the side surface 43 of the radiating fin 37. To do.

  Although not shown, when the support metal fitting 49 is fixed to the side surface 43 of the radiating fin 37, the semiconductor element 31 is inserted and disposed in advance between the top plate 55 and the side plates 61 and 63, and the support metal fitting 49 is attached to the side surface 43. It may be fixed to.

  Then, as shown in FIG. 9, when the fastening screw 59 is tightened with a predetermined torque with a screwdriver 71 from above, the pipe material 47 is pressed from above and below by the pressing plate 65 and the top plate 55 as shown in FIG. While the pipe member 47 is elastically deformed in the radial direction, the pipe member 47 presses the center in the vertical direction of the element main body 33 over the longitudinal direction thereof, so that the semiconductor element 31 is moved by the pipe member 47 to the side surface 43 of the radiation fin 37. Pressed and held.

  Thereafter, the lead terminal 35 is soldered from the back side of the printed circuit board 39, and the mounting operation of the semiconductor element 31 is completed.

  On the other hand, when a situation occurs in which the semiconductor element 31 is replaced due to long-term use, even if an electronic component is mounted in the surrounding area, after removing the solder of the lead terminal 35, as shown in FIG. If the tightening screw 59 is loosened, the holding plate 65 moves downward along the tightening screw 59, and the pipe material 47 returns to its original shape by its own restoring force and is separated from the element body 33. The pressing and holding force with respect to is released, and the semiconductor element 31 can be removed.

  Therefore, the semiconductor element 31 may be removed from the side surface 43 (printed circuit board 39) of the radiating fin 37, and a new semiconductor element may be attached to the side surface 43 of the radiating fin 37 again by the procedure described above.

  As described above, according to the present embodiment, even when many electronic components are already mounted on the printed circuit board 39, the support member 45 incorporating the pipe material 47 can be used to operate the driver 71 from above. The semiconductor element 31 can be easily attached / detached to / from the side surface 43 of the radiating fin 37. As a result, it has become possible to reduce the conventional labor and man-hour required for attaching / detaching the semiconductor element 31.

  In the present embodiment, since the cylindrical pipe member 47 presses the center of the element body 33 in the vertical direction over the longitudinal direction, there is a gap between the semiconductor element 31 and the side surface 43 of the radiation fin 37. There is an advantage that good heat dissipation of the semiconductor element 31 can be achieved without being generated.

  Although not shown in the drawings, if the plate that widely presses the surface of the element body 33 is disposed between the pipe material 47 and the element body 33 of the semiconductor element 31 as in the embodiment of the invention according to claim 5, the above-described embodiment is achieved. Compared to the form, the surface of the element body 33 can be pressed with a wider area through the pipe material 47, and therefore, there is an advantage that the semiconductor element 31 can be pressed and held to the side surface 43 of the heat radiation fin 37 better.

  In the embodiment, the hollow pipe material 47 is used as the elastic pressing member. However, for example, a solid cylindrical elastic pressing member using heat-resistant rubber may be used.

  Moreover, although the said embodiment demonstrated attachment / detachment of the one semiconductor element 31, it is also possible to mount in parallel the some support member 45 on the side surface of a long radiating fin, and the number of the semiconductor elements 31 to attach. Accordingly, the number of support members 45 attached to the side surface 43 may be appropriately selected.

31 Semiconductor element 33 Element body 35 Lead terminal 37 Radiation fin 39 Printed circuit board 43 Radiation fin side surface 45 Support member 47 Pipe material (elastic pressing member)
49 Supporting bracket 51 Mounting flange 55 Top plate 57, 67 Mounting screw hole 59 Tightening screw 65 Holding plate 69 Screw insertion hole 71 Driver

Claims (5)

A support member that supports the elastic pressing member spaced from the side surface is attached to the side surface of the heat radiation fin mounted on the printed circuit board, and a semiconductor element is disposed between the elastic pressing member and the side surface,
A mounting structure of a semiconductor element, wherein the elastic pressing member is pressed against the semiconductor element by a pressing operation from above on the elastic pressing member, and the semiconductor element is pressed and held on a side surface of the radiation fin. The support member is attached to the side surface of the heat radiating fin, and a fastening screw is screwed from above so that a semiconductor element can be inserted. It consists of a holding plate with a rectangular shape in plan view,
The elastic pressing member through which the tightening screw is inserted is disposed between the pressing plate and the support fitting,
2. The semiconductor element mounting structure according to claim 1, wherein the pressing plate presses and deforms the elastic pressing member with a support fitting and press-contacts the semiconductor element by a tightening operation from above the tightening screw.   3. The semiconductor element mounting structure according to claim 1, wherein the elastic pressing member is in pressure contact with a center in a vertical direction of an element body of the semiconductor element.   4. The semiconductor element mounting structure according to claim 1, wherein the elastic pressing member is formed in a cylindrical shape and is disposed in a width direction of a side surface of the radiation fin. 5. 5. The semiconductor element attachment according to claim 1, wherein a plate that is in pressure contact with the element body is disposed between the elastic pressing member and the element body of the semiconductor element. Construction.

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