JPH0553062B2 - - Google Patents
Info
- Publication number
- JPH0553062B2 JPH0553062B2 JP4312886A JP4312886A JPH0553062B2 JP H0553062 B2 JPH0553062 B2 JP H0553062B2 JP 4312886 A JP4312886 A JP 4312886A JP 4312886 A JP4312886 A JP 4312886A JP H0553062 B2 JPH0553062 B2 JP H0553062B2
- Authority
- JP
- Japan
- Prior art keywords
- mounting table
- semiconductor wafer
- small holes
- cleaning
- wafer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 235000012431 wafers Nutrition 0.000 claims description 39
- 239000004065 semiconductor Substances 0.000 claims description 32
- 238000004140 cleaning Methods 0.000 claims description 14
- 238000001035 drying Methods 0.000 claims description 10
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 5
- 239000007788 liquid Substances 0.000 description 4
- 238000007664 blowing Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000001179 sorption measurement Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Landscapes
- Jigs For Machine Tools (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Cleaning In General (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4312886A JPS62199030A (ja) | 1986-02-27 | 1986-02-27 | 半導体ウエハ−の処理装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4312886A JPS62199030A (ja) | 1986-02-27 | 1986-02-27 | 半導体ウエハ−の処理装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62199030A JPS62199030A (ja) | 1987-09-02 |
| JPH0553062B2 true JPH0553062B2 (en, 2012) | 1993-08-09 |
Family
ID=12655203
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4312886A Granted JPS62199030A (ja) | 1986-02-27 | 1986-02-27 | 半導体ウエハ−の処理装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62199030A (en, 2012) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2006075356A1 (ja) | 2005-01-11 | 2006-07-20 | Mitsubishi Denki Kabushiki Kaisha | 半導体製造装置 |
-
1986
- 1986-02-27 JP JP4312886A patent/JPS62199030A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS62199030A (ja) | 1987-09-02 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |