JP7365160B2 - スピナー乾燥装置 - Google Patents
スピナー乾燥装置 Download PDFInfo
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- JP7365160B2 JP7365160B2 JP2019145366A JP2019145366A JP7365160B2 JP 7365160 B2 JP7365160 B2 JP 7365160B2 JP 2019145366 A JP2019145366 A JP 2019145366A JP 2019145366 A JP2019145366 A JP 2019145366A JP 7365160 B2 JP7365160 B2 JP 7365160B2
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- suction
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- spinner
- spinner table
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Drying Of Solid Materials (AREA)
- Cleaning By Liquid Or Steam (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Description
図1は、本発明の実施形態に係るスピナー乾燥装置1の概略構成を示す正面図である。
図2に示すように、スピナーテーブルパッド11の吸着面12には、スピナーテーブルパッド11の径方向に延在する略直線状の吸引凹部14と、吸引凹部14に交差して水平方向に延在する吸引溝13と、吸引凹部14に形成されて真空吸引手段としてのバキュームポンプ30(図1参照)につながる吸引口15と、が形成されている。
ワークWを吸着する際、吸引溝13は、バキュームポンプ30によって吸引される流体、即ち空気及びワークWに付着していた水分等、が流れる流路となる。
10 スピナーテーブル
11 スピナーテーブルパッド
12 吸着面
13 吸引溝
14 吸引凹部
15 吸引口
16 吸引経路
17 嵌合凹部
18 吸引経路
19 軸
20 排水ケース
21 排水口
22 壁部
23 上縁部
24 ロータリージョイント
25 軸
26 カップリング
28 モータ
29 モータ軸
30 バキュームポンプ
31 エア配管
32 空気供給装置
33 エアノズル
35 支持台
Claims (4)
- 回転するスピナーテーブルと、
前記スピナーテーブルに設けられてワークを保持する吸着面を有するスピナーテーブルパッドと、
前記吸着面から流体を吸引して前記ワークを前記吸着面に吸着する真空吸引手段と、を有し、
前記吸着面には、前記真空吸引手段につながり前記真空吸引手段によって吸引される前記流体が流れる吸引口と、前記ワーク方向に開口し前記吸引口につながり前記流体が流れる吸引溝と、が形成されており、
前記吸引溝は、一端が前記スピナーテーブルパッドの周縁から外側に開口しており、
前記ワークを前記吸着面に吸着する際、前記ワークの前記吸着面近傍に付着していた水分を前記吸引溝及び前記吸引口を経由して吸引除去することを特徴とするスピナー乾燥装置。 - 前記吸着面には、前記ワーク方向に開口し前記スピナーテーブルパッドの回転中心近傍から両端が回転半径方向に延在する直線状の吸引凹部が形成されており、
前記吸引口は、前記吸引凹部に形成されており、
前記吸引溝は、前記吸引凹部と交差する方向に延在して前記吸引凹部につながっていることを特徴とする請求項1に記載のスピナー乾燥装置。 - 前記吸引凹部は、両端部が前記スピナーテーブルパッドの周縁から外側に開口していないことを特徴とする請求項2に記載のスピナー乾燥装置。
- 前記吸引口は、前記スピナーテーブルパッドの回転中心よりも回転半径方向外側に形成されていることを特徴とする請求項1ないし請求項3の何れか1項に記載のスピナー乾燥装置。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019145366A JP7365160B2 (ja) | 2019-08-07 | 2019-08-07 | スピナー乾燥装置 |
CN202010512206.8A CN112349618A (zh) | 2019-08-07 | 2020-06-08 | 旋转干燥装置 |
KR1020200070017A KR20210018020A (ko) | 2019-08-07 | 2020-06-10 | 스피너 건조 장치 |
TW109120364A TW202107552A (zh) | 2019-08-07 | 2020-06-17 | 旋轉乾燥裝置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019145366A JP7365160B2 (ja) | 2019-08-07 | 2019-08-07 | スピナー乾燥装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2021025725A JP2021025725A (ja) | 2021-02-22 |
JP7365160B2 true JP7365160B2 (ja) | 2023-10-19 |
Family
ID=74357472
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2019145366A Active JP7365160B2 (ja) | 2019-08-07 | 2019-08-07 | スピナー乾燥装置 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP7365160B2 (ja) |
KR (1) | KR20210018020A (ja) |
CN (1) | CN112349618A (ja) |
TW (1) | TW202107552A (ja) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
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CN113634556A (zh) * | 2021-08-10 | 2021-11-12 | 叶建蓉 | 一种硅片表面除液清理设备 |
CN113945072B (zh) * | 2021-10-18 | 2022-11-29 | 北京烁科精微电子装备有限公司 | 一种干燥系统及干燥方法 |
CN114152051B (zh) * | 2021-11-04 | 2022-11-01 | 深圳市中医院 | 组立式医用玻片沥水架 |
CN114602913A (zh) * | 2022-04-08 | 2022-06-10 | 上海德采包装机械股份有限公司 | 高速自动洗瓶烘干机 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004319930A (ja) | 2003-04-21 | 2004-11-11 | Okamoto Machine Tool Works Ltd | 基板用洗浄・乾燥装置 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59183735U (ja) * | 1983-05-23 | 1984-12-07 | 株式会社 デイスコ | 吸着固定装置 |
-
2019
- 2019-08-07 JP JP2019145366A patent/JP7365160B2/ja active Active
-
2020
- 2020-06-08 CN CN202010512206.8A patent/CN112349618A/zh active Pending
- 2020-06-10 KR KR1020200070017A patent/KR20210018020A/ko unknown
- 2020-06-17 TW TW109120364A patent/TW202107552A/zh unknown
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004319930A (ja) | 2003-04-21 | 2004-11-11 | Okamoto Machine Tool Works Ltd | 基板用洗浄・乾燥装置 |
Also Published As
Publication number | Publication date |
---|---|
JP2021025725A (ja) | 2021-02-22 |
TW202107552A (zh) | 2021-02-16 |
KR20210018020A (ko) | 2021-02-17 |
CN112349618A (zh) | 2021-02-09 |
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