JPH0553062B2 - - Google Patents
Info
- Publication number
- JPH0553062B2 JPH0553062B2 JP4312886A JP4312886A JPH0553062B2 JP H0553062 B2 JPH0553062 B2 JP H0553062B2 JP 4312886 A JP4312886 A JP 4312886A JP 4312886 A JP4312886 A JP 4312886A JP H0553062 B2 JPH0553062 B2 JP H0553062B2
- Authority
- JP
- Japan
- Prior art keywords
- mounting table
- semiconductor wafer
- small holes
- cleaning
- wafer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 235000012431 wafers Nutrition 0.000 claims description 39
- 239000004065 semiconductor Substances 0.000 claims description 32
- 238000004140 cleaning Methods 0.000 claims description 14
- 238000001035 drying Methods 0.000 claims description 10
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 5
- 239000007788 liquid Substances 0.000 description 4
- 238000007664 blowing Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000001179 sorption measurement Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Landscapes
- Cleaning In General (AREA)
- Jigs For Machine Tools (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4312886A JPS62199030A (ja) | 1986-02-27 | 1986-02-27 | 半導体ウエハ−の処理装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4312886A JPS62199030A (ja) | 1986-02-27 | 1986-02-27 | 半導体ウエハ−の処理装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62199030A JPS62199030A (ja) | 1987-09-02 |
| JPH0553062B2 true JPH0553062B2 (US20100056889A1-20100304-C00004.png) | 1993-08-09 |
Family
ID=12655203
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4312886A Granted JPS62199030A (ja) | 1986-02-27 | 1986-02-27 | 半導体ウエハ−の処理装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62199030A (US20100056889A1-20100304-C00004.png) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1796158B1 (en) | 2005-01-11 | 2016-05-18 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor manufacturing apparatus |
-
1986
- 1986-02-27 JP JP4312886A patent/JPS62199030A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS62199030A (ja) | 1987-09-02 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH07256195A (ja) | 回転式薬液処理装置 | |
| JPS6064436A (ja) | スピンドライヤ | |
| JP7365160B2 (ja) | スピナー乾燥装置 | |
| JPH031172Y2 (US20100056889A1-20100304-C00004.png) | ||
| JP2004319885A (ja) | チャックテーブル及び半導体ウェーハの研削方法 | |
| JPH0553062B2 (US20100056889A1-20100304-C00004.png) | ||
| JPH0778864A (ja) | 半導体製造装置及び半導体装置の製造方法 | |
| JP2003017452A (ja) | 基板処理方法及び基板処理装置 | |
| JP2875213B2 (ja) | 洗浄用スポンジブラシ | |
| KR100618868B1 (ko) | 스핀 장치 | |
| JPS5932056B2 (ja) | 半導体装置の製造方法 | |
| JP2004319930A (ja) | 基板用洗浄・乾燥装置 | |
| JP3184311B2 (ja) | スピンチャック | |
| JPH0379872U (US20100056889A1-20100304-C00004.png) | ||
| JPH04225256A (ja) | ウェーハ把持装置 | |
| JP3035580U (ja) | ディスク等の研磨加工体の洗滌装置 | |
| JPH0684775A (ja) | 回転機構 | |
| JPH0417311Y2 (US20100056889A1-20100304-C00004.png) | ||
| JPS6333660Y2 (US20100056889A1-20100304-C00004.png) | ||
| JPH0441977Y2 (US20100056889A1-20100304-C00004.png) | ||
| JPS6242375B2 (US20100056889A1-20100304-C00004.png) | ||
| JPH06275582A (ja) | ウエハ加工装置 | |
| JP2000105076A (ja) | スピン処理装置 | |
| JPH0766105A (ja) | 基板処理装置 | |
| JPS6032326A (ja) | 半導体ウエハの乾燥方法 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |