JPH0552667B2 - - Google Patents
Info
- Publication number
- JPH0552667B2 JPH0552667B2 JP60026968A JP2696885A JPH0552667B2 JP H0552667 B2 JPH0552667 B2 JP H0552667B2 JP 60026968 A JP60026968 A JP 60026968A JP 2696885 A JP2696885 A JP 2696885A JP H0552667 B2 JPH0552667 B2 JP H0552667B2
- Authority
- JP
- Japan
- Prior art keywords
- high frequency
- coaxial line
- chip
- transistor
- characteristic impedance
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000004020 conductor Substances 0.000 claims description 12
- 239000000523 sample Substances 0.000 claims description 10
- 238000011156 evaluation Methods 0.000 claims description 6
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims description 5
- 239000004065 semiconductor Substances 0.000 claims description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- 229910052802 copper Inorganic materials 0.000 description 5
- 239000010949 copper Substances 0.000 description 5
- 238000010586 diagram Methods 0.000 description 5
- 238000005259 measurement Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 2
- 230000002950 deficient Effects 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 230000007547 defect Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Measuring Leads Or Probes (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2696885A JPS61187244A (ja) | 1985-02-14 | 1985-02-14 | 半導体評価装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2696885A JPS61187244A (ja) | 1985-02-14 | 1985-02-14 | 半導体評価装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS61187244A JPS61187244A (ja) | 1986-08-20 |
JPH0552667B2 true JPH0552667B2 (zh) | 1993-08-06 |
Family
ID=12207955
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2696885A Granted JPS61187244A (ja) | 1985-02-14 | 1985-02-14 | 半導体評価装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS61187244A (zh) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6367884U (zh) * | 1986-06-20 | 1988-05-07 | ||
JPH0652748B2 (ja) * | 1987-05-12 | 1994-07-06 | 東京エレクトロン株式会社 | プロ−ブカ−ド |
JP2944677B2 (ja) * | 1989-03-03 | 1999-09-06 | 日本発条株式会社 | 導電性接触子 |
JP2000121666A (ja) * | 1998-10-15 | 2000-04-28 | Micronics Japan Co Ltd | プローブ及びプローブカード |
JP3944196B2 (ja) * | 2004-06-28 | 2007-07-11 | 日本電産リード株式会社 | プローブ装置及び基板検査装置 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS50150375A (zh) * | 1974-05-21 | 1975-12-02 | ||
JPS5124851U (zh) * | 1974-08-12 | 1976-02-24 | ||
JPS5941314A (ja) * | 1982-08-31 | 1984-03-07 | Mitsui Petrochem Ind Ltd | 変性4―メチル―1―ペンテン重合体の製造方法 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5997469U (ja) * | 1982-12-20 | 1984-07-02 | 株式会社東芝 | 半導体チツプ測定用探針 |
-
1985
- 1985-02-14 JP JP2696885A patent/JPS61187244A/ja active Granted
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS50150375A (zh) * | 1974-05-21 | 1975-12-02 | ||
JPS5124851U (zh) * | 1974-08-12 | 1976-02-24 | ||
JPS5941314A (ja) * | 1982-08-31 | 1984-03-07 | Mitsui Petrochem Ind Ltd | 変性4―メチル―1―ペンテン重合体の製造方法 |
Also Published As
Publication number | Publication date |
---|---|
JPS61187244A (ja) | 1986-08-20 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
LAPS | Cancellation because of no payment of annual fees |