JPH0552666B2 - - Google Patents

Info

Publication number
JPH0552666B2
JPH0552666B2 JP58220925A JP22092583A JPH0552666B2 JP H0552666 B2 JPH0552666 B2 JP H0552666B2 JP 58220925 A JP58220925 A JP 58220925A JP 22092583 A JP22092583 A JP 22092583A JP H0552666 B2 JPH0552666 B2 JP H0552666B2
Authority
JP
Japan
Prior art keywords
metal film
metal
bump
plating
electrode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP58220925A
Other languages
English (en)
Japanese (ja)
Other versions
JPS60113446A (ja
Inventor
Hiroshi Nakatani
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
Original Assignee
Seiko Epson Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp filed Critical Seiko Epson Corp
Priority to JP58220925A priority Critical patent/JPS60113446A/ja
Publication of JPS60113446A publication Critical patent/JPS60113446A/ja
Publication of JPH0552666B2 publication Critical patent/JPH0552666B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/11—Manufacturing methods
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/11—Manufacturing methods
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
    • H01L2224/13001—Core members of the bump connector
    • H01L2224/13099—Material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01013—Aluminum [Al]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01023—Vanadium [V]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01024—Chromium [Cr]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01041—Niobium [Nb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01042—Molybdenum [Mo]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01072—Hafnium [Hf]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01073—Tantalum [Ta]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01074—Tungsten [W]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Magnetic Heads (AREA)
JP58220925A 1983-11-24 1983-11-24 バンプ電極の製造方法 Granted JPS60113446A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58220925A JPS60113446A (ja) 1983-11-24 1983-11-24 バンプ電極の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58220925A JPS60113446A (ja) 1983-11-24 1983-11-24 バンプ電極の製造方法

Publications (2)

Publication Number Publication Date
JPS60113446A JPS60113446A (ja) 1985-06-19
JPH0552666B2 true JPH0552666B2 (cs) 1993-08-06

Family

ID=16758697

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58220925A Granted JPS60113446A (ja) 1983-11-24 1983-11-24 バンプ電極の製造方法

Country Status (1)

Country Link
JP (1) JPS60113446A (cs)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62252951A (ja) * 1986-04-22 1987-11-04 Oki Electric Ind Co Ltd バンプ電極の製造方法
JP2633586B2 (ja) * 1987-10-21 1997-07-23 株式会社東芝 バンプ構造を有する半導体装置

Also Published As

Publication number Publication date
JPS60113446A (ja) 1985-06-19

Similar Documents

Publication Publication Date Title
EP0291014B1 (en) Semiconductor device in which wiring layer is formed below bonding pad
US5403777A (en) Semiconductor bond pad structure and method
JPH0513418A (ja) 半導体装置およびその製造方法
JPH0552666B2 (cs)
JPH118264A (ja) 半導体装置及びその製造方法
JPH06224200A (ja) 集積半導体デバイスおよび集積半導体デバイス上にバンプ構造を形成する方法
JPH0714028B2 (ja) 立体型半導体装置の製造方法
JPS60136338A (ja) 半導体装置
JP3116469B2 (ja) バンプ型電極の形成方法及び半導体装置の製造方法
JPH0244145B2 (cs)
JPH065609A (ja) バンプ形成方法
JP2773762B2 (ja) 半導体装置の製造方法
JP2600161B2 (ja) 転写バンプ用基板
JPH0562977A (ja) 集積回路装置用バンプ電極
KR200198274Y1 (ko) 반도체장치의범프
JPS5823940B2 (ja) 半導体装置の電極形成方法
JPH05243323A (ja) 半導体装置およびその製造方法
JPS61202444A (ja) 半導体装置の製造方法
JPH0462459B2 (cs)
JPS5846852B2 (ja) 半導体装置の製造方法
JPS5868975A (ja) 半導体装置
JPS5936976A (ja) 太陽電池装置
JPH0529375A (ja) 半導体装置
JPH05136198A (ja) 半導体装置
JPS61141157A (ja) 半導体素子の製造方法