JPH05509360A - 金析出のための安定性無電解水性酸性金浴及び該浴使用下での方法 - Google Patents
金析出のための安定性無電解水性酸性金浴及び該浴使用下での方法Info
- Publication number
- JPH05509360A JPH05509360A JP3512501A JP51250191A JPH05509360A JP H05509360 A JPH05509360 A JP H05509360A JP 3512501 A JP3512501 A JP 3512501A JP 51250191 A JP51250191 A JP 51250191A JP H05509360 A JPH05509360 A JP H05509360A
- Authority
- JP
- Japan
- Prior art keywords
- gold
- bath
- complexing agent
- acid
- stable electroless
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 title claims description 29
- 229910052737 gold Inorganic materials 0.000 title claims description 29
- 239000010931 gold Substances 0.000 title claims description 29
- 230000008021 deposition Effects 0.000 title claims description 12
- 230000002378 acidificating effect Effects 0.000 title claims description 8
- 238000000034 method Methods 0.000 title description 2
- 239000008139 complexing agent Substances 0.000 claims description 15
- 238000000151 deposition Methods 0.000 claims description 12
- 239000000203 mixture Substances 0.000 claims description 11
- 239000002253 acid Substances 0.000 claims description 8
- 150000001875 compounds Chemical class 0.000 claims description 7
- 229910052751 metal Inorganic materials 0.000 claims description 6
- 239000002184 metal Substances 0.000 claims description 6
- 239000000956 alloy Substances 0.000 claims description 4
- 229910045601 alloy Inorganic materials 0.000 claims description 4
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims description 3
- ABLZXFCXXLZCGV-UHFFFAOYSA-N phosphonic acid group Chemical group P(O)(O)=O ABLZXFCXXLZCGV-UHFFFAOYSA-N 0.000 claims description 3
- 150000001450 anions Chemical class 0.000 claims description 2
- 150000001735 carboxylic acids Chemical class 0.000 claims description 2
- 239000003795 chemical substances by application Substances 0.000 claims description 2
- 239000000126 substance Substances 0.000 claims 2
- YSMRWXYRXBRSND-UHFFFAOYSA-N TOTP Chemical compound CC1=CC=CC=C1OP(=O)(OC=1C(=CC=CC=1)C)OC1=CC=CC=C1C YSMRWXYRXBRSND-UHFFFAOYSA-N 0.000 claims 1
- 230000009918 complex formation Effects 0.000 claims 1
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 6
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 4
- 150000002739 metals Chemical class 0.000 description 4
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 description 2
- 150000007513 acids Chemical class 0.000 description 2
- 229910052783 alkali metal Inorganic materials 0.000 description 2
- 150000001340 alkali metals Chemical class 0.000 description 2
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 229910052700 potassium Inorganic materials 0.000 description 2
- 239000011591 potassium Substances 0.000 description 2
- 238000001556 precipitation Methods 0.000 description 2
- 229910000531 Co alloy Inorganic materials 0.000 description 1
- 229910000990 Ni alloy Inorganic materials 0.000 description 1
- 229910019142 PO4 Inorganic materials 0.000 description 1
- KGWWEXORQXHJJQ-UHFFFAOYSA-N [Fe].[Co].[Ni] Chemical compound [Fe].[Co].[Ni] KGWWEXORQXHJJQ-UHFFFAOYSA-N 0.000 description 1
- 239000011260 aqueous acid Substances 0.000 description 1
- QDWJUBJKEHXSMT-UHFFFAOYSA-N boranylidynenickel Chemical compound [Ni]#B QDWJUBJKEHXSMT-UHFFFAOYSA-N 0.000 description 1
- 239000003638 chemical reducing agent Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 150000002343 gold Chemical class 0.000 description 1
- MSNOMDLPLDYDME-UHFFFAOYSA-N gold nickel Chemical compound [Ni].[Au] MSNOMDLPLDYDME-UHFFFAOYSA-N 0.000 description 1
- IZLAVFWQHMDDGK-UHFFFAOYSA-N gold(1+);cyanide Chemical compound [Au+].N#[C-] IZLAVFWQHMDDGK-UHFFFAOYSA-N 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 229910001092 metal group alloy Inorganic materials 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 229910000510 noble metal Inorganic materials 0.000 description 1
- 150000007965 phenolic acids Chemical class 0.000 description 1
- 235000009048 phenolic acids Nutrition 0.000 description 1
- OFNHPGDEEMZPFG-UHFFFAOYSA-N phosphanylidynenickel Chemical compound [P].[Ni] OFNHPGDEEMZPFG-UHFFFAOYSA-N 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 150000003628 tricarboxylic acids Chemical class 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/42—Coating with noble metals
- C23C18/44—Coating with noble metals using reducing agents
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/42—Coating with noble metals
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemically Coating (AREA)
- Electroplating And Plating Baths Therefor (AREA)
- Manufacture And Refinement Of Metals (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE4024764.3 | 1990-08-02 | ||
| DE4024764A DE4024764C1 (en, 2012) | 1990-08-02 | 1990-08-02 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH05509360A true JPH05509360A (ja) | 1993-12-22 |
Family
ID=6411638
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3512501A Pending JPH05509360A (ja) | 1990-08-02 | 1991-08-01 | 金析出のための安定性無電解水性酸性金浴及び該浴使用下での方法 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US5322552A (en, 2012) |
| EP (1) | EP0542771B1 (en, 2012) |
| JP (1) | JPH05509360A (en, 2012) |
| AT (1) | ATE117740T1 (en, 2012) |
| DE (2) | DE4024764C1 (en, 2012) |
| TW (1) | TW241312B (en, 2012) |
| WO (1) | WO1992002663A1 (en, 2012) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE19745601C2 (de) * | 1997-10-08 | 2001-07-12 | Fraunhofer Ges Forschung | Lösung und Verfahren zum stromlosen Abscheiden von Goldschichten sowie Verwendung der Lösung |
| DE19745602C1 (de) | 1997-10-08 | 1999-07-15 | Atotech Deutschland Gmbh | Verfahren und Lösung zur Herstellung von Goldschichten |
| US5935306A (en) * | 1998-02-10 | 1999-08-10 | Technic Inc. | Electroless gold plating bath |
| JP4116718B2 (ja) * | 1998-11-05 | 2008-07-09 | 日本リーロナール有限会社 | 無電解金めっき方法及びそれに使用する無電解金めっき液 |
| DE102009041264A1 (de) | 2009-09-11 | 2011-03-24 | IPHT Jena Institut für Photonische Technologien e.V. | Verfahren zur Herstellung von optisch aktiven Nanostrukturen |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4374876A (en) * | 1981-06-02 | 1983-02-22 | Occidental Chemical Corporation | Process for the immersion deposition of gold |
| US4474838A (en) * | 1982-12-01 | 1984-10-02 | Omi International Corporation | Electroless direct deposition of gold on metallized ceramics |
| DE3614090C1 (en) * | 1986-04-25 | 1987-04-30 | Heraeus Gmbh W C | Bath for the currentless deposition of gold layers |
| DE3640028C1 (de) * | 1986-11-24 | 1987-10-01 | Heraeus Gmbh W C | Saures Bad fuer das stromlose Abscheiden von Goldschichten |
| DE3707817A1 (de) * | 1987-03-09 | 1988-09-22 | Schering Ag | Stabilisiertes alkalisches goldbad zur stromlosen abscheidung von gold |
| US4919720A (en) * | 1988-06-30 | 1990-04-24 | Learonal, Inc. | Electroless gold plating solutions |
-
1990
- 1990-08-02 DE DE4024764A patent/DE4024764C1/de not_active Expired - Lifetime
-
1991
- 1991-08-01 AT AT91913280T patent/ATE117740T1/de not_active IP Right Cessation
- 1991-08-01 WO PCT/DE1991/000624 patent/WO1992002663A1/de active IP Right Grant
- 1991-08-01 EP EP91913280A patent/EP0542771B1/de not_active Expired - Lifetime
- 1991-08-01 US US07/978,690 patent/US5322552A/en not_active Expired - Fee Related
- 1991-08-01 JP JP3512501A patent/JPH05509360A/ja active Pending
- 1991-08-01 DE DE59104436T patent/DE59104436D1/de not_active Expired - Fee Related
-
1992
- 1992-09-04 TW TW081107004A patent/TW241312B/zh active
Also Published As
| Publication number | Publication date |
|---|---|
| ATE117740T1 (de) | 1995-02-15 |
| US5322552A (en) | 1994-06-21 |
| EP0542771A1 (de) | 1993-05-26 |
| TW241312B (en, 2012) | 1995-02-21 |
| DE4024764C1 (en, 2012) | 1991-10-10 |
| WO1992002663A1 (de) | 1992-02-20 |
| DE59104436D1 (de) | 1995-03-09 |
| EP0542771B1 (de) | 1995-01-25 |
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