JPH0548959B2 - - Google Patents

Info

Publication number
JPH0548959B2
JPH0548959B2 JP62202497A JP20249787A JPH0548959B2 JP H0548959 B2 JPH0548959 B2 JP H0548959B2 JP 62202497 A JP62202497 A JP 62202497A JP 20249787 A JP20249787 A JP 20249787A JP H0548959 B2 JPH0548959 B2 JP H0548959B2
Authority
JP
Japan
Prior art keywords
bent
wiring board
film
circuit
copper foil
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP62202497A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6445197A (en
Inventor
Yutaka Hibino
Toshihide Kimura
Ken Okazaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Electric Industries Ltd
Original Assignee
Sumitomo Electric Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Electric Industries Ltd filed Critical Sumitomo Electric Industries Ltd
Priority to JP20249787A priority Critical patent/JPS6445197A/ja
Publication of JPS6445197A publication Critical patent/JPS6445197A/ja
Publication of JPH0548959B2 publication Critical patent/JPH0548959B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
    • H05K3/4691—Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
JP20249787A 1987-08-12 1987-08-12 Manufacture of flexible double-sided wiring board Granted JPS6445197A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP20249787A JPS6445197A (en) 1987-08-12 1987-08-12 Manufacture of flexible double-sided wiring board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP20249787A JPS6445197A (en) 1987-08-12 1987-08-12 Manufacture of flexible double-sided wiring board

Publications (2)

Publication Number Publication Date
JPS6445197A JPS6445197A (en) 1989-02-17
JPH0548959B2 true JPH0548959B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1993-07-22

Family

ID=16458467

Family Applications (1)

Application Number Title Priority Date Filing Date
JP20249787A Granted JPS6445197A (en) 1987-08-12 1987-08-12 Manufacture of flexible double-sided wiring board

Country Status (1)

Country Link
JP (1) JPS6445197A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6519714B2 (ja) * 2016-08-26 2019-05-29 株式会社村田製作所 樹脂多層基板、伝送線路、モジュールおよびモジュールの製造方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54157271A (en) * 1978-06-02 1979-12-12 Tokyo Shibaura Electric Co Rigid flexible compound printed circuit board and method of producing same
JPS5636187A (en) * 1979-08-31 1981-04-09 Sumitomo Electric Industries Flameeresistant substrate for flexible printed circuit

Also Published As

Publication number Publication date
JPS6445197A (en) 1989-02-17

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees