JPH0546699B2 - - Google Patents
Info
- Publication number
- JPH0546699B2 JPH0546699B2 JP60008374A JP837485A JPH0546699B2 JP H0546699 B2 JPH0546699 B2 JP H0546699B2 JP 60008374 A JP60008374 A JP 60008374A JP 837485 A JP837485 A JP 837485A JP H0546699 B2 JPH0546699 B2 JP H0546699B2
- Authority
- JP
- Japan
- Prior art keywords
- bonding
- wire
- wire bonding
- position recognition
- program
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000010586 diagram Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 230000004044 response Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01039—Yttrium [Y]
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60008374A JPS61168928A (ja) | 1985-01-22 | 1985-01-22 | ボンデイング装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60008374A JPS61168928A (ja) | 1985-01-22 | 1985-01-22 | ボンデイング装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61168928A JPS61168928A (ja) | 1986-07-30 |
| JPH0546699B2 true JPH0546699B2 (enrdf_load_stackoverflow) | 1993-07-14 |
Family
ID=11691453
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60008374A Granted JPS61168928A (ja) | 1985-01-22 | 1985-01-22 | ボンデイング装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61168928A (enrdf_load_stackoverflow) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2649805B2 (ja) * | 1987-06-29 | 1997-09-03 | 東芝メカトロニクス株式会社 | 半導体部品製造用ボンディング装置 |
-
1985
- 1985-01-22 JP JP60008374A patent/JPS61168928A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61168928A (ja) | 1986-07-30 |
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