JPH0546699B2 - - Google Patents

Description

[Detailed description of the invention] [Technical field of invention] The present invention relates to a bonding device.

[Technical background of the invention and its problems]

Bonding apparatuses such as die bonders, chip mounters, and wire bonders for dispensing processes, mounting processes, etc. are well known. In the actual process of these devices, a line is formed in which eight wire bonders correspond to one die bonder or chip mounter due to factors such as speed.

It is also necessary to automatically bond a wide variety of workpieces, such as printed circuit boards.
For example, in wire bonders, high speed and ultra-accuracy are required, so the conventional measures shown in FIG. 5 have been taken. That is, regarding the printed circuit 41, A,
In order to wire bond the three types B and C, each wire bonder 42, 43, 44 is used.
For each circuit board, floppy disks 45, 46, and 47 are prepared, into which reference signals for position recognition, such as a program for calculating the origin, are input.
When wire bonding is performed, the floppy disk corresponding to the type of workpiece is replaced each time. However, in an actual production line, there are many different types of workpieces, and it is necessary not only to have a program that corresponds to the type of workpiece, but also a program that corresponds to each wire bonder. Memorized floppy disks are frequently replaced.

The time required for replacement work is also undesirable from a productivity standpoint, and each time a new product is introduced, it is necessary to create a correction program that corresponds to the workpiece type and the wire bonder in question. Improvements were desired. .

Particularly in an actual mounting line where eight wire bonders are arranged in parallel on one mounter, eight wire bonders are used for one product, so it is necessary to create a program suitable for each of the eight bonders.

[Purpose of the invention]

This invention was made in response to the above points,
To provide a bonding device that uses a replaceable storage device containing a program compatible with the type of workpiece and common to other devices only when the type of workpiece changes.

[Summary of the invention]

In other words, in a device that performs bonding by position recognition by comparing the output of an image of the bonding position of the workpiece with pre-stored standard data, the reference signal for the position recognition is calculated and corrected, and then based on this reference signal. The present invention provides a bonding device provided with the above-mentioned position recognition mechanism.

[Embodiments of the invention]

Next, an embodiment in which the device of the present invention is applied to a wire bonding device will be described with reference to the drawings.

FIG. 1 shows a case where a workpiece, for example a printed circuit board 1, is wire bonded using three wire bonding apparatuses 2, 3, and 4. As is clear from comparing this figure with Fig. 5, printed circuit board 1
A floppy disk 5 in which programs corresponding to each type A, B, and C are stored can be commonly used for each wire bonding device 2, 3, and 4. In other words, which wire bonding device 2,
3 and 4 can be used in common. In this way, the following mechanism is built into each wire bonding device 2, 3, 4 so that each wire bonding device 2, 3, 4 can be used in common. Each wire bonding device 2, 3, 4 has a different reference signal for each device operation. This reference signal is, for example, origin position information for position recognition in the wire bonding apparatus. The origin position information is obtained by moving the bonding tools 6, 7, and 8 to the bonding position in sequence according to the program.
This is origin information for driving in the Z-axis direction to move the XY tables 9, 10, 11 and bonding tools 6, 7, 8 in the vertical direction above the bonding position. This origin information is used for each wire bonding device 2, 3, 4.
Since each wire bonding device 2, 3, and 4 is slightly different, the content that has been calculated in advance for each wire bonding device 2, 3, and 4 and corrected so that the origin information of each wire bonding device 2, 3, and 4 is the same is used for each wire bonding device 2, 3, and 4. It is built into memory 3 and 4.

This origin information correction means is executed as follows. That is, the reference origin data 21 is stored in a memory in advance, and the stored content is compared and verified 23 with the origin information 22 of the bonding tool of the wire bonding apparatus to detect the amount of deviation 24, and a value at which this amount of deviation is minimized is determined. is stored in the memory as a correction program 25. This correction program above XYZ
This information is stored in each wire bonding device 2, 3, and 4 in advance as origin information.

This correction program 25 is installed in the control device 31 of the wire bonding apparatuses 2, 3, and 4 shown in FIG.
By running the bonding program from the floppy disk, the controlled systems 33 such as the XY table and bonding head can be accurately driven. That is, when wire bonding to the printed circuit board 1, the bonding position can be recognized by
When bonding is performed by comparing the imaging output from the ITV camera with pre-stored standard data and recognizing the position, first run the above correction program as shown in FIG. 4, (Step A) calculate the standard signal, Measured with Z-axis displacement sensor (Step B)
Compare the measured value with the Z-axis standard height (Step C)
The amount of deviation is calculated, the amount of deviation is corrected using the reference signal (step D), the position is recognized, and the position is treated as a position control signal.

By incorporating a correction program into each machine in this way, you can simply create a dedicated program for each control circuit board, and copy this onto a floppy disk for the number of wire bonding devices, which improves work efficiency. Significantly improved.

〔Effect of the invention〕

As explained above, according to the apparatus of the present invention, bonding can be performed commonly on all machines simply by creating a dedicated program for each type of workpiece. In the above embodiment, an example has been described in which the present invention is applied to a wire bonding apparatus, but the present invention can also be applied to position recognition of a day super panther head and a mount head of a die bonder chip mounter in the case of a bonding apparatus.

[Brief explanation of the drawing]

Fig. 1 is a configuration diagram for explaining an embodiment of the device of the present invention, Fig. 2 is an explanatory diagram of the correction program of Fig. 1, Fig. 3 is an explanatory diagram of a control system using Fig. 2, and Fig. 4 FIG. 3 is a flowchart for explaining correction by control, and FIG. 5 is an explanatory diagram of a production line of a conventional wire bonding apparatus. 1... Circuit board, 5... Floppy disk,
2, 3, 4...Wire bonding equipment.

Claims (1)

[Claims] 1. In a device that performs bonding by position recognition by comparing the output of an image of the bonding position of the workpiece with pre-stored standard data, after calculating and correcting the reference signal for position recognition, A bonding device comprising the above-mentioned position recognition mechanism based on the reference signal. 2. The bonding apparatus according to claim 1, wherein the reference signal for position recognition is an origin for position recognition. 3. The bonding device according to claim 1, wherein the bonding device is a wire bonding device.