JPH0343124A - Manufacture system - Google Patents

Abstract

PURPOSE:To eliminate a tooling change in a multi-line production process by entering a code in a lead frame, providing a code reading device to a succeeding line, and making a system a mechanism conducting the selection and processing of parts based on the entering and providing above mentioned. CONSTITUTION:An optional lead frame is drawn out by the command of a host computer 3, and the specification of a product produced hereafter is coded to be marked in the lead frame with a laser marker 2. The said code is read with a read part 5, required IC designated by the code is taken out from the IC stocker 6 of diamond touch m1c 4, and diamond touch is made on the lead frame by diamond touch m1c. The condition of wire bonding is set by auto wire bonding m1c 8 based on the reading of a read part 9. A required mold type is selected with a transfer mold m1c 14 based on the read of a read part 11, a required item is marked based on a read part 17 in a laser marker 16.

Description

[Detailed description of the invention]

[Industrial Application Field 1] The present invention relates to a manufacturing system that combines a plurality of parts. 2. Description of the Related Art As an example of a conventional manufacturing system, an example of a crystal oscillator manufacturing system will be described. Before the explanation, an example of the structure of a crystal oscillator will be explained with reference to FIG. , an IC 105 is fixed to the land 103 by a method such as die attachment, and wire-bonded with a gold wire 106. A crystal resonator 107 is fixed to the crystal resonator fixing part 104 by welding, soldering, etc., and it is possible to generate one oscillation. After the IC 105 and the crystal resonator 107 are fixed, a resin 108 is covered by a method such as transfer molding, and the crystal oscillator is completed. By the way, the crystal oscillator 107 used in the crystal oscillator has five different oscillation frequencies, and the IC 105 is also suitable for combining crystal oscillators 107 with optimal oscillation conditions and those with different output formats. Since it comes in other shapes, there are also multiple types. Also, lead frame lO1 etc., surface mount type,
There are a plurality of standard shapes, etc., and the outer shape of the resin 108 also has several types. FIG. 4 shows a conventional crystal oscillator manufacturing system, in which a plurality of lead frame lots are set in a lead frame stocker 110 and sent to a die attach m/clll on which the next ICIO3 is mounted. After die attach, furnace 1 is used to harden the adhesive applied during die attach.
12 and then auto wire bonding m/c
The zero-order lead frame bonded by l13 is sent to crystal welding m/cl14, where a crystal resonator 107 is welded. After resin molding is performed by a transfer mold m/cl 15 connected below, the next printing paper 116 is printed on the resin surface. The above manufacturing systems include lead frames, crystal resonators,
It can only work when the ICs are of the same shape, and if they manufacture different crystal oscillators, die attach m/c
, auto wire bonding m/c, transfer mold crystal welding m/c, crystal welding machine, etc. require tooling changes.

[Problems to be Solved by the Invention] However, in the conventional manufacturing system, when making a topographical crystal oscillator, the tooling has to be changed, which is not suitable for multi-model production, and it is not possible to manufacture when the tooling is changed. The problem is that production numbers will decrease. M/C) problems arise, such as errors in setting when supplying raw materials, resulting in products with different parts. Furthermore, when changing models, conventionally, all work-in-progress items in the manufacturing system had to be removed before the switch could be made. The present invention has been made to solve the above problems, and its purpose is to provide a manufacturing system that can produce multiple models without changing tooling.

[Means to solve the problem]

The manufacturing system of the present invention has a code reading unit in each of the steps of writing a code on the support material that is the base of the product and the subsequent parts mounting process, and selects and supplies parts based on the read code. It is characterized by setting processing conditions. [Example] As an example of the manufacturing system of the present invention, an example of a manufacturing system for a crystal oscillator will be explained with reference to FIG. 1. The configuration of the crystal oscillator used in this example is the same as that described in the conventional example. . l is a lead frame stocker as a support material,
A plurality of lead frames of one type or several types are each stocked. Reference numeral 2 is a laser marker, which pulls out an arbitrary lead frame in response to a command from the host computer 3, codes the specifications of an oscillator that will be made using that lead frame in the future, and uses a laser to mark the margins of the lead frame (for example, the lead frame This is a device for marking the joints, etc.). 4 is die attach m
/c, the code of the lead frame marked with the previous code is read by the reading section 5, and the I of the die attach m/c4 is read.
Necessary IC specified by code from C stocker 6
is taken out and die-attached onto the lead frame. In addition, with die attach M/C 4, the die attach position differs depending on the type of lead frame, so it is necessary to position it at the optimal position and control the amount of adhesive applied by commands by code depending on the width feed pitch of the lead frame, etc. It also has a mechanism to 7 is a heating furnace for drying the adhesive used in die attachment in a curing furnace. A code reader and a temperature controller are linked so that the drying state (m degree temperature and time) can be set using a code if necessary. Reference numeral 8 is an auto wire bonding m/c, which has a mechanism that allows a code reading section 9 of the lead frame to read a code and set wire bonding conditions based on the command. This makes it possible to accommodate differences in IC shape, bonding, bonding position, and frame shape (frame width, length, pitch, IC position, etc.) and number of ICs of different models. 1O is a crystal welding machine, which has a mechanism that reads the code of the lead frame with a code reading unit 11, and supplies the necessary crystal oscillator from a stocker 12 stocked on a reel or the like to which the crystal oscillator is taped, Welding the crystal oscillator. During welding, it has a mechanism to control the welding position, pressure, welding power, and time, and also has a mechanism that can vary the width, length, thickness, and pitch of the lead frame for transportation. Reference numeral 13 denotes an appearance inspection machine, which inspects inspection items based on codes using a pattern recognition device or the like. Reference numeral 14 designates a transfer mold m/c, which is equipped with a lead frame code reading section 15 at the entrance, and is comprised of a heating mechanism, a pressurizing mechanism, etc., which selects a necessary mold type based on the read code, and performs resin transfer molding. . Mold conditions include molding force, transfer pressure, transfer speed, temperature (mold and tablet), etc., and there is a variable mechanism for these. Reference numeral 16 denotes a laser marker, which consists of a laser device and a controller that mark the product number, oscillation frequency, manufacturing date, manufacturer name, etc. on the resin surface using the code read by the code reading section 17 of the lead frame. 18 is a stocker, which is a part that collects, delivers, and tallies products. In addition to sending commands to mark codes on the lead frame, the host computer 3 exchanges data with each subsequent m/c, and determines the number of oscillators to be manufactured and the manufacturing status 1.
Understand quality status, machine operating status, etc. In this example, marking is performed using a laser, but the present invention is not limited to this, and other marking methods such as printing, pressing, etching, engraving, and engraving may be used. Next, an example of marking on a lead frame will be explained with reference to FIG. 2. Code 17 is an example of one person and is "rA12,000B", where A represents the type of product, 12.000 represents the oscillation frequency, and B represents the frequency accuracy. The code read by each m/c's reading device is sent as is to the computer built in each m/c'. The computer has m/c that corresponds to each code.
Data for different processing conditions is stored. Based on the sent code, the computer selects machining conditions for each m/c, and immediately applies that data to each m/c.
Transfer data to /c. Each m/c has a mechanism in which the processing conditions of the product are programmed based on the sent data, and is configured to start processing. In addition, if a buffer 19 is provided between each m/c, each m/c
/C Since work-in-progress from the previous process is stocked in the event of a problem, it is better to install it as necessary. It is also effective for maintaining line balance. Although the manufacturing system of the present invention has been described above using the crystal oscillator manufacturing system as an example, the present invention is not limited thereto, and can be applied to other products such as hybrid ICs, home appliances,
It can be used in manufacturing systems for products such as TVs, radios, watches, etc. that have many variations in one product. [Effects of the Invention] According to the present invention described above, the code of the product to be manufactured is written on the lead frame, the specifications of the same part are written, and in the subsequent lines, the m/c of each of the 5 processes is
In order to have a mechanism that reads the code, selects parts, positions parts, and sets conditions for the process according to the code, the lead frame itself becomes the process command and the manufacturing progresses. have an effect. 1) A wide variety of products can be manufactured. 2) Since the product itself has a command code, there are no errors when filling out slips. 3) No unnecessary inventory is generated during the process. 4) The occurrence of defective parts combinations during m/c troubles is reduced. 5) There is no tooling loss because tooling can be done instantly when changing product types. 6) Since the command code is written on the product itself, it is easy to interrupt or cancel plan changes.

[Brief explanation of drawings]

FIG. 1 is a configuration diagram of a crystal oscillator manufacturing system of the present invention,
FIG. 2 is an explanatory diagram of the marking of the lead frame of the present invention,
FIG. 3 is a block diagram of a conventional crystal oscillator, and FIG. 4 is a block diagram of a conventional crystal oscillator manufacturing system. l ・ 2 ・ 3 ・ 4 ・ 5 ・ 6 ・ 7 ・ 8 ・ 9 ・ l 0 ・ 11 ・ l 2 ・ l 3 ・ ・Lead frame stocker・Laser marker・Host computer・Die attach m/c ・Reader・IC Stocker, cure furnace, auto wire bonding m/c, code reading unit, crystal welding machine, code reading unit, stocker, appearance inspection machine, transfer mold m/c, code reading unit, laser marker, code reading unit, stocker, buffer that's all

Claims (1)

[Claims] 1) In the step of writing a code on the support material that is the base of the product, and in the subsequent parts mounting process, a code reading section is provided, and parts are selectively loaded based on the read code. A manufacturing system characterized by setting material processing conditions. 2) The manufacturing system according to claim 1, wherein the supporting material is a lead frame.