JPH11253860A - Pattern forming device and method therefor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To drastically shorten a process and to save materials by detecting the pattern position already written on a substrate, aligning a head and discharging a writing resin from the head by the position of the substrate while moving the substrate within a plane parallel with the head, thereby having the arbitrary patterns written. SOLUTION: When the pattern is already written on the substrate 1 after the distance alignment between the head and the substrate, an X-Y stage 6 is moved to an alignment detection position and the alignment detection between the already written part and the head is executed by an alignment detector 4. The alignment is then executed by an actuator for θ driving on an θ-Z-tilt state 7. The actuator is thereafter moved to a writing start position by the X-Y stage 6 and the arbitrary patterns are written while the writing head 2 is subjected to the control of the discharge position and the discharge nozzle by a discharge control section 70. As a result, the drastic process shortening and material saving are made possible.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to an apparatus and a method for forming a pattern on a semiconductor wafer, a liquid crystal substrate or a printed circuit board.

[0002]

2. Description of the Related Art Conventional semiconductor integrated circuit and liquid crystal substrates are manufactured by a resist coating (mainly spin coating), prebaking,
The steps of aligning with the mask, exposing, developing, post-baking, etching and removing unnecessary resist are repeated.

[0003] In this method, since the resist is applied by spin coating, a large amount of waste resist is generated, and there are problems such as an increase in cost and consideration for the environment. In addition, it is necessary to prepare a mask corresponding to each repetition of the process, and from this point of view, there are problems such as an increase in cost and a decrease in yield due to the large number of processes.

In order to make up for these disadvantages, Japanese Patent Publication No. 5-1
0817 and JP-A-7-219236.

[0005]

However, in the conventional example described in Japanese Patent Publication No. 5-10817, an orifice is used instead of spin coating, so that the amount of waste resist at the coating stage can be greatly reduced. The problem that a mask is required every time the process is repeated and the cost is increased, and a highly accurate alignment mechanism between the mask and the pattern is required is not solved. Further, since unnecessary portions are removed by etching or the like after pattern drawing, waste materials are not reduced but are not eliminated.

Japanese Patent Application Laid-Open No. 7-219236 describes a method of drawing a pattern by an ink jet method, but discloses a specific method for actually manufacturing semiconductors, liquid crystals, and the like. Absent.

SUMMARY OF THE INVENTION An object of the present invention is to provide an inexpensive and highly accurate apparatus and method for manufacturing a semiconductor, a liquid crystal substrate, a printed circuit board, and the like while solving the disadvantages of the conventional method.

[0008]

According to the present invention, in order to achieve the above object, in order to draw a pattern on a substrate, a distance and a tilt between a head having a plurality of drawing nozzles and the substrate are measured. Based on the measurement results, the position of the substrate is controlled so that the distance and inclination between the substrate and the head are constant, the pattern position already drawn on the substrate is detected, the head is aligned based on the detection result, and the substrate is moved to the head. While moving in a plane parallel to the substrate, the drawing resin is discharged from the head depending on the position of the substrate to draw an arbitrary pattern.

As a result, an arbitrary pattern can be drawn,
High-precision drawing is possible, high-precision drawing is not affected by the flatness of the substrate because the inclination between the substrate and the head is constant, and high-precision pattern superposition is possible.
In the case of drawing another pattern, it is only necessary to change the pattern to be drawn on the head, and effects such as inexpensiveness without the need for a mask or the like and easy pattern configuration can be obtained.

According to the present invention, in particular, by using a photosensitive resist as a discharge material (pattern forming material),
It can be applied to the manufacture of semiconductors, liquid crystal substrates and the like. In addition, by using a light-curing or thermosetting resin as the ejection material, it can be applied to optical shaping. In addition, 2
By using a liquid-mixing type resin, it can be applied to flat and three-dimensional modeling.

In the present invention, it is preferable to prepare a head for each material in order to draw a plurality of materials. This enables high-precision drawing with a simple configuration,
Even if the drawing material changes, it is only necessary to replace the head, and it is not necessary to change the apparatus configuration, and it is possible to perform inexpensive and highly accurate pattern drawing. As the substrate, a silicon wafer, a transparent glass substrate, or a printed circuit board material can be used. Therefore, a semiconductor, a liquid crystal substrate, a printed circuit board, and the like can be manufactured.

Japanese Patent Application Laid-Open No. 7-219236 describes a method of drawing a pattern by an ink jet method. However, it is necessary to go through a plurality of steps in order to manufacture a semiconductor, a liquid crystal and the like. There is a problem that a process for actually manufacturing such as positioning with a pattern already drawn and drawing a plurality of materials is not considered.

[0013]

Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is an overall view of a drawing apparatus according to one embodiment of the present invention. In the drawing, 1 is a drawing substrate, 2 is a drawing head unit, 3 (31 to 33) is a distance measuring device between head substrates, 4 is an alignment detecting device in a plane between the head and the substrate, 5 is a head unit cleaning device. , 6 is a moving stage in the XY plane, 7 is a θ-Z-tilt moving stage, and 9 is a substrate transfer robot.

FIG. 2 is a detailed view of the stages 6 and 7 in FIG. In the figure, 8 (81 to 83) is Z-
This is a tilt drive actuator. FIG. 3 shows a control system of the apparatus of FIG. 3, reference numeral 100 denotes the entire drawing apparatus; 58, a controller for controlling the entire operation of the manufacturing apparatus 100; 65, an interface for transferring data to and from the teaching pendant 59; 66, a CPU for controlling the drawing apparatus 100; ROM storing a control program for operating the
68 is a RAM that stores production information and the like, 70 is an ejection control unit that controls ejection, and 71 is a control unit that controls operations of the XY stage 6 and the θ-Z-tilt movement stage 7 of the drawing apparatus 100.

FIG. 4 shows a drawing sequence in the apparatus shown in FIG. Hereinafter, the operation of the drawing apparatus shown in FIGS. 1 to 3 will be described with reference to FIG. In the above configuration, the drawing substrate 1 is mounted on the θ-Z-tilt stage 7 by the substrate transfer robot 9. After mounting the substrate, the stage operation controller 71
The XY stage 6 is moved to the distance measurement position between the head and the substrate by using the distance measuring devices 31 to 33, the distance between the head and the substrate is measured, and the Z on the θ-Z-tilt stage 7 is measured.
-The distance between the head and the substrate is adjusted by the tilt driving actuators 81 to 83 so as to have a predetermined value. In addition,
In this embodiment, the distance between the substrate and the head is adjusted to the substrate mounting location. However, the distance measurement and the alignment may be performed in real time during drawing.

After the distance between the head and the substrate is adjusted, if a pattern has already been drawn on the substrate 1, the XY stage 6
Is moved to the alignment detection position, alignment detection between the already drawn pattern and the head is performed by the alignment detection device 4, and alignment is performed by the θ driving actuator (not shown) on the θ-Z-tilt stage 7. After the alignment, the XY stage 6 is moved to the drawing start position, and the discharge control unit 7 is
With 0, drawing is performed while controlling the discharge position and the discharge nozzle. After the drawing, the XY stage 6 moves the substrate to the substrate carry-out position, discharges the drawn substrate, and mounts a new substrate. During the substrate replacement, the drawing head unit 2 is cleaned by the head unit cleaning device 5. The drawn substrate proceeds to the next step, and the drawing is repeated a required number of times to produce a semiconductor, a liquid crystal substrate, a printed board, or the like.

The features of this configuration are that the process is significantly shortened and the cost is reduced as compared with the conventional manufacturing method (FIG. 5), the cost is reduced without using a mask, and the pattern can be easily changed. There is an advantage in that the process does not require etching and unnecessary resist removal processes, thereby shortening the process and reducing costs. In addition, there is no need to dispose of waste materials after removing unnecessary resists, and the effect on the environment is also advantageous.

Further, as compared with spin coating, a large amount of material can be saved and the cost can be reduced.
There is no material wraparound, which is advantageous from the problem of dust. Also, it is easy to increase the size (in spin coating, the speed difference between the center and the periphery increases as the size increases, and uniform coating can be achieved). It becomes difficult).

[0019]

As described above, according to the present invention, the process can be greatly reduced, the material can be saved and the cost can be reduced, the cost can be reduced without using a mask, and the pattern can be easily changed. There is no need to dispose of waste materials after removing unnecessary resist, and it has an advantageous effect on the environment.It is also advantageous from the problem of dust because there is no material behind, and it is easy to increase the size. There is.

[Brief description of the drawings]

FIG. 1 is an overall view of a drawing apparatus according to an embodiment of the present invention.

FIG. 2 is a detailed view of stages 6 and 7 in FIG.

FIG. 3 is a block diagram showing a control system of the apparatus of FIG.

FIG. 4 is a flowchart showing a drawing sequence in the apparatus of FIG. 1;

FIG. 5 is a flowchart showing a conventional semiconductor manufacturing sequence.

[Explanation of symbols]

1: substrate, 2: drawing head unit, 3 (31-33)
: Z-tilt detecting device between head substrates, 4: head
Alignment detection device between substrates, 5: head unit cleaning device, 6: XY plane moving stage, 7: θ-Z-tilt stage, 8 (81-83): Z-tilt drive actuator, 9: substrate transfer Robot 58, a controller for controlling the overall operation of the manufacturing apparatus 100; 65, an interface for transferring data to and from the teaching pendant 59; 66, a CPU for controlling the drawing apparatus 100; 67, a control program for operating the CPU 66; ROM stored therein, 68: RAM for storing production information, etc., 70: discharge control unit for controlling discharge, 7
1: a control unit for controlling the operations of the XY stage 6 and the θ-Z-tilt stage 7 of the drawing apparatus 100; 100: the whole drawing apparatus.

──────────────────────────────────────────────────続 き Continued on front page (51) Int.Cl. ⁶ Identification code FI // G03F 7/16 501 H01L 21/88 B

Claims (9)

[Claims] 1. A head provided with a plurality of nozzles for ejecting a pattern forming material at a position facing a substrate on which a pattern is formed, a detector for measuring a gap between the head and the substrate, and a substrate based on the measurement result. A mechanism for holding the relative posture of the head and the gap constant, and a method for measuring the relative position information of the substrate and the head in a plane parallel to the substrate surface while holding the substrate, and Measurement / control means for relatively moving the head; means for measuring the position of a pattern or reference mark drawn on the substrate; adjusting the position of the head with respect to the pattern or reference mark based on the measurement result And a means for creating pattern information. The pattern information is input to a discharge control unit of a head, and a pattern is formed from a head based on the relative position information. A pattern forming apparatus which discharges a pattern forming material to draw and form a desired pattern. 2. The pattern forming apparatus according to claim 1, further comprising means for aligning the head with an existing pattern or a reference mark on the substrate. 3. The pattern forming apparatus according to claim 1, wherein the pattern forming material is a photosensitive resist. 4. The method according to claim 1, wherein the pattern forming material is a photo-curing or thermosetting resin.
The pattern forming apparatus described in the above. 5. The pattern forming apparatus according to claim 1, wherein the liquid resin is a two-liquid type resin, and is ejected from different heads. 6. The pattern forming apparatus according to claim 1, wherein the number of the heads is equal to the number of materials to be written. 7. The pattern forming apparatus according to claim 1, wherein the substrate is a silicon wafer, a transparent glass substrate, or a printed circuit board. 8. A head having a plurality of nozzles for ejecting a liquid resin is disposed at a position facing a substrate on which a pattern is formed, and the head is measured by a detector for measuring a distance between the head and the substrate. Holding the substrate with a constant attitude and gap with respect to the head; moving the substrate in a plane parallel to the head while holding the substrate; In a pattern forming method of drawing and forming a pattern by ejecting a liquid resin from a head based on the position information of the moving body, for a substrate having no pattern, the liquid resin is moved from the head based on the position information of the moving body. To draw a pattern, align the head with an existing pattern or a reference mark existing on the Pattern forming method which is characterized in that the position information of drawing a pattern by ejecting liquid resin from the head. 9. A semiconductor integrated circuit, a liquid crystal substrate, or a printed circuit board manufactured by the method according to claim 7.