JP2005161245A - Film forming method, film forming apparatus, and element - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a film forming technique capable of improving the capability of an element provided with a film having a function on the surface of a substrate. <P>SOLUTION: The film forming method is employed for forming the thin film 13 on the surface of the substrate 1 by ejecting drops containing materials forming the film 13 toward the surface of the substrate 1 to make a solvent evaporate from a liquid film 7 formed on the surface of the substrate 1. According to the film forming method, when the solvent evaporated from the liquid film 7, an evaporation amount reducing means for reducing the amount of evaporation of the solvent at a peripheral edge portion 7a of the liquid film 7 is used, and when the solvent is evaporated from the liquid film 7, the liquid film 7 is heated with a heating source 9 positioned at the liquid film 7 side. The evaporation amount reducing means is positioned between the heating source 9 and the liquid film 7, and is a frame-like mask member 11 covering the peripheral edge portion 7a of the liquid film 7. Thereby, the reduction of the evaporation amount of the solvent at the peripheral edge portion 7a of the liquid film 7 controls the coffee stain phenomenon, and uniformizes the thickness of the film. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a technique for forming a film having functionality on a surface of a substrate for forming an image display element, a semiconductor element, or the like.

  As a method for forming a resist film such as a semiconductor or a liquid crystal display, an alignment film such as a liquid crystal display, or a film serving as a color filter on a flat substrate surface, a spin coating method is used for a resist film such as a semiconductor or liquid crystal display. A flexographic printing method is used for an alignment film of a liquid crystal display. In these film forming methods, among the materials used for forming the film, since the rate of the material that actually becomes the film, that is, the utilization rate of the material is low, development of a new film forming method is desired.

  On the other hand, as a film forming method for forming a film on the bottom surface of each of a plurality of holes surrounded by a bank formed on a substrate, such as a polymer organic EL element, a film such as an inkjet method is used. There has been proposed a film forming method for forming a film by discharging droplets containing a material for forming a film toward a lower surface of a hole provided in a substrate (see, for example, Patent Document 1). In such a film forming method, a liquid droplet dissolved in a concentration of, for example, several percent in a material for forming a film is discharged from an inkjet nozzle or the like to land on the bottom surface of the substrate, and the solvent is evaporated. Create a membrane with The inkjet method is also attracting attention because the film can be finely and easily patterned.

  Therefore, such a film forming method is also applied to a film forming method for forming a film on a flat substrate surface such as a resist film such as a semiconductor or a liquid crystal display, an alignment film such as a liquid crystal display, or a film serving as a color filter. It is considered to apply.

  However, in a film formation method in which a film containing a material for forming a film is discharged onto the surface of the substrate to form the film on the surface of the substrate, it is difficult to control the film thickness, and a flat film with a uniform film thickness is formed. It is difficult to form. In other words, when a film is formed by landing droplets on a predetermined area of the surface of a flat substrate, even if the liquid film formed by the landed liquid droplets has a uniform thickness, When the solvent evaporates and dries, the film material, which is a solute dissolved in the solvent, accumulates at the periphery of the formed film, and the film thickness at the periphery of the film becomes thicker than other parts, There is a problem that a flat film is not formed.

  This is a phenomenon called “coffee ring” or “coffee stain”, and is a phenomenon that occurs when a droplet in which a solute is dissolved in a solvent is dried. That is, the amount of evaporation at the outer edge of the liquid film spread on the substrate, that is, the peripheral edge, is larger than that at other parts, so that the liquid flows toward the peripheral edge to compensate for it, and as a result, the peripheral edge rises after drying. This is a phenomenon in which a thick film is formed (see Non-Patent Document 1, for example).

  On the other hand, in the film forming method described in Patent Document 1, two types of liquid droplets having different concentrations of the solute, that is, the material forming the film are divided into two portions and formed on the substrate. We are trying to make the thickness of the film uniform. In this film forming method, a droplet having a predetermined concentration is first landed on the substrate, and then a liquid film formed by the first landed droplet is equal to or lower than the concentration of the initially landed droplet. It ’s landing on the top. In many paints, materials that do not cause such a coffee stain phenomenon are selected and commercialized. For example, since the ink is mixed with glue, it gels with drying, and the liquid is difficult to move, and the coffee stain phenomenon hardly occurs.

Japanese Patent Laid-Open No. 2001-291583 (page 3, FIG. 1-5) NATURE, 389, 1997, p.827

  Incidentally, in an element such as a semiconductor element provided with a film having a function on the surface of a substrate or an image element of a liquid crystal display, it is necessary to flatten the film to be formed in order to improve the performance of the element. For this reason, in order to make the film as flat as possible, a film forming method as in Patent Document 1 has been proposed. However, in the film forming method described in Patent Document 1, the liquid film formed in the first time and the liquid formed in the second time are formed because the film is formed by landing droplets in two times. Since the film is not mixed with each other, an interface is easily generated between the films formed by the respective droplets. When an interface is formed between the formed films, the device performance is deteriorated due to the interface even though the film is being flattened to improve the element performance. End up. Also, letting the liquid gel when it dries and the droplets contain components that make it difficult for the liquid to move, so that the film can be made to contain impurities, thereby flattening the film and improving device performance. In spite of this, the performance of the device may not be improved.

  The subject of this invention is improving the performance of the element which provided the film | membrane which has a function in the surface of a board | substrate.

  The film forming method of the present invention evaporates the solvent from the liquid film formed on the surface of the substrate by ejecting droplets containing the material forming the film toward the surface of the substrate, and the film is formed on the surface of the substrate. When the solvent is evaporated from the liquid film, the above problem is solved by using an evaporation amount reducing means for reducing the evaporation amount of the solvent at the peripheral edge of the liquid film.

  Then, when evaporating the solvent from the liquid film, heat is applied to the liquid film by a heat source located on the liquid film side, and the evaporation amount reducing means is located between the heat source and the liquid film, and the periphery of the liquid film The film forming method is a frame-like mask member that covers the portion. As a result, the peripheral portion of the liquid film becomes difficult to be heated and the evaporation amount of the solvent is reduced, so that the evaporation amount with other portions is made uniform and the thickness of the formed film is made uniform. Therefore, it is possible to equalize the thickness of the formed film without landing the component in two steps, and without including the component that makes the liquid difficult to move, so that the interface is difficult to occur, and impurities Since it is not included, the performance of the element provided with a functional film on the surface of the substrate can be improved.

  Further, the evaporation amount reducing means is a film forming method which is provided in the surface portion of the substrate corresponding to the peripheral portion of the liquid film, and is a liquid processing unit which has been subjected to liquid processing to repel droplets. As a result, the contact angle between the periphery of the liquid film and the surface of the substrate is increased, and the amount of evaporation of the solvent at the periphery of the liquid film is reduced, so that the evaporation amount with other parts is made uniform. The thickness of the film is made uniform. Therefore, it is possible to equalize the thickness of the formed film without landing the component in two steps, and without including a component that makes it difficult for the liquid to move. Since the film does not contain impurities, the performance of an element provided with a film having a function on the surface of the substrate can be improved.

  Furthermore, if the film forming method is such that the contact angle between the liquid film and the surface of the substrate is 90 degrees or more by the liquid-treatment part, the thickness can be made more uniform.

  Further, the evaporation amount reducing means is a film forming method which is a groove formed in a frame shape on the surface portion of the substrate corresponding to the peripheral portion of the liquid film. As a result, when the peripheral edge of the liquid film is located in the groove, the evaporated solvent stays in the groove, the vapor density of the space in the groove increases, and the amount of solvent evaporation at the peripheral edge of the liquid film increases. In order to reduce, the amount of evaporation with other parts is made uniform, and the thickness of the formed film is made uniform. Therefore, it is possible to equalize the thickness of the formed film without landing the component in two steps, and without including the component that makes the liquid difficult to move, so that the interface is difficult to occur, and impurities Since it is not included, the performance of the element provided with a functional film on the surface of the substrate can be improved.

  Furthermore, it is a film forming apparatus for forming a film on the surface of the substrate, and this liquid is formed on the liquid film formed on the surface of the substrate by droplets containing a material that forms the film discharged toward the surface of the substrate. A heat source that applies heat from the film side, and a frame-shaped mask member that is positioned between the heat source and a liquid film formed on the surface of the substrate and covers a peripheral portion of the liquid film formed on the surface of the substrate The film forming apparatus having the above configuration is used. If the film forming apparatus having such a configuration is used, the peripheral portion of the liquid film is not easily heated by the mask member, and the amount of evaporation of the solvent is reduced, so that the amount of evaporation with other portions is made uniform and formed. Is made uniform. Therefore, it is possible to equalize the thickness of the formed film without landing the component in two steps, and without including the component that makes the liquid difficult to move, so that the interface is difficult to occur, and impurities Since it is not included, the performance of the element provided with a functional film on the surface of the substrate can be improved.

  Further, the element is provided with a film having a function on the surface of the substrate, and the substrate is a film that is landed on the substrate in order to form a film on a portion corresponding to the peripheral portion of the film on the surface on which the film is formed. The element is configured to have a soot treatment portion that has been subjected to a soot treatment that repels droplets containing a material that forms the material. Further, the element is provided with a film having a function on the surface of the substrate, and the substrate is an element having a groove in a portion corresponding to the peripheral portion of the film on the surface on which the film is formed. In the case of an element having such a configuration, the film thickness is made uniform, so that the performance can be improved.

  ADVANTAGE OF THE INVENTION According to this invention, the performance of the element which provided the film | membrane which has a function on the surface of a board | substrate can be improved.

  A first embodiment of a film forming technique to which the present invention is applied will be described below with reference to FIGS. FIG. 1 is a cross-sectional view schematically showing a state in which droplets are landed on a substrate by an ink jet nozzle in a film forming method to which the present invention is applied. FIG. 2 is a cross-sectional view schematically showing a state in which a liquid film is formed on a substrate by droplets that have landed on the substrate in a film forming method to which the present invention is applied. FIG. 3 shows a film forming method to which the present invention is applied, and a film is formed by evaporating the solvent of the liquid film formed on the substrate using a film forming apparatus having a light source as a heat source and a mask member. It is sectional drawing which shows typically the state which is. FIG. 4 is an arrow view from the line IV-IV in FIG.

  In the film forming method of this embodiment, first, as shown in FIG. 1, a liquid (hereinafter referred to as an ink composition) formed by dissolving or dispersing a material for forming a film as a solute in a solvent by an ink jet is used as a substrate. A liquid film forming step of forming a liquid film on the surface of the substrate 1 by the droplets 3 discharged and landed on the surface of the substrate 1 is performed. In the liquid film forming step, each of the ink composition droplets 5 is ejected from the inkjet head 5 provided with a plurality of nozzles 5 a toward the surface of the substrate 1 and dropped onto the surface of the substrate 1. The amount of ink composition discharged from the inkjet nozzle 5a, that is, the amount of droplets, can be adjusted in the range of several pL to several hundred pL, for example, depending on the diameter of the nozzle 5a and the design of the pressure pulse.

  The surface of the substrate 1 is processed and adjusted so as to improve the wettability with respect to the ink composition in order to make the landed droplets 5 easier to spread. As shown in FIG. 2, the liquid droplets 7 that spread on the surface of the substrate 1 and that have landed adjacent to each other merge to form a liquid film 7 that covers almost the entire surface of the substrate 1. Thus, after forming the liquid film 7 using an inkjet in a liquid film formation process, the drying process which evaporates a solvent from the formed liquid film 7 is performed.

  When the drying process is performed, the contact angle at the contact line with the substrate 1 at the outer peripheral portion of the liquid film 7, that is, the peripheral portion 7 a is processed so that the wettability of the surface of the substrate 1 to the ink composition is improved. Therefore, it is 90 degrees or less. The substrate 1 on which the liquid film 7 in such a state is formed is subjected to a drying process using a film forming apparatus, and the solvent in the liquid film 7 is evaporated and dried. As shown in FIG. 3, the film forming apparatus used in the drying process includes a light source 9 that irradiates light onto the surface of the substrate 1 on which the liquid film 7 is formed, and a mask member positioned between the light source 9 and the substrate 1. 11.

  The light source 9 of the present embodiment has a plurality of lamps 9a, and irradiates the entire surface of the substrate 1 on which the liquid film 7 is formed to heat the liquid film 7. In addition, the light source 9 covers a portion of the lamp 9a in a direction other than the necessary light irradiation direction as in the present embodiment, and has directivity and directivity in the light irradiation direction including a reflection plate 9b that reflects the light. It is possible to improve the irradiation efficiency of light, that is, the evaporation efficiency of the solvent from the liquid film 7 by using the liquid crystal having the above. As shown in FIGS. 3 and 4, the mask member 11 has a flat frame shape having a shielding portion 11 a that shields light, that is, heat, in a shape corresponding to the peripheral portion 7 a of the liquid film 7 formed on the surface of the substrate 1. The shielding part 11a is a material that does not transmit light, and is formed of a material having heat insulation properties or a material having relatively low thermal conductivity. In this embodiment, since the element is formed using the rectangular substrate 1, the hole portion of the mask member 11, that is, the inner portion of the shielding portion 11 a has a rectangular shape corresponding to the shape of the substrate 1.

  In the drying process, by using such a film forming apparatus, the irradiation of light from the light source 9 to the peripheral portion 7a of the liquid film 7 formed on the substrate 1 is blocked, that is, the peripheral edge of the liquid film 7 The liquid film 7 formed on the substrate 1 is heated in a state where the radiant heat from the light source 9 to the part 7a is blocked. For this reason, the evaporation amount of the solvent at the peripheral portion 7a of the liquid film 7 is reduced as compared with the case where the mask member 11 is not provided, and the evaporation amount of the solvent at the peripheral portion 7a of the liquid film 7 is shielded by the mask member 11. The amount of evaporation of the solvent in other portions of the liquid film 7 that has not been made uniform. For this reason, the movement of the liquid due to the difference in the amount of evaporation of the solvent in the liquid film 7 does not occur, and as shown in FIG. 3, the solid film 13 having a uniform thickness is formed. Thus, in this embodiment, the mask member 11 serves as an evaporation amount reducing means for reducing the evaporation amount of the solvent at the peripheral portion 7a of the liquid film 7, and the light source 9 heats the liquid film 7 to This is a heat source for evaporating the solvent from the film 7.

  By the way, in the conventional film forming technique that does not use the mask member 11, as shown in FIG. 5, since there is no mask member 11, the liquid film 7 formed on the substrate 1 is entirely exposed to the lamp 9 a of the light source 9. , The entire liquid film 7 is heated. Therefore, at the peripheral edge 7a of the liquid film 7, as shown in FIG. 6, when the contact angle θ between the surface of the substrate 1 and the liquid film 7 is smaller than 90 degrees, the solvent at the peripheral edge 7a of the liquid film 7 Since the evaporation amount becomes larger than the evaporation amount of other portions of the liquid film 7, a coffee stain phenomenon occurs. That is, in the conventional film formation technique, in the drying process, the solute moves in the direction of the peripheral portion 7a of the liquid film 7 having a large evaporation amount and accumulates in the peripheral portion 7a. And as shown in FIG. 6, it becomes a film | membrane with an uneven thickness in which the protrusion 15a which swelled in the peripheral part was formed.

  As described above, the coffee stain phenomenon is caused when the contact angle between the surface of the substrate 1 and the liquid film 7 at the peripheral edge 7a of the liquid film 7 is smaller than 90 degrees, the evaporation rate at the peripheral edge 7a of the liquid film 7 is increased. As shown in FIG. 6, when the liquid is larger than the other portions, the liquid moves outward in the radial direction to compensate for the amount of the evaporated liquid. As a result, the solute accumulates at the peripheral edge portion 7a of the liquid film 7, and the liquid film 7 This is a phenomenon in which the portion corresponding to the peripheral portion 7a becomes a raised film shape after drying.

  On the other hand, in the film formation technique of the present embodiment, the peripheral portion 7 a of the liquid film 7 formed on the surface of the substrate 1 is blocked by the mask member 11 by landing the droplet 3 on the surface of the substrate 1. Thus, the light source 9 is irradiated with light and dried. For this reason, the evaporation rate of the peripheral portion 7a of the liquid film 7 shielded by the mask member 11 is smaller than other portions of the liquid film 7 that are not shielded, and the evaporation amount at the peripheral portion 7a of the liquid film 7 is reduced. Therefore, the occurrence of the coffee stain phenomenon can be suppressed. In this way, the droplets are landed in two steps, and the formed film thickness can be made uniform without including components that make it difficult for the liquid to move. Since the formed film does not include impurities, the performance of the element provided with a film having a function on the surface of the substrate can be improved.

  Furthermore, if it is set as image display elements, such as a semiconductor element which formed the resist film by the film formation technique of this embodiment, and the resist film, the alignment film, the film | membrane used as a color filter, etc., as each element In addition, the performance, electrical characteristics or optical characteristics of a semiconductor device or a liquid crystal display can be improved.

  Furthermore, in the film forming method in which the film is formed by landing the liquid droplets in two steps, it is necessary to change the concentration of the liquid droplets discharged from the inkjet nozzle, which makes the film forming operation complicated. In the embodiment, it is only necessary to discharge the liquid droplets to one region on the surface of the substrate, and it is not necessary to change the concentration or composition of the ink composition. The productivity of elements, image display elements, semiconductor devices, liquid crystal displays, and the like can be improved.

  In the present embodiment, the light source 9 is used as a heat source. However, as long as the heat source can heat the liquid film 7, a device that generates warm air can be used.

(Second Embodiment)
Hereinafter, a second embodiment of a film forming technique to which the present invention is applied will be described with reference to FIGS. FIG. 7 is a cross-sectional view schematically showing a state in which a film is formed by evaporating the solvent of the liquid film formed on the substrate provided with the liquid treatment unit in the film forming method to which the present invention is applied. It is. FIG. 8 is a diagram for explaining the relationship of the evaporation amount of the solvent in each part of the liquid film with respect to the contact angle between the surface of the substrate and the liquid film. In the present embodiment, the same components as those in the first embodiment are denoted by the same reference numerals and description thereof will be omitted, and differences and features from the first embodiment will be described.

  The film forming technique of the present embodiment is different from that of the first embodiment in that the mask member is not used as the evaporation amount reducing means for reducing the evaporation amount of the solvent at the peripheral portion of the liquid film, and the peripheral edge of the liquid film on the substrate. The liquid processing part which repels the ink composition is provided at a position corresponding to the part, and the liquid processing part provided on the substrate is used as the evaporation amount reducing means. That is, in this embodiment, as shown in FIG. 7, before performing the liquid film forming step and the drying step as described in the first embodiment, it corresponds to the peripheral portion 7a of the liquid film 7 of the substrate as a material. In the portion to be subjected to the above, a liquid crystal processing part forming step is carried out for producing a substrate 19 provided with a liquid crystal processing part 17 that has been subjected to a liquid crystal process that repels the ink composition that forms the liquid film 7. Therefore, the liquid-soaking process part 17 is provided in the frame shape along the peripheral part of the film | membrane which is going to form on the surface of the board | substrate 19, ie, the outer periphery shape.

  As an example of the liquid repellent treatment for forming the liquid treatment part 17 of the substrate 19 in the liquid treatment part formation step, when the solvent of the ink composition is aqueous, the liquid film 7 spreading on the surface of the substrate 19 is used. There is a method of coating a water repellent agent on a portion corresponding to the peripheral edge portion 7a. As the water repellent treatment agent, a water repellent effect can be easily obtained by using hydrocarbon wax or silicone. Furthermore, when the solvent of the ink composition is oily, a liquid repellent effect can be obtained even when the solvent is oily by using a fluorine compound such as polytetrafluoroethylene. In addition, by using a perfluoro-containing compound, it is possible to reduce the cost of the liquid-soaking treatment. In addition, a method such as surface activation of the surface of the substrate 19 by light irradiation may be used. For example, in the case of using a plasma treatment method using tetrafluoromethane, post-treatment is facilitated because the consumed material is a gas.

  As described in the first embodiment, the liquid film forming step is performed and the drying step is further performed using the substrate 19 that has been subjected to the liquid processing portion forming step for forming such a liquid processing portion 17. However, in the drying process, it is not necessary to use the mask member used in the first embodiment.

  Here, the relationship of the evaporation amount of the solvent of the liquid film 7 with respect to the contact angle θ between the surface of the substrate 1 and the peripheral edge portion 7a of the liquid film 7 in the same state as in the first embodiment in which the liquid treatment unit 17 is not provided. Is as shown in FIG. That is, the evaporation amount of the solvent at the peripheral portion 7a of the liquid film 7 is a function of the contact angle θ. Therefore, as shown in FIG. 8, in order to reliably reduce the evaporation amount of the solvent at the peripheral portion 7 a of the liquid film 7 to be equal to or less than the evaporation amount of each portion other than the peripheral portion 7 a of the liquid film 7, It is desirable that the contact angle of the liquid film 7 at the surface portion of the liquid-soaking unit 17 is 90 degrees or more.

  It should be noted that the surface portion of the substrate 19 other than the liquid-repellent processing unit 17 is such that the droplets of the plurality of ink compositions that have landed on the surface of the substrate 19 spread and easily form the liquid film 7. The contact angle is smaller than 90 degrees, that is, the wettability is improved.

  Also in the film forming technique of this embodiment, the contact angle θ between the peripheral edge 7a of the liquid film 7 and the surface of the substrate 19 is increased, and the amount of evaporation at the peripheral edge 7a of the liquid film 7 is reduced. The amount of evaporation with this portion is made uniform, and the thickness of the formed film 13 is made uniform. Therefore, as in the first embodiment, the performance of an element provided with a film having a function on the surface of the substrate can be improved.

  In FIG. 7, in order to easily understand the position of the liquid processing part 17, the liquid processing part 17 is drawn in a state of protruding from the surface of the substrate 19. However, in actuality, when the sessile liquid processing unit 17 is provided by the method illustrated in this embodiment, the smoky processing unit 17 hardly protrudes from the surface of the substrate 19 or cannot be visually confirmed even if it protrudes. It is about. However, as shown in FIG. 7, it is also possible to provide the soot processing part in a state of protruding from the surface of the substrate 19. For example, the liquid processing part 17 which protruded on the surface of the board | substrate 19 can also be formed by sticking the member which the surface has a liquid-liquid property on the surface of the board | substrate 19. In addition, the liquid processing unit 17 is removed by shaving and removing the liquid film 7 after the liquid film 7 is formed by drying the liquid film 7 in the case where the liquid film 7 protrudes from the surface of the substrate 19 or not. You can also

(Third embodiment)
Hereinafter, a third embodiment of a film forming technique to which the present invention is applied will be described with reference to FIGS. FIG. 9 is a cross-sectional view schematically showing a state of a liquid film formed on a substrate provided with a groove in a film forming method to which the present invention is applied. FIG. 10 is a plan view schematically showing a state of a liquid film formed on a substrate provided with a groove in a film forming method to which the present invention is applied. In the present embodiment, the same components and the like as those in the first and second embodiments are denoted by the same reference numerals, and the description thereof is omitted. Differences and features from the first and second embodiments are described. explain.

  The film forming technique of the present embodiment is different from the first and second embodiments in that the liquid solution provided on the mask member or the substrate as the evaporation amount reducing means for reducing the evaporation amount of the solvent at the peripheral portion of the liquid film. A groove is provided at a position corresponding to the peripheral edge of the liquid film on the substrate without using a processing unit or the like, and the groove formed on the substrate is used as an evaporation amount reducing means. That is, in this embodiment, as shown in FIGS. 9 and 10, before the liquid film forming process and the drying process as described in the first embodiment are performed, the peripheral portion of the liquid film 7 of the substrate as a material is used. A groove forming step for forming the substrate 23 by providing the groove 21 in the portion corresponding to 7a is performed. Therefore, the groove 21 is provided in a frame shape along the peripheral edge of the film to be formed on the surface of the substrate 23, that is, the outer periphery.

  Using the substrate 23 that has been subjected to the groove forming process for forming the groove 21 as described in the first embodiment, a liquid film forming process is performed, and a drying process is further performed. However, in the drying process, it is not necessary to use the mask member used in the first embodiment.

  The peripheral edge portion 7 a of the liquid film 7 formed in the liquid film forming step enters the groove 21. When the drying process is performed in this state, the space in the groove 21 is narrower than the open space other than in the groove 21, so that the vapor density of the solvent evaporated in the space in the groove 21 is increased, and the liquid film 7 evaporates at the peripheral edge 7a.

  As described above, even when the substrate 23 having the grooves 21 is used as in the present embodiment, the evaporated solvent stays in the grooves 21, the vapor density of the space in the grooves 21 increases, and the liquid film 7 Since the amount of evaporation of the solvent at the peripheral edge portion 7a is reduced, the performance of the element provided with a film having a function on the surface of the substrate can be improved as in the first and second embodiments. The amount of evaporation at the peripheral edge portion 7a of the liquid film 7 can be reduced.

  In addition, the groove | channel which a board | substrate forms can be formed in various cross-sectional shapes, such as rectangular shape and circular shape, not only V-shaped cross-sectional shape like this embodiment.

  In the second and third embodiments, the solvent can be evaporated by natural drying without using a heat source.

  Further, the present invention can be applied to manufacturing various elements in which a functional film is formed on a substrate.

It is sectional drawing which shows typically the state which made the droplet land on a board | substrate with the inkjet nozzle in the film formation method of 1st Embodiment formed by applying this invention. In the film formation method of a 1st embodiment formed by applying the present invention, it is a sectional view showing typically the state where the droplet which landed on the substrate formed the liquid film on the substrate. In the film forming method of the first embodiment to which the present invention is applied, a film is formed by evaporating the solvent of the liquid film formed on the substrate using a film forming apparatus including a light source serving as a heat source and a mask member. It is sectional drawing which shows the state currently formed typically. It is an arrow view from the IV-IV line of FIG. It is sectional drawing explaining the conventional film formation method. It is a figure explaining a coffee stain phenomenon, (a) is a figure which shows the evaporation amount of the solvent in each part which goes to a radial direction from the center of a liquid film when forming a circular liquid film, (b) These are sectional drawings which show the amount of evaporation of the solvent in each part of the liquid film and the shape of the solid film to be formed. In the film formation method of 2nd Embodiment formed by applying this invention, the state which forms the film | membrane by evaporating the solvent of the liquid film formed in the board | substrate which provided the liquid-treatment process part is shown typically. It is sectional drawing. It is a figure explaining the relationship of the evaporation amount of the solvent in each part of a liquid film with respect to the contact angle of the surface of a board | substrate, and a liquid film. It is sectional drawing which shows typically the state of the liquid film formed in the board | substrate provided with the groove | channel in the film | membrane formation method of 3rd Embodiment formed by applying this invention. It is a top view which shows typically the state of the liquid film formed in the board | substrate provided with the groove | channel in the film forming method of 3rd Embodiment formed by applying this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Board | substrate 7 Liquid film 7a The peripheral part of a liquid film 9 Light source 9a Lamp 11 Mask member 13 Solid film

Claims (7)

A film forming method for evaporating a solvent from a liquid film formed on a surface of the substrate by discharging droplets containing a material for forming the film toward the surface of the substrate to form a film on the surface of the substrate. ,
A film forming method using evaporation amount reducing means for reducing the evaporation amount of a solvent at a peripheral portion of the liquid film when the solvent is evaporated from the liquid film. When evaporating the solvent from the liquid film, heat is applied to the liquid film by a heat source located on the liquid film side, and the evaporation amount reducing means is located between the heat source and the liquid film. The film forming method according to claim 1, wherein the film forming method is a frame-shaped mask member that covers a peripheral portion of the film. The evaporation amount reducing means is a liquid processing unit provided on a surface portion of the substrate corresponding to a peripheral portion of the liquid film and subjected to liquid processing for repelling the droplets. 2. The film forming method according to 1. 2. The film forming method according to claim 1, wherein the evaporation amount reducing means is a groove formed in a frame shape on a surface portion of the substrate corresponding to a peripheral edge portion of the liquid film. A film forming apparatus for forming a film on a surface of a substrate, and the liquid film side of the liquid film formed on the surface of the substrate by droplets containing a material that forms the film discharged toward the surface of the substrate And a frame-shaped mask member that is positioned between the heat source and the liquid film formed on the surface of the substrate and covers the peripheral edge of the liquid film formed on the surface of the substrate. A film forming apparatus. An element in which a film having a function is provided on a surface of a substrate, the substrate landing on the substrate to form the film on a portion corresponding to a peripheral portion of the film on the surface on which the film is formed An element having a liquid treatment part subjected to a liquid repelling process for repelling a droplet containing a material for forming the film. An element in which a film having a function is provided on a surface of a substrate, wherein the substrate has a groove in a portion corresponding to a peripheral portion of the film on the surface on which the film is formed. .

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