JPH1126477A - Method and device for manufacturing semiconductor device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To suppress investment in facility in an assembly process for a semiconductor device by providing a control device for controlling operation of a plurality of working device. SOLUTION: Such assembly information as product specification, work supply condition, and work instruction is provided under instruction of a trunk computer through LAN for production assistance, allowing batch control from production development to shipping. Various assembly information is displayed on an operation panel 17 and a computer display part 18, which forms an operation panel 13 that is a control device for controlling various working devices. An operator 19 supplies members to a supply cleaning device 2, and performed such operation and monitoring at the operation panel 13 as controlling of work condition for each working device. A trunk LAN is connected to the operation panel 13, while the operation panel 13 displays such various technical information as regarding product's technical development and such various control information as regarding product's production control. The operation panel 13 supplies the assembly information for each working device.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to an apparatus and a method for manufacturing a semiconductor device, and more particularly to an apparatus and a method for manufacturing a semiconductor device in a process of assembling a semiconductor device in which a plurality of elements are mounted in one package. It is.

[0002]

2. Description of the Related Art FIG. 4 is an explanatory view schematically showing an arrangement of manufacturing apparatuses in a conventional semiconductor device assembling process.

[0003] The semiconductor device manufacturing apparatus constituting the assembly process includes a die bonder 41, a wire bonder 42, a molding device 43, a lead cutting device 44, a laser marking device 45, and a packing device 46. An oven 47 for curing silver paste or the like after die bonding, a honing device 48 for deburring mold resin, and a solder dip device 49 for solder dip of a lead frame are provided as typical devices. .

[0004] A work (workpiece) to be a product is transported between devices by an operator (operator) sequentially storing the work in a magazine or a pallet for each product lot.

[0005]

However, the conventional semiconductor device assembling process has the following problems.

First, each of the manufacturing apparatuses constituting the assembling process includes a work supply unit (loader), a transport unit (feeder), a processing unit, and a work storage unit (unloader). The supply unit (loader), transport unit (feeder), and work storage unit (unloader) are the same mechanical units, and have an excessive and complicated single-unit configuration.
Capital investment becomes enormous.

Secondly, since the manufacturing apparatuses constituting the assembling process are dispersed to some extent, and the transfer of the work between the devices is performed by the operator for each product lot, the work is input from the die bonding process to the final process. Usually, it takes a plurality of days until the processing by the packing device is completed, and the lead time is long.

Third, supply of a work for each manufacturing apparatus,
Since a series of operations of transport and storage are repeated, a defect due to such an operation in the manufacturing apparatus is likely to occur, which causes a decrease in yield or a variation in yield among lots. In particular, after the wire bonding, the semiconductor device is stored in a magazine or transported to the next step, so that abnormalities such as deformation of the bonding wires, poor connection, and disconnection are likely to occur. Further, since an operator is interposed between the respective manufacturing apparatuses, the yield is often reduced due to an erroneous operation or the like.

Fourthly, due to the diversification of product specifications, it is inevitable that the production method will be multi-product small-lot production. However, work instruction information on new products to be developed one after another is transmitted from the technology development department to the manufacturing department. Requires a certain period of time, which results in a longer product development period. Due to the problems described above, the manufacturing cost increases, which is an obstacle to reducing the unit cost of the product.

SUMMARY OF THE INVENTION The present invention has been made in view of the above problems, and has as its object to reduce capital investment in a semiconductor device assembling process, to provide assembling information at any time, and to assemble the semiconductor device. An object of the present invention is to provide a manufacturing apparatus and a manufacturing method of a semiconductor device having a configuration in which various types of processing apparatuses can be arbitrarily selected and mounted.

[0011]

According to an apparatus for manufacturing a semiconductor device according to the present invention, a substantially circular turntable for carrying a work, and a work provided around the turntable and carried by the turntable. The present invention is characterized by comprising a plurality of processing apparatuses each performing an assembling process of a semiconductor device, and a control device controlling operation of the plurality of processing apparatuses according to specifications of a product to be manufactured. According to the method of manufacturing a semiconductor device according to the first aspect, the first step of supplying the work on the substantially circular turntable that conveys the work, and the plurality of processing apparatuses disposed around the turntable, the turntable A second process of sequentially performing predetermined processing on the workpiece conveyed by the rotation of the first processing, and a predetermined processing performed by a plurality of processing apparatuses, after the last processing is performed. And a third step of collecting the workpieces. With this configuration, a transport unit (feeder), a supply unit (loader), and a storage unit (unloader) conventionally required for each processing apparatus are provided. Can be eliminated, and capital investment can be reduced and space can be saved.

Since the plurality of processing apparatuses include various apparatuses for performing an assembling process of the semiconductor device, they can be arbitrarily selected and arranged around the turntable, and a plurality of processing apparatuses can be manufactured. The replacement can be performed according to the specifications.

[0013] The control device is provided via a communication network,
Various technical information on product technology development and various management information on product production management are provided, and assembly information on multiple processing devices is provided.Therefore, various information on products from product development to shipment Batch management becomes possible.

[0014]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A semiconductor device manufacturing apparatus and a manufacturing method according to the present invention use a circular turntable as a means for transporting a work (workpiece) as a product, and a semiconductor device is provided around the turntable. The feature is that the semiconductor device assembling process is performed by a configuration in which processing devices for performing main processing in the device assembling process are assembled and arranged. The processing device can be arbitrarily selected and arranged around the turntable, and can be replaced according to the specifications of the product to be manufactured.

In the configuration of the semiconductor device manufacturing apparatus and the manufacturing method according to the present invention, a work such as a lead frame and a substrate is conveyed and processed on a turntable, so that it is conventionally necessary for each processing apparatus. A transport unit (feeder), a supply unit (loader), and a storage unit (unloader) that have been used are not required, so that capital investment can be reduced and space can be saved. In addition, assembly information such as product specifications, work input conditions, work instructions, etc. is provided based on instructions from a backbone computer via a LAN for production support, enabling integrated management from product development to shipment. It is.

FIG. 1 is an explanatory diagram showing the configuration of a semiconductor device manufacturing apparatus according to the present invention, that is, a manufacturing apparatus used for carrying out the semiconductor device manufacturing method according to the present invention.

The semiconductor device manufacturing apparatus according to the present invention is configured as follows in the present embodiment. That is, a turntable 1 that is disposed at the center of a plurality of processing devices and transports a work between the processing devices, a supply and cleaning device 2 that supplies and cleans the work,
A die bonder 3 for performing die bonding, a taping device 4 for performing tape bonding, a step cure oven 5 for curing a die bonding material in a short time when a workpiece is transferred, a wire bonding device 6 for performing wire bonding, and mounting and bonding of a die Bonding visual inspection device 7 for inspecting the external appearance and removing defective products, and molding device 8 for performing resin sealing of semiconductor chips
A laser marker 14 for performing a laser mark on a package of a semiconductor device; a lead cut device 9 for performing a lead cut; and a tray storage device 1 for storing a work in a tray 15.
0, a transfer stock conveyor 11 having an unloader 16 for storing a tray in which the work is stored, a work transfer head 12 for transferring the work to each processing device on the turntable 1, an operation panel 17, and a computer display. Various assembly information is displayed on the section 18 and the operation panel 13 which is a control device for controlling each of the above processing devices constitutes a semiconductor device manufacturing apparatus according to the present invention. Reference numeral 19 denotes an operator.

The operator 19 mainly performs supply of members such as a lead frame to the supply / cleaning device 2 and operation and monitoring on the operation panel 13 for controlling processing conditions of each processing device.

FIG. 2 is an explanatory view showing an outline of the processing steps in the semiconductor device manufacturing apparatus according to the present invention, that is, an explanatory view showing each step of the semiconductor device manufacturing method according to the present invention. Each figure in FIG. 2 shows a die bonding process (FIG. 2).
(A)), curing step (FIG. 2 (b)), wire bonding step (FIG. 2 (c)), molding step (FIG. 2).
(D)) and a lead cutting process (FIG. 2 (e)).

As shown in FIG. 2A, in the die bonding step, the push-up block 22 which stands by at a position lower than the upper surface of the turntable around the turntable 21.
And the die chip bonder 23 bonds the semiconductor chip 20.
The same applies to chip capacitors formed by taping. As shown in FIG. 2B, in the curing step, the workpiece is transferred by the workpiece transfer head 12 disposed on the turntable 21 to the conveyor 2 in the step cure oven 5.
The silver paste used for bonding the semiconductor chip 20 and the lead frame is cured by being placed on the substrate 4 and transporting the work by the conveyor 24 in the step cure oven 5. A plurality of work transfer heads 12 are provided for transferring the work to the molding device and the lead cut device. As shown in FIG.
The work to which the semiconductor chip 20 is bonded is clamped by the heater block 25 waiting at a position lower than the surrounding upper surface of the turntable, and wiring by gold wire is performed by the wire bonder 26.

As described above, the molding apparatus includes a molding section for sealing the semiconductor chip 20 mounted and wired on the lead frame with a resin, a laser marker 14 for performing a laser mark on a semiconductor device package, and a mark inspection section for performing a mark inspection. It is composed of As shown in FIG. 2D, in the molding step, the semiconductor chip 20 surrounded by the film 27 and the collar 28 is molded using a heater 25 ', and further, a mark and a mark inspection are performed.

As shown in FIG. 2 (e), in the lead cutting step, the lead of the work transferred from the turntable 21 to a lead cutting device equipped with a die is cut by a cutter 29, and cut into individual products. Separated and stored in a tray.

FIG. 3 is an explanatory diagram showing a state in which a core technical department for product development and a factory production department for product production are connected via a main LAN.

The core technology department develops applied technology 34 based on the core technology, and further develops product technology 35 including design review and the like. The applied technology 34 is fed back to the core technology, and the information is provided to the core technology support 3
3 is connected to the main LAN 31. Further, the product technology 35 includes PDM (Product Data Man) as product development information.
agement) is connected to the main LAN 31 via the management unit 32.

On the other hand, in the factory production section, based on information from the main LAN 31, the factory production support 36
Production plan 37 such as production plan and work instruction, PDM management unit 3
2. QA (Quality) of manufacturing equipment including recipe transfer based on the information of No. 2, FA (Factory Automation) 38 of manufacturing equipment considering production capacity, processing point sensing, SPC (Stored Program Control) information storage, etc.
Assurance: 39. That information is
The PDM management unit 3 is connected to the main LAN 31 as a factory production support 36, and is used as a production management / warehouse inspection menu.
2 and is fed back as security information such as input lot information and QA accumulated data when the production plan 37 is performed.

The main LAN 31 is connected to the operation panel 13 shown in FIG. 1. The operation panel 13 includes various technical information related to product technical development and various management information related to product production management, such as a manufacturing plan, various types of information. Assembly information, work instructions, etc. are provided and displayed. The operation panel 13 supplies assembly information in each processing apparatus. Accordingly, it is possible to collectively manage various kinds of information on products from product development to shipment.

[0027]

According to the apparatus and method for manufacturing a semiconductor device according to the present invention, the processing devices are assembled around the turntable, so that the transport unit (feeder), the supply unit (loader) and It is not necessary to provide a storage unit (unloader) for each processing apparatus, so that capital investment can be reduced and space can be saved. In addition, the control device that controls each processing device includes various technical information related to product technology development,
Various management information related to product production management is provided, and assembly information is supplied for each processing device, so that various information related to products can be managed collectively from product development to shipment. The period from the end of the process to the commercialization can be shortened, the finished product can be manufactured without requiring a plurality of days, and the inter-device storage device becomes unnecessary. Further, the work transfer path is shortened, and no human is interposed between the processing devices, so that the yield can be improved and stabilized. In addition, since the quality check by various appearance inspections is performed by the automatic inspection machine, outflow of defective products can be prevented. In addition, the product specification and work input information can be obtained in real time by the LAN, so that the product development efficiency is improved, and the quality control is facilitated by analyzing the FA and QA information of the manufacturing apparatus.

The above effects can be summarized as follows: reduction of capital investment, reduction of workers, saving of space, improvement of product yield,
Delivery time can be shortened, and as a result, production efficiency can be improved and manufacturing cost can be reduced.

[Brief description of the drawings]

FIG. 1 is an explanatory diagram showing a configuration of a semiconductor device manufacturing apparatus according to the present invention.

FIG. 2 is an explanatory view showing each step of a method for manufacturing a semiconductor device according to the present invention.

FIG. 3 is an explanatory diagram showing a state in which a core technical department for product development and a factory production department for product production are connected via a main LAN.

FIG. 4 is an explanatory view schematically showing an arrangement of manufacturing apparatuses in a conventional semiconductor device assembling process.

[Explanation of symbols]

Reference Signs List 1 turntable 2 supply / cleaning device 3 die bonder 4 taping device 5 step cure oven 6 wire bonding device 7 mount bonding appearance inspection device 8 molding device 9 lead cut device 10 tray storage device 11 transport stock conveyor 12 work transfer head 13 operation panel 14 Laser marker 15 Tray 16 Unloader 17 Operation panel 18 Computer display unit 19 Operator 20 Semiconductor chip 21 Turntable 22 Push-up block 23 Die bonder 24 Conveyor 25 Heater block 25 'Heater 26 Wire bonder 27 Film 28 Color 29 Cutter 31 Main LAN 32 PDM (Product Data) Management) Management Department 33 Core Technical Support 34 Application Technology 35 Product Technology 36 Factory Production Support 7 of the production plan 38 manufacturing device FA QA of (Factory Automation) of 39 manufacturing equipment (Quality Assurance: Quality Assurance)

Claims (4)

[Claims] 1. A substantially circular turntable for transporting a work, and a plurality of processes disposed around the turntable and performing a semiconductor device assembling process on the work transported by the turntable. An apparatus for manufacturing a semiconductor device, comprising: an apparatus; and a control apparatus that controls operations of the plurality of processing apparatuses according to specifications of a product to be manufactured. 2. The apparatus for manufacturing a semiconductor device according to claim 1, wherein the control device is configured to transmit, via a communication network, various types of technical information relating to technical development of the product and various types of management information relating to production management of the product. And a device for supplying assembly information in the plurality of processing apparatuses. 3. A first step of supplying a workpiece onto a substantially circular turntable for transporting the workpiece, and a plurality of processing devices disposed around the turntable to transport the workpiece by rotating the turntable. A second step of sequentially performing predetermined processing on the work that has been performed, and a third step of collecting the work after the last processing is performed among the predetermined processing by the plurality of processing apparatuses. And a process for manufacturing a semiconductor device. 4. The method of manufacturing a semiconductor device according to claim 3, wherein the plurality of processing devices include various devices for performing an assembling process of the semiconductor device, and a control device according to the specification of a product to be manufactured. The control device is provided with various types of technical information on technical development of the product and various types of management information on production management of the product via a communication network, and the plurality of processes. A method for manufacturing a semiconductor device, comprising supplying assembly information in a device.