JPH0546270Y2 - - Google Patents
Info
- Publication number
- JPH0546270Y2 JPH0546270Y2 JP10526088U JP10526088U JPH0546270Y2 JP H0546270 Y2 JPH0546270 Y2 JP H0546270Y2 JP 10526088 U JP10526088 U JP 10526088U JP 10526088 U JP10526088 U JP 10526088U JP H0546270 Y2 JPH0546270 Y2 JP H0546270Y2
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor element
- resin
- substrate
- sealing
- plastic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000004065 semiconductor Substances 0.000 claims description 25
- 239000011347 resin Substances 0.000 claims description 14
- 229920005989 resin Polymers 0.000 claims description 14
- 238000001721 transfer moulding Methods 0.000 claims description 6
- 238000001746 injection moulding Methods 0.000 claims description 2
- 238000002347 injection Methods 0.000 claims 1
- 239000007924 injection Substances 0.000 claims 1
- 229920000307 polymer substrate Polymers 0.000 claims 1
- 238000007789 sealing Methods 0.000 description 19
- 239000000758 substrate Substances 0.000 description 13
- 238000000034 method Methods 0.000 description 8
- 239000000088 plastic resin Substances 0.000 description 8
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000005538 encapsulation Methods 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
Landscapes
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10526088U JPH0546270Y2 (ko) | 1988-08-09 | 1988-08-09 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10526088U JPH0546270Y2 (ko) | 1988-08-09 | 1988-08-09 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0226241U JPH0226241U (ko) | 1990-02-21 |
| JPH0546270Y2 true JPH0546270Y2 (ko) | 1993-12-03 |
Family
ID=31337711
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10526088U Expired - Lifetime JPH0546270Y2 (ko) | 1988-08-09 | 1988-08-09 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0546270Y2 (ko) |
-
1988
- 1988-08-09 JP JP10526088U patent/JPH0546270Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0226241U (ko) | 1990-02-21 |
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