JPH0544616B2 - - Google Patents
Info
- Publication number
- JPH0544616B2 JPH0544616B2 JP58187044A JP18704483A JPH0544616B2 JP H0544616 B2 JPH0544616 B2 JP H0544616B2 JP 58187044 A JP58187044 A JP 58187044A JP 18704483 A JP18704483 A JP 18704483A JP H0544616 B2 JPH0544616 B2 JP H0544616B2
- Authority
- JP
- Japan
- Prior art keywords
- thick film
- film circuit
- vacuum
- metal
- pressure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000002184 metal Substances 0.000 claims description 18
- 210000003298 dental enamel Anatomy 0.000 claims description 6
- 239000004065 semiconductor Substances 0.000 claims description 4
- 239000011521 glass Substances 0.000 description 8
- 229910052710 silicon Inorganic materials 0.000 description 6
- 239000010703 silicon Substances 0.000 description 6
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 5
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 238000001514 detection method Methods 0.000 description 3
- 238000007789 sealing Methods 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 230000003321 amplification Effects 0.000 description 1
- 238000005219 brazing Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000003199 nucleic acid amplification method Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 150000003376 silicon Chemical class 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
- G01L19/14—Housings
- G01L19/141—Monolithic housings, e.g. molded or one-piece housings
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
- G01L19/0007—Fluidic connecting means
- G01L19/003—Fluidic connecting means using a detachable interface or adapter between the process medium and the pressure gauge
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
- G01L19/0061—Electrical connection means
- G01L19/0084—Electrical connection means to the outside of the housing
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
- G01L19/14—Housings
- G01L19/148—Details about the circuit board integration, e.g. integrated with the diaphragm surface or encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Measuring Fluid Pressure (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP58187044A JPS6079242A (ja) | 1983-10-07 | 1983-10-07 | 圧力変換器 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP58187044A JPS6079242A (ja) | 1983-10-07 | 1983-10-07 | 圧力変換器 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6079242A JPS6079242A (ja) | 1985-05-07 |
JPH0544616B2 true JPH0544616B2 (US06566495-20030520-M00011.png) | 1993-07-06 |
Family
ID=16199189
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP58187044A Granted JPS6079242A (ja) | 1983-10-07 | 1983-10-07 | 圧力変換器 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6079242A (US06566495-20030520-M00011.png) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0441644U (US06566495-20030520-M00011.png) * | 1990-08-08 | 1992-04-08 | ||
JP2547950Y2 (ja) * | 1990-08-24 | 1997-09-17 | ナイルス部品株式会社 | 厚膜圧力センサ |
DE19631742C2 (de) * | 1996-08-06 | 2000-07-20 | Siemens Ag | Elektronisches Sensor-Bauelement |
JP3764375B2 (ja) | 2001-11-15 | 2006-04-05 | 三菱電機株式会社 | 同期誘導電動機の回転子及び電動機の回転子及び同期誘導電動機及び誘導電動機及び直流ブラシレスモータ及び密閉型圧縮機及び冷蔵庫及び空気調和機和機及び同期誘導電動機の回転子の製造方法 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS55124035A (en) * | 1979-03-09 | 1980-09-24 | Thomson Csf | Pressure detector |
JPS5636109A (en) * | 1979-08-31 | 1981-04-09 | Matsushita Electric Works Ltd | Monostable type polar electromagnet |
JPS57186137A (en) * | 1981-05-12 | 1982-11-16 | Fuji Electric Corp Res & Dev Ltd | Pressure sensor |
JPS5823494A (ja) * | 1981-08-05 | 1983-02-12 | 株式会社東芝 | 厚膜集積回路の製造方法 |
-
1983
- 1983-10-07 JP JP58187044A patent/JPS6079242A/ja active Granted
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS55124035A (en) * | 1979-03-09 | 1980-09-24 | Thomson Csf | Pressure detector |
JPS5636109A (en) * | 1979-08-31 | 1981-04-09 | Matsushita Electric Works Ltd | Monostable type polar electromagnet |
JPS57186137A (en) * | 1981-05-12 | 1982-11-16 | Fuji Electric Corp Res & Dev Ltd | Pressure sensor |
JPS5823494A (ja) * | 1981-08-05 | 1983-02-12 | 株式会社東芝 | 厚膜集積回路の製造方法 |
Also Published As
Publication number | Publication date |
---|---|
JPS6079242A (ja) | 1985-05-07 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPS63149531A (ja) | 静電容量式圧力センサ | |
JPH1130559A (ja) | 圧力センサ | |
JP3915605B2 (ja) | 圧力センサ装置 | |
JPH0544616B2 (US06566495-20030520-M00011.png) | ||
JPH11326088A (ja) | 圧力センサとその製造方法 | |
US4400682A (en) | Pressure sensor | |
JP2782572B2 (ja) | 圧力センサとその製造方法 | |
JPH09178596A (ja) | 圧力センサ | |
JPH01169333A (ja) | 半導体圧力変換器 | |
JPH02196938A (ja) | 圧力センサ | |
JPH04267566A (ja) | 高圧用半導体圧力センサ | |
JPS63175482A (ja) | 圧力センサ | |
JPH0654273B2 (ja) | 圧力センサ | |
JPH08226861A (ja) | 圧力センサ並びにその実装構造 | |
JP4103227B2 (ja) | 圧力センサ | |
JP3220346B2 (ja) | 圧力センサ及びその製造方法 | |
JPH0566979B2 (US06566495-20030520-M00011.png) | ||
JP3375533B2 (ja) | 半導体圧力変換器 | |
JP3158353B2 (ja) | 圧力検出装置 | |
JP3349489B2 (ja) | 圧力センサとその製造方法 | |
JPH04350530A (ja) | 半導体圧力センサ | |
JP3285971B2 (ja) | 半導体圧力センサ | |
JPS6316240A (ja) | 圧力検出器 | |
JP2583137B2 (ja) | 半導体圧力センサ | |
JPH04267565A (ja) | 高圧用半導体圧力センサ |