JPH0543318B2 - - Google Patents
Info
- Publication number
- JPH0543318B2 JPH0543318B2 JP32702287A JP32702287A JPH0543318B2 JP H0543318 B2 JPH0543318 B2 JP H0543318B2 JP 32702287 A JP32702287 A JP 32702287A JP 32702287 A JP32702287 A JP 32702287A JP H0543318 B2 JPH0543318 B2 JP H0543318B2
- Authority
- JP
- Japan
- Prior art keywords
- board
- circuit board
- guide
- fixed
- fastener
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000001816 cooling Methods 0.000 description 8
- 239000002184 metal Substances 0.000 description 6
- 230000002265 prevention Effects 0.000 description 5
- 230000000694 effects Effects 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Mounting Of Printed Circuit Boards And The Like (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP32702287A JPH01170094A (ja) | 1987-12-25 | 1987-12-25 | 基板実装構造 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP32702287A JPH01170094A (ja) | 1987-12-25 | 1987-12-25 | 基板実装構造 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH01170094A JPH01170094A (ja) | 1989-07-05 |
JPH0543318B2 true JPH0543318B2 (enrdf_load_stackoverflow) | 1993-07-01 |
Family
ID=18194433
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP32702287A Granted JPH01170094A (ja) | 1987-12-25 | 1987-12-25 | 基板実装構造 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH01170094A (enrdf_load_stackoverflow) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2666565B2 (ja) * | 1990-11-30 | 1997-10-22 | 日本電気株式会社 | 半導体装置の製造方法 |
-
1987
- 1987-12-25 JP JP32702287A patent/JPH01170094A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPH01170094A (ja) | 1989-07-05 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US4687276A (en) | Connector clip for ribbon cable connector | |
JPH0468752B2 (enrdf_load_stackoverflow) | ||
JPH0543318B2 (enrdf_load_stackoverflow) | ||
JPH0617345Y2 (ja) | ジャックの取付け装置 | |
US6421911B1 (en) | Apparatus and method for providing automatic alignment of a circuit board within a chassis | |
JPH0595196A (ja) | シールド装置 | |
JPH0334923Y2 (enrdf_load_stackoverflow) | ||
JPS6243345B2 (enrdf_load_stackoverflow) | ||
JPS6144496A (ja) | 電源コ−ド保持装置 | |
JPH04109593U (ja) | シールドケース | |
JPH0319262Y2 (enrdf_load_stackoverflow) | ||
JPS5816301Y2 (ja) | シヤ−シソウチ | |
JPH05243773A (ja) | プリント板シェルフ | |
JP2654477B2 (ja) | プリント基盤用コネクタのロツク機構 | |
JPS5816222Y2 (ja) | シヤ−シ取付装置 | |
JP2921152B2 (ja) | 取付構造 | |
JP4239408B2 (ja) | 電気湯沸かし器 | |
JPH0574523A (ja) | シールドケース付コネクタ | |
JPH0997987A (ja) | 電子機器のモジュールの構造 | |
JPH05275872A (ja) | プリント配線基板の取付装置 | |
JPH0766580A (ja) | 配線基板のシールド構造 | |
JPS6063977U (ja) | 小型電子回路ユニツトの蓋取付装置 | |
JPH07192813A (ja) | シールドコネクタ組立体 | |
JPS5827498Y2 (ja) | コネクタ | |
JPS5950599A (ja) | シ−ルドケ−ス |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
LAPS | Cancellation because of no payment of annual fees |