JPH0543318B2 - - Google Patents
Info
- Publication number
- JPH0543318B2 JPH0543318B2 JP32702287A JP32702287A JPH0543318B2 JP H0543318 B2 JPH0543318 B2 JP H0543318B2 JP 32702287 A JP32702287 A JP 32702287A JP 32702287 A JP32702287 A JP 32702287A JP H0543318 B2 JPH0543318 B2 JP H0543318B2
- Authority
- JP
- Japan
- Prior art keywords
- board
- circuit board
- guide
- fixed
- fastener
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000001816 cooling Methods 0.000 description 8
- 239000002184 metal Substances 0.000 description 6
- 230000002265 prevention Effects 0.000 description 5
- 230000000694 effects Effects 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Mounting Of Printed Circuit Boards And The Like (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP32702287A JPH01170094A (ja) | 1987-12-25 | 1987-12-25 | 基板実装構造 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP32702287A JPH01170094A (ja) | 1987-12-25 | 1987-12-25 | 基板実装構造 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01170094A JPH01170094A (ja) | 1989-07-05 |
| JPH0543318B2 true JPH0543318B2 (cs) | 1993-07-01 |
Family
ID=18194433
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP32702287A Granted JPH01170094A (ja) | 1987-12-25 | 1987-12-25 | 基板実装構造 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01170094A (cs) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2666565B2 (ja) * | 1990-11-30 | 1997-10-22 | 日本電気株式会社 | 半導体装置の製造方法 |
-
1987
- 1987-12-25 JP JP32702287A patent/JPH01170094A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPH01170094A (ja) | 1989-07-05 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH0468752B2 (cs) | ||
| JPH113749A (ja) | シールドコネクタ | |
| JPH0543318B2 (cs) | ||
| JPH0617345Y2 (ja) | ジャックの取付け装置 | |
| US6157536A (en) | Retention module for receiving different CPU modules | |
| US6421911B1 (en) | Apparatus and method for providing automatic alignment of a circuit board within a chassis | |
| JPH0595196A (ja) | シールド装置 | |
| JPH0334923Y2 (cs) | ||
| JPS6243345B2 (cs) | ||
| JPS6144496A (ja) | 電源コ−ド保持装置 | |
| JPH04109593U (ja) | シールドケース | |
| JPH0319262Y2 (cs) | ||
| JPH08298393A (ja) | チューナ装置 | |
| JPS5816301Y2 (ja) | シヤ−シソウチ | |
| JPH05243773A (ja) | プリント板シェルフ | |
| JP2654477B2 (ja) | プリント基盤用コネクタのロツク機構 | |
| JPS5816222Y2 (ja) | シヤ−シ取付装置 | |
| JP4239408B2 (ja) | 電気湯沸かし器 | |
| JPH0574523A (ja) | シールドケース付コネクタ | |
| JPH0997987A (ja) | 電子機器のモジュールの構造 | |
| JPH05275872A (ja) | プリント配線基板の取付装置 | |
| JPH0766580A (ja) | 配線基板のシールド構造 | |
| JPS6063977U (ja) | 小型電子回路ユニツトの蓋取付装置 | |
| JPS5950599A (ja) | シ−ルドケ−ス | |
| JP2962328B1 (ja) | パネル取付構造 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |