JPH0541704B2 - - Google Patents
Info
- Publication number
- JPH0541704B2 JPH0541704B2 JP1146280A JP14628089A JPH0541704B2 JP H0541704 B2 JPH0541704 B2 JP H0541704B2 JP 1146280 A JP1146280 A JP 1146280A JP 14628089 A JP14628089 A JP 14628089A JP H0541704 B2 JPH0541704 B2 JP H0541704B2
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- holder
- substrate holder
- groove
- present
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/50—Substrate holders
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
- Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14628089A JPH0313577A (ja) | 1989-06-08 | 1989-06-08 | スパッタ装置の基板ホルダ |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14628089A JPH0313577A (ja) | 1989-06-08 | 1989-06-08 | スパッタ装置の基板ホルダ |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH0313577A JPH0313577A (ja) | 1991-01-22 |
JPH0541704B2 true JPH0541704B2 (enrdf_load_html_response) | 1993-06-24 |
Family
ID=15404150
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP14628089A Granted JPH0313577A (ja) | 1989-06-08 | 1989-06-08 | スパッタ装置の基板ホルダ |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0313577A (enrdf_load_html_response) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5855687A (en) * | 1990-12-05 | 1999-01-05 | Applied Materials, Inc. | Substrate support shield in wafer processing reactors |
US5304248A (en) * | 1990-12-05 | 1994-04-19 | Applied Materials, Inc. | Passive shield for CVD wafer processing which provides frontside edge exclusion and prevents backside depositions |
CN104900567A (zh) * | 2014-03-04 | 2015-09-09 | 北京北方微电子基地设备工艺研究中心有限责任公司 | 一种托盘以及腔室 |
JP2017155282A (ja) * | 2016-03-01 | 2017-09-07 | 株式会社アルバック | 成膜装置、プラテンリング |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS55121648A (en) * | 1979-03-14 | 1980-09-18 | Pioneer Electronic Corp | Cvd device |
JPS5842444Y2 (ja) * | 1980-06-30 | 1983-09-26 | 日本真空技術 株式会社 | ウエハの支承装置 |
-
1989
- 1989-06-08 JP JP14628089A patent/JPH0313577A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPH0313577A (ja) | 1991-01-22 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
EXPY | Cancellation because of completion of term |