JPH0535207B2 - - Google Patents
Info
- Publication number
- JPH0535207B2 JPH0535207B2 JP60201855A JP20185585A JPH0535207B2 JP H0535207 B2 JPH0535207 B2 JP H0535207B2 JP 60201855 A JP60201855 A JP 60201855A JP 20185585 A JP20185585 A JP 20185585A JP H0535207 B2 JPH0535207 B2 JP H0535207B2
- Authority
- JP
- Japan
- Prior art keywords
- copper
- ribbon
- alloy
- foil
- flexibility
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Continuous Casting (AREA)
- Conductive Materials (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP20185585A JPS6263633A (ja) | 1985-09-13 | 1985-09-13 | 可撓性を有する銅基合金 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP20185585A JPS6263633A (ja) | 1985-09-13 | 1985-09-13 | 可撓性を有する銅基合金 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6263633A JPS6263633A (ja) | 1987-03-20 |
JPH0535207B2 true JPH0535207B2 (enrdf_load_stackoverflow) | 1993-05-26 |
Family
ID=16448001
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP20185585A Granted JPS6263633A (ja) | 1985-09-13 | 1985-09-13 | 可撓性を有する銅基合金 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6263633A (enrdf_load_stackoverflow) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7463222B2 (en) | 2002-09-05 | 2008-12-09 | Koninklijke Philips Electronics N.V. | Devices and methods for electroluminescent display |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FI87470C (fi) * | 1989-11-17 | 1993-01-11 | Outokumpu Oy | Som slaglod anvaendbara kopparlegeringar |
US5378294A (en) * | 1989-11-17 | 1995-01-03 | Outokumpu Oy | Copper alloys to be used as brazing filler metals |
US5178827A (en) * | 1989-11-17 | 1993-01-12 | Outokumpu Oy | Copper alloys to be used as brazing filler metals |
JPH03297595A (ja) * | 1990-04-18 | 1991-12-27 | Meidensha Corp | ロウ材とロウ付け方法 |
DE10335947A1 (de) | 2003-08-04 | 2005-03-17 | Vacuumschmelze Gmbh & Co. Kg | Hartlotlegierung auf Kupferbasis sowie Verfahren zum Hartlöten |
JP2008151422A (ja) * | 2006-12-18 | 2008-07-03 | Daikin Ind Ltd | 熱交換器 |
JP6221912B2 (ja) * | 2014-04-10 | 2017-11-01 | 住友金属鉱山株式会社 | はんだ接合用銅合金 |
CN108453222B (zh) * | 2018-03-12 | 2019-11-05 | 东北大学 | 一种铜基弹性合金薄带的减量化制备方法 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6056409B2 (ja) * | 1982-05-17 | 1985-12-10 | 東ソー株式会社 | 電解陰極用表面活性化非晶質合金 |
-
1985
- 1985-09-13 JP JP20185585A patent/JPS6263633A/ja active Granted
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7463222B2 (en) | 2002-09-05 | 2008-12-09 | Koninklijke Philips Electronics N.V. | Devices and methods for electroluminescent display |
Also Published As
Publication number | Publication date |
---|---|
JPS6263633A (ja) | 1987-03-20 |
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