JPS6263633A - 可撓性を有する銅基合金 - Google Patents
可撓性を有する銅基合金Info
- Publication number
- JPS6263633A JPS6263633A JP20185585A JP20185585A JPS6263633A JP S6263633 A JPS6263633 A JP S6263633A JP 20185585 A JP20185585 A JP 20185585A JP 20185585 A JP20185585 A JP 20185585A JP S6263633 A JPS6263633 A JP S6263633A
- Authority
- JP
- Japan
- Prior art keywords
- alloy
- copper
- ribbon
- rapid cooling
- flexibility
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Continuous Casting (AREA)
- Conductive Materials (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP20185585A JPS6263633A (ja) | 1985-09-13 | 1985-09-13 | 可撓性を有する銅基合金 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP20185585A JPS6263633A (ja) | 1985-09-13 | 1985-09-13 | 可撓性を有する銅基合金 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6263633A true JPS6263633A (ja) | 1987-03-20 |
JPH0535207B2 JPH0535207B2 (enrdf_load_stackoverflow) | 1993-05-26 |
Family
ID=16448001
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP20185585A Granted JPS6263633A (ja) | 1985-09-13 | 1985-09-13 | 可撓性を有する銅基合金 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6263633A (enrdf_load_stackoverflow) |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03297595A (ja) * | 1990-04-18 | 1991-12-27 | Meidensha Corp | ロウ材とロウ付け方法 |
US5130090A (en) * | 1989-11-17 | 1992-07-14 | Outokumpu Oy | Copper alloys to be used as brazing filler metals |
US5178827A (en) * | 1989-11-17 | 1993-01-12 | Outokumpu Oy | Copper alloys to be used as brazing filler metals |
US5378294A (en) * | 1989-11-17 | 1995-01-03 | Outokumpu Oy | Copper alloys to be used as brazing filler metals |
JP2008151422A (ja) * | 2006-12-18 | 2008-07-03 | Daikin Ind Ltd | 熱交換器 |
US7461770B2 (en) | 2003-08-04 | 2008-12-09 | Vacuumschmelze Gmbh & Co. Kg | Copper-based brazing alloy and brazing process |
JP2015199115A (ja) * | 2014-04-10 | 2015-11-12 | 住友金属鉱山株式会社 | はんだ接合用銅合金 |
CN108453222A (zh) * | 2018-03-12 | 2018-08-28 | 东北大学 | 一种铜基弹性合金薄带的减量化制备方法 |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB0220614D0 (en) | 2002-09-05 | 2002-10-16 | Koninkl Philips Electronics Nv | Electroluminescent display devices |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58199839A (ja) * | 1982-05-17 | 1983-11-21 | Toyo Soda Mfg Co Ltd | 電解陰極用表面活性化非晶質合金 |
-
1985
- 1985-09-13 JP JP20185585A patent/JPS6263633A/ja active Granted
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58199839A (ja) * | 1982-05-17 | 1983-11-21 | Toyo Soda Mfg Co Ltd | 電解陰極用表面活性化非晶質合金 |
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5130090A (en) * | 1989-11-17 | 1992-07-14 | Outokumpu Oy | Copper alloys to be used as brazing filler metals |
US5178827A (en) * | 1989-11-17 | 1993-01-12 | Outokumpu Oy | Copper alloys to be used as brazing filler metals |
US5378294A (en) * | 1989-11-17 | 1995-01-03 | Outokumpu Oy | Copper alloys to be used as brazing filler metals |
JPH03297595A (ja) * | 1990-04-18 | 1991-12-27 | Meidensha Corp | ロウ材とロウ付け方法 |
US7461770B2 (en) | 2003-08-04 | 2008-12-09 | Vacuumschmelze Gmbh & Co. Kg | Copper-based brazing alloy and brazing process |
US7654438B2 (en) | 2003-08-04 | 2010-02-02 | Vacuumschmelze Gmbh & Co. Kg | Copper-based brazing alloy and brazing process |
JP2008151422A (ja) * | 2006-12-18 | 2008-07-03 | Daikin Ind Ltd | 熱交換器 |
JP2015199115A (ja) * | 2014-04-10 | 2015-11-12 | 住友金属鉱山株式会社 | はんだ接合用銅合金 |
CN108453222A (zh) * | 2018-03-12 | 2018-08-28 | 东北大学 | 一种铜基弹性合金薄带的减量化制备方法 |
Also Published As
Publication number | Publication date |
---|---|
JPH0535207B2 (enrdf_load_stackoverflow) | 1993-05-26 |
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