JP2023079242A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2023079242A5 JP2023079242A5 JP2021192604A JP2021192604A JP2023079242A5 JP 2023079242 A5 JP2023079242 A5 JP 2023079242A5 JP 2021192604 A JP2021192604 A JP 2021192604A JP 2021192604 A JP2021192604 A JP 2021192604A JP 2023079242 A5 JP2023079242 A5 JP 2023079242A5
- Authority
- JP
- Japan
- Prior art keywords
- low
- temperature solder
- alloy
- temperature
- base material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims 30
- 239000000463 material Substances 0.000 claims 24
- 229910045601 alloy Inorganic materials 0.000 claims 14
- 239000000956 alloy Substances 0.000 claims 14
- 229910052738 indium Inorganic materials 0.000 claims 11
- 229910052797 bismuth Inorganic materials 0.000 claims 8
- 238000004519 manufacturing process Methods 0.000 claims 8
- 238000002844 melting Methods 0.000 claims 8
- 230000008018 melting Effects 0.000 claims 8
- 229910052698 phosphorus Inorganic materials 0.000 claims 6
- 229910052782 aluminium Inorganic materials 0.000 claims 5
- 238000005275 alloying Methods 0.000 claims 4
- 229910052787 antimony Inorganic materials 0.000 claims 4
- 239000011347 resin Substances 0.000 claims 4
- 229920005989 resin Polymers 0.000 claims 4
- 238000005476 soldering Methods 0.000 claims 4
- 239000000758 substrate Substances 0.000 claims 4
- 229910052718 tin Inorganic materials 0.000 claims 4
- 229910052802 copper Inorganic materials 0.000 claims 3
- 239000010949 copper Substances 0.000 claims 3
- 238000002156 mixing Methods 0.000 claims 3
- 229910052710 silicon Inorganic materials 0.000 claims 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims 2
- 229910018978 Sn—In—Bi Inorganic materials 0.000 claims 2
- SWLVFNYSXGMGBS-UHFFFAOYSA-N ammonium bromide Chemical compound [NH4+].[Br-] SWLVFNYSXGMGBS-UHFFFAOYSA-N 0.000 claims 2
- 229910052788 barium Inorganic materials 0.000 claims 2
- 229920002678 cellulose Polymers 0.000 claims 2
- 239000001913 cellulose Substances 0.000 claims 2
- 229910052804 chromium Inorganic materials 0.000 claims 2
- 229910010272 inorganic material Inorganic materials 0.000 claims 2
- 239000011147 inorganic material Substances 0.000 claims 2
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims 2
- 239000004973 liquid crystal related substance Substances 0.000 claims 2
- 229910052751 metal Inorganic materials 0.000 claims 2
- 239000002184 metal Substances 0.000 claims 2
- 239000000843 powder Substances 0.000 claims 2
- 229910052720 vanadium Inorganic materials 0.000 claims 2
- 229920000049 Carbon (fiber) Polymers 0.000 claims 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 1
- 229910020830 Sn-Bi Inorganic materials 0.000 claims 1
- 229910018728 Sn—Bi Inorganic materials 0.000 claims 1
- 229910018956 Sn—In Inorganic materials 0.000 claims 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims 1
- 239000004917 carbon fiber Substances 0.000 claims 1
- 239000000919 ceramic Substances 0.000 claims 1
- 239000011248 coating agent Substances 0.000 claims 1
- 238000000576 coating method Methods 0.000 claims 1
- 230000002708 enhancing effect Effects 0.000 claims 1
- 239000000835 fiber Substances 0.000 claims 1
- 238000010304 firing Methods 0.000 claims 1
- 239000011521 glass Substances 0.000 claims 1
- 229910052742 iron Inorganic materials 0.000 claims 1
- 239000000155 melt Substances 0.000 claims 1
- 150000002739 metals Chemical class 0.000 claims 1
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 claims 1
- 238000000034 method Methods 0.000 claims 1
- -1 or In Inorganic materials 0.000 claims 1
- 239000000123 paper Substances 0.000 claims 1
- 239000010703 silicon Substances 0.000 claims 1
- 238000005245 sintering Methods 0.000 claims 1
- 229910001220 stainless steel Inorganic materials 0.000 claims 1
- 239000010935 stainless steel Substances 0.000 claims 1
- 239000002023 wood Substances 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021192604A JP2023079242A (ja) | 2021-11-27 | 2021-11-27 | 低温半田、低温半田の製造方法、および低温半田被覆リード線 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021192604A JP2023079242A (ja) | 2021-11-27 | 2021-11-27 | 低温半田、低温半田の製造方法、および低温半田被覆リード線 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2023079242A JP2023079242A (ja) | 2023-06-08 |
| JP2023079242A5 true JP2023079242A5 (enrdf_load_stackoverflow) | 2024-11-25 |
Family
ID=86647467
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2021192604A Pending JP2023079242A (ja) | 2021-11-27 | 2021-11-27 | 低温半田、低温半田の製造方法、および低温半田被覆リード線 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2023079242A (enrdf_load_stackoverflow) |
-
2021
- 2021-11-27 JP JP2021192604A patent/JP2023079242A/ja active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN103561903B (zh) | 无铅焊料合金 | |
| JP6062070B2 (ja) | Ｐｂを含まない半田合金 | |
| CN108326465A (zh) | 高强度无银无铅焊锡 | |
| CN101269446A (zh) | Sn-Zn-Ga-Ce无铅钎料 | |
| CN104972242A (zh) | 一种铝/钢熔钎焊用自钎剂药芯焊丝 | |
| CN101780607A (zh) | 一种用于电子封装组装钎焊的无铅钎料及其制备方法 | |
| WO2010087241A1 (ja) | 無鉛はんだ合金及び該はんだ合金を含む耐疲労性はんだ接合材並びに該接合材を使用した接合体 | |
| CN101537546A (zh) | 含Pr、Ni、Ga的Sn-Ag-Cu无铅钎料 | |
| JP3878305B2 (ja) | 高温はんだ付用Ｚｎ合金 | |
| WO2009143677A1 (zh) | 高熔点无铅焊料及其生产工艺 | |
| CN107262957A (zh) | 一种含Ge的光伏焊带用低温Sn‑Bi焊料及其制备方法 | |
| CN102642097A (zh) | 一种低银无铅钎料合金 | |
| JP2023079242A5 (enrdf_load_stackoverflow) | ||
| CN113579559A (zh) | 一种带有铟保护层的药芯银钎料及制备方法 | |
| CN102848100A (zh) | 含Nd、Ga的低银Sn-Ag-Cu无铅钎料 | |
| JP3835582B2 (ja) | 高温はんだ付用Ｚｎ合金 | |
| JP7386826B2 (ja) | 成形はんだ及び成形はんだの製造方法 | |
| JP2018069243A (ja) | Ａｕ−Ｓｎ−Ａｇ系はんだペースト並びにこのＡｕ−Ｓｎ−Ａｇ系はんだペーストを用いて接合もしくは封止された電子部品 | |
| JP6413668B2 (ja) | Ａｕ−Ｓｎ−Ａｇ系はんだ合金とはんだ材料並びにこのはんだ合金又ははんだ材料を用いて封止された電子部品及び電子部品搭載装置 | |
| KR100904656B1 (ko) | 웨이브 및 디핑용 무연 솔더 조성물과 이를 이용한 전자기기 및 인쇄회로기판 | |
| CN102848099B (zh) | 含Pr、Ga、Se的低银Sn-Ag-Cu无铅钎料 | |
| GB2431412A (en) | Lead-free solder alloy | |
| JPH0422595A (ja) | クリームはんだ | |
| CN100366376C (zh) | 含铈的Sn-Cu-Ni钎料 | |
| CN103753047B (zh) | 一种无铅钎料 |