JPH0534821B2 - - Google Patents

Info

Publication number
JPH0534821B2
JPH0534821B2 JP56138942A JP13894281A JPH0534821B2 JP H0534821 B2 JPH0534821 B2 JP H0534821B2 JP 56138942 A JP56138942 A JP 56138942A JP 13894281 A JP13894281 A JP 13894281A JP H0534821 B2 JPH0534821 B2 JP H0534821B2
Authority
JP
Japan
Prior art keywords
electric furnace
heat treatment
heat
soaking zone
furnace
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP56138942A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5840824A (ja
Inventor
Masaru Ogawa
Hideki Tsuya
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Electric Co Ltd filed Critical Nippon Electric Co Ltd
Priority to JP13894281A priority Critical patent/JPS5840824A/ja
Publication of JPS5840824A publication Critical patent/JPS5840824A/ja
Publication of JPH0534821B2 publication Critical patent/JPH0534821B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67098Apparatus for thermal treatment
    • H01L21/67115Apparatus for thermal treatment mainly by radiation

Landscapes

  • Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Formation Of Insulating Films (AREA)
JP13894281A 1981-09-03 1981-09-03 半導体ウエハの熱処理装置 Granted JPS5840824A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13894281A JPS5840824A (ja) 1981-09-03 1981-09-03 半導体ウエハの熱処理装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13894281A JPS5840824A (ja) 1981-09-03 1981-09-03 半導体ウエハの熱処理装置

Publications (2)

Publication Number Publication Date
JPS5840824A JPS5840824A (ja) 1983-03-09
JPH0534821B2 true JPH0534821B2 (enrdf_load_stackoverflow) 1993-05-25

Family

ID=15233747

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13894281A Granted JPS5840824A (ja) 1981-09-03 1981-09-03 半導体ウエハの熱処理装置

Country Status (1)

Country Link
JP (1) JPS5840824A (enrdf_load_stackoverflow)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6185821A (ja) * 1984-10-04 1986-05-01 Matsushita Electric Ind Co Ltd 気相成長方法
JP2644819B2 (ja) * 1988-05-06 1997-08-25 松下電子工業株式会社 加熱炉
JPH01296628A (ja) * 1988-05-25 1989-11-30 Fujitsu Ltd 半導体装置の製造装置及びその製造方法
JPH1197446A (ja) * 1997-09-18 1999-04-09 Tokyo Electron Ltd 縦型熱処理装置

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50118860U (enrdf_load_stackoverflow) * 1974-03-14 1975-09-29
JPS5143720U (enrdf_load_stackoverflow) * 1974-09-28 1976-03-31
JPS5472978A (en) * 1977-11-24 1979-06-11 Hitachi Ltd Heat treatment unit

Also Published As

Publication number Publication date
JPS5840824A (ja) 1983-03-09

Similar Documents

Publication Publication Date Title
US4449037A (en) Method and apparatus for heating semiconductor wafers
JPH0534821B2 (enrdf_load_stackoverflow)
JP2650908B2 (ja) 熱処理方法
JPS63283124A (ja) 反応炉
US6296709B1 (en) Temperature ramp for vertical diffusion furnace
JPS62140413A (ja) 縦型拡散装置
JP2693465B2 (ja) 半導体ウェハの処理装置
JPS63316428A (ja) 半導体ウェハ熱処理炉用ソフトランディングシステム
JP2649568B2 (ja) 加熱装置
JPS622616A (ja) 半導体ウエハ−の熱処理方法
JPS59108315A (ja) 半導体ウエハの拡散処理方法
JPS6379317A (ja) 熱処理装置
JPS60148124A (ja) 熱処理装置
JPS60107249A (ja) 半導体へのイオン注入処理装置
JPH01315131A (ja) 熱処理装置
JPS63128623A (ja) 熱処理制御用基板及びその使用方法
JPS6345376A (ja) ソフトランデイング装置
JP3498004B2 (ja) ウエハ熱処理装置及びその熱処理方法
JPS5935433A (ja) 半導体装置の熱処理方法
JPS59132616A (ja) 半導体ウエハの拡散処理装置
JPH0364911A (ja) 半導体装置の製造装置
JPS63160325A (ja) 半導体ウエハの熱処理方法および熱処理装置
JPH0640545B2 (ja) ウエハの熱処理方法
JPH0214515A (ja) 半導体製造用治具
JPS62123713A (ja) ウエハチヤ−ジ治具及びウエハ表面処理方法