JPH0530392Y2 - - Google Patents
Info
- Publication number
- JPH0530392Y2 JPH0530392Y2 JP1985003071U JP307185U JPH0530392Y2 JP H0530392 Y2 JPH0530392 Y2 JP H0530392Y2 JP 1985003071 U JP1985003071 U JP 1985003071U JP 307185 U JP307185 U JP 307185U JP H0530392 Y2 JPH0530392 Y2 JP H0530392Y2
- Authority
- JP
- Japan
- Prior art keywords
- heat
- filler
- adhesive
- circuit board
- heat dissipation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 230000017525 heat dissipation Effects 0.000 claims description 21
- 239000000853 adhesive Substances 0.000 claims description 16
- 230000001070 adhesive effect Effects 0.000 claims description 16
- 239000000945 filler Substances 0.000 claims description 13
- 239000004519 grease Substances 0.000 claims description 7
- 239000002184 metal Substances 0.000 claims description 4
- 229910052751 metal Inorganic materials 0.000 claims description 4
- 238000000034 method Methods 0.000 description 3
- 230000005855 radiation Effects 0.000 description 3
- 239000010949 copper Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985003071U JPH0530392Y2 ( ) | 1985-01-14 | 1985-01-14 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985003071U JPH0530392Y2 ( ) | 1985-01-14 | 1985-01-14 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61119396U JPS61119396U ( ) | 1986-07-28 |
| JPH0530392Y2 true JPH0530392Y2 ( ) | 1993-08-03 |
Family
ID=30477348
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985003071U Expired - Lifetime JPH0530392Y2 ( ) | 1985-01-14 | 1985-01-14 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0530392Y2 ( ) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4708755B2 (ja) * | 2004-10-04 | 2011-06-22 | 富士通テン株式会社 | 放熱材の規制構造 |
| JP5348121B2 (ja) * | 2010-12-21 | 2013-11-20 | 株式会社デンソー | 電子装置 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5950552A (ja) * | 1982-09-09 | 1984-03-23 | シ−メンス・アクチエンゲゼルシヤフト | 集積回路素子の冷却装置 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS50131956U ( ) * | 1974-04-15 | 1975-10-30 |
-
1985
- 1985-01-14 JP JP1985003071U patent/JPH0530392Y2/ja not_active Expired - Lifetime
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5950552A (ja) * | 1982-09-09 | 1984-03-23 | シ−メンス・アクチエンゲゼルシヤフト | 集積回路素子の冷却装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61119396U ( ) | 1986-07-28 |
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