JPH0530299B2 - - Google Patents

Info

Publication number
JPH0530299B2
JPH0530299B2 JP62019348A JP1934887A JPH0530299B2 JP H0530299 B2 JPH0530299 B2 JP H0530299B2 JP 62019348 A JP62019348 A JP 62019348A JP 1934887 A JP1934887 A JP 1934887A JP H0530299 B2 JPH0530299 B2 JP H0530299B2
Authority
JP
Japan
Prior art keywords
gas
wafer
susceptor
support
heat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP62019348A
Other languages
English (en)
Japanese (ja)
Other versions
JPS63186422A (ja
Inventor
Tadahiro Oomi
Masaru Umeda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to JP62019348A priority Critical patent/JPS63186422A/ja
Priority to US07/391,556 priority patent/US5119541A/en
Priority to PCT/JP1988/000067 priority patent/WO1993013548A1/ja
Publication of JPS63186422A publication Critical patent/JPS63186422A/ja
Publication of JPH0530299B2 publication Critical patent/JPH0530299B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10P72/7616—
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68757—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a coating or a hardness or a material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67103—Apparatus for thermal treatment mainly by conduction
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68771—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by supporting more than one semiconductor substrate
    • H10P72/0432—
    • H10P72/7621—
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00—Metal treatment
    • Y10S148/006—Apparatus

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP62019348A 1987-01-28 1987-01-28 ウエハサセプタ装置 Granted JPS63186422A (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP62019348A JPS63186422A (ja) 1987-01-28 1987-01-28 ウエハサセプタ装置
US07/391,556 US5119541A (en) 1987-01-28 1988-01-28 Wafer succeptor apparatus
PCT/JP1988/000067 WO1993013548A1 (fr) 1987-01-28 1988-01-28 Suscepteur de tranches

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62019348A JPS63186422A (ja) 1987-01-28 1987-01-28 ウエハサセプタ装置

Publications (2)

Publication Number Publication Date
JPS63186422A JPS63186422A (ja) 1988-08-02
JPH0530299B2 true JPH0530299B2 (en:Method) 1993-05-07

Family

ID=11996885

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62019348A Granted JPS63186422A (ja) 1987-01-28 1987-01-28 ウエハサセプタ装置

Country Status (3)

Country Link
US (1) US5119541A (en:Method)
JP (1) JPS63186422A (en:Method)
WO (1) WO1993013548A1 (en:Method)

Families Citing this family (33)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07118466B2 (ja) * 1988-12-26 1995-12-18 東芝セラミックス株式会社 サセプタ
US5306895A (en) * 1991-03-26 1994-04-26 Ngk Insulators, Ltd. Corrosion-resistant member for chemical apparatus using halogen series corrosive gas
US6090706A (en) * 1993-06-28 2000-07-18 Applied Materials, Inc. Preconditioning process for treating deposition chamber prior to deposition of tungsten silicide coating on active substrates therein
US5482749A (en) * 1993-06-28 1996-01-09 Applied Materials, Inc. Pretreatment process for treating aluminum-bearing surfaces of deposition chamber prior to deposition of tungsten silicide coating on substrate therein
JP2701767B2 (ja) * 1995-01-27 1998-01-21 日本電気株式会社 気相成長装置
SE9500326D0 (sv) * 1995-01-31 1995-01-31 Abb Research Ltd Method for protecting the susceptor during epitaxial growth by CVD and a device for epitaxial growth by CVD
US6086680A (en) * 1995-08-22 2000-07-11 Asm America, Inc. Low-mass susceptor
JPH10511507A (ja) * 1995-10-20 1998-11-04 フィリップス エレクトロニクス ネムローゼ フェンノートシャップ 選択的に堆積された半導体領域を有する半導体装置の製造
EP1036406B1 (en) * 1997-11-03 2003-04-02 ASM America, Inc. Improved low mass wafer support system
US6410172B1 (en) 1999-11-23 2002-06-25 Advanced Ceramics Corporation Articles coated with aluminum nitride by chemical vapor deposition
JP4374156B2 (ja) * 2000-09-01 2009-12-02 日本碍子株式会社 Ｉｉｉ−ｖ族窒化物膜の製造装置及び製造方法
JP3579344B2 (ja) * 2000-11-15 2004-10-20 日本碍子株式会社 Ｉｉｉｖ族窒化物膜の製造方法および製造装置
US20050170314A1 (en) * 2002-11-27 2005-08-04 Richard Golden Dental pliers design with offsetting jaw and pad elements for assisting in removing upper and lower teeth and method for removing teeth utilizing the dental plier design
US8603248B2 (en) * 2006-02-10 2013-12-10 Veeco Instruments Inc. System and method for varying wafer surface temperature via wafer-carrier temperature offset
US8460764B2 (en) * 2008-03-06 2013-06-11 Georgia Tech Research Corporation Method and apparatus for producing ultra-thin graphitic layers
JP5200171B2 (ja) * 2008-08-29 2013-05-15 ビーコ・インストゥルメンツ・インコーポレイテッド ウエハキャリア、化学蒸着装置、および、ウエハを処理する方法
US8801857B2 (en) 2008-10-31 2014-08-12 Asm America, Inc. Self-centering susceptor ring assembly
US20110185969A1 (en) * 2009-08-21 2011-08-04 Varian Semiconductor Equipment Associates, Inc. Dual heating for precise wafer temperature control
US10316412B2 (en) 2012-04-18 2019-06-11 Veeco Instruments Inc. Wafter carrier for chemical vapor deposition systems
US10167571B2 (en) 2013-03-15 2019-01-01 Veeco Instruments Inc. Wafer carrier having provisions for improving heating uniformity in chemical vapor deposition systems
KR20160111521A (ko) 2014-01-27 2016-09-26 비코 인스트루먼츠 인코포레이티드 화학적 기상 증착 시스템을 위한 복합 반경들을 갖는 유지 포켓들을 구비한 웨이퍼 캐리어
USD920936S1 (en) 2019-01-17 2021-06-01 Asm Ip Holding B.V. Higher temperature vented susceptor
USD914620S1 (en) 2019-01-17 2021-03-30 Asm Ip Holding B.V. Vented susceptor
US11961756B2 (en) 2019-01-17 2024-04-16 Asm Ip Holding B.V. Vented susceptor
TWI845682B (zh) 2019-05-22 2024-06-21 荷蘭商Ａｓｍ Ｉｐ私人控股有限公司 工件基座主體
JP7379993B2 (ja) * 2019-09-20 2023-11-15 東京エレクトロン株式会社 エッチング装置及びエッチング方法
CN112599463B (zh) * 2019-10-02 2024-01-19 佳能株式会社 晶片卡盘、其生产方法和曝光装置
US11764101B2 (en) 2019-10-24 2023-09-19 ASM IP Holding, B.V. Susceptor for semiconductor substrate processing
TWI888578B (zh) 2020-06-23 2025-07-01 荷蘭商Ａｓｍ Ｉｐ私人控股有限公司 基座及反應腔室
USD1031676S1 (en) 2020-12-04 2024-06-18 Asm Ip Holding B.V. Combined susceptor, support, and lift system
CN112687597B (zh) * 2020-12-25 2022-08-05 集美大学 一种高温基片退火架
USD1030687S1 (en) * 2022-05-31 2024-06-11 Asm Ip Holding B.V. Susceptor
USD1067204S1 (en) * 2022-05-31 2025-03-18 Asm Ip Holding B.V. Susceptor

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3783822A (en) * 1972-05-10 1974-01-08 J Wollam Apparatus for use in deposition of films from a vapor phase
JPS50747A (en:Method) * 1973-05-02 1975-01-07
US3980854A (en) * 1974-11-15 1976-09-14 Rca Corporation Graphite susceptor structure for inductively heating semiconductor wafers
JPS5185649U (en:Method) * 1974-12-28 1976-07-09
JPS5185649A (ja) * 1975-01-24 1976-07-27 Nippon Signal Co Ltd Kinsentorokuki
JPS5381069A (en) * 1976-12-27 1978-07-18 Hitachi Ltd Production of susceptor in cvd device
JPS62205619A (ja) * 1986-03-06 1987-09-10 Dainippon Screen Mfg Co Ltd 半導体の加熱方法及びその方法に使用されるサセプタ
US4858558A (en) * 1988-01-25 1989-08-22 Nippon Kokan Kabushiki Kaisha Film forming apparatus

Also Published As

Publication number Publication date
US5119541A (en) 1992-06-09
WO1993013548A1 (fr) 1993-07-08
JPS63186422A (ja) 1988-08-02

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