JPH0530054B2 - - Google Patents

Info

Publication number
JPH0530054B2
JPH0530054B2 JP57194735A JP19473582A JPH0530054B2 JP H0530054 B2 JPH0530054 B2 JP H0530054B2 JP 57194735 A JP57194735 A JP 57194735A JP 19473582 A JP19473582 A JP 19473582A JP H0530054 B2 JPH0530054 B2 JP H0530054B2
Authority
JP
Japan
Prior art keywords
pattern
film
semiconductor device
manufacturing
photoresist
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP57194735A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5984550A (ja
Inventor
Masaru Myazaki
Susumu Takahashi
Takahiro Kobashi
Kiichi Kamyanagi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP19473582A priority Critical patent/JPS5984550A/ja
Publication of JPS5984550A publication Critical patent/JPS5984550A/ja
Publication of JPH0530054B2 publication Critical patent/JPH0530054B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Electrodes Of Semiconductors (AREA)
  • Drying Of Semiconductors (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Weting (AREA)
JP19473582A 1982-11-08 1982-11-08 半導体装置の製法 Granted JPS5984550A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP19473582A JPS5984550A (ja) 1982-11-08 1982-11-08 半導体装置の製法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19473582A JPS5984550A (ja) 1982-11-08 1982-11-08 半導体装置の製法

Publications (2)

Publication Number Publication Date
JPS5984550A JPS5984550A (ja) 1984-05-16
JPH0530054B2 true JPH0530054B2 (cs) 1993-05-07

Family

ID=16329355

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19473582A Granted JPS5984550A (ja) 1982-11-08 1982-11-08 半導体装置の製法

Country Status (1)

Country Link
JP (1) JPS5984550A (cs)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102011075888B4 (de) * 2011-05-16 2014-07-10 Robert Bosch Gmbh Halbleitervorrichtung mit mindestens einem Kontakt und Herstellungsverfahren für eine Halbleitervorrichtung mit mindestens einem Kontakt

Also Published As

Publication number Publication date
JPS5984550A (ja) 1984-05-16

Similar Documents

Publication Publication Date Title
JP2822430B2 (ja) 層間絶縁膜の形成方法
US4988403A (en) Method of forming patterned silicone rubber layer
JPH0530054B2 (cs)
JPS59141222A (ja) 半導体装置の製造方法
JP2503256B2 (ja) パタ―ン形成方法
JP3349001B2 (ja) 金属膜の形成方法
JPS62149138A (ja) 半導体装置の製造方法
JPH0621432A (ja) 半導体装置の製造方法
JPS61172336A (ja) 半導体装置電極開口部の形成方法
JPH04124822A (ja) 半導体装置の製造方法
JPS6336547A (ja) 半導体装置の製造方法
JPS5984442A (ja) 半導体装置の製造方法
JPS6193629A (ja) 半導体装置の製造方法
JPH0364933A (ja) 半導体装置の製造方法
JPH05283537A (ja) 半導体装置の製造方法
JPS61224425A (ja) 半導体装置のパタ−ン形成方法
JPS6020517A (ja) 半導体装置の製造法
JPS6386453A (ja) 半導体装置の製造方法
JPS6226843A (ja) 電極金属配線パタ−ンの形成方法
JPS59211249A (ja) 配線形成方法
KR19990062216A (ko) 반도체 장치의 결함 처리 방법
JPH02103937A (ja) 半導体装置の製造方法
JPH07240421A (ja) 半導体装置の配線形成方法
JPS61244026A (ja) 半導体装置の製造方法
JPH0350828A (ja) 金配線の形成方法