JPH05299886A - Electronic component mounter - Google Patents

Abstract

PURPOSE:To speed up electronic component mounting by using a predetermined one of a plurality of cut parts in the case where a next selected component supply unit of the component supply part agrees with a preceeding selected component supply unit and by using a cut part different from a predetermined cut part in the case of disagreement to cut tapes. CONSTITUTION:Many component supply units 12 are arranged in parallel on a transfer table 11, so as to transfer an arbitrary component supply unit 12 for positioning at a predetermined component supply position 13. In the case where a next selected component supply unit 12 agrees with a preceeding selected component supply unit in the transfer table 11, this table does not transfer but stops. At this time, a main cutter 25 operates to cut a taping component 15. In the case of disagreement, the transfer table 11 transfers to position a next selected component supply unit 12. At this time, the taping component 15 is cut by a subcutter 10a or 10b.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component mounting apparatus used when an electronic component is adsorbed and mounted on a circuit board.

[0002]

2. Description of the Related Art Conventionally, as an electronic component mounting apparatus for mounting electronic components on a circuit board, a plurality of component supply units accommodating a large number of electronic components are arranged in parallel on a movable table and the movable table is supplied. By configuring the units to be movable in the parallel direction, the electronic components housed in an arbitrary component supply unit at a predetermined position can be installed so as to be taken out. After the parts are taken out at the predetermined parts taking-out position, the parts supply unit intermittently feeds the taped electronic parts at equal intervals to prepare for the next parts taking-out.
The empty tape after the parts are taken out is synchronized with the parts taking out, the intermittent feeding of the tape, etc., and is cut into small pieces by a cutter installed in front of the parts taking-out position.
Further, a means for positioning the supplied circuit board is provided so that the position where the electronic component of the circuit board should be mounted comes to a predetermined position, and the electronic component taken out at the predetermined component take-out position is mounted on the mounting member. The electronic component mounting means is provided.

FIG. 7 is a front view of a cutting portion in the conventional electronic component mounting apparatus, and FIG. 8 is a side view of the cutting portion in the electronic component mounting apparatus of FIG. 7 and 8, the cutting unit 1 is driven by a cam 4 via a link mechanism of a rod 2 and a lever 3. This cutting part 1
Is designed such that the tape is cut by the cutting unit 1 after the intermittent feeding of the electronic components is finished and before the movement of the moving table is started, as shown in the timing chart of FIG. With the current standard mounting machine with a mounting tact of 0.18 seconds, it takes about 25 msec to cut the tape by the cutting unit 1.

[0004]

However, in the above-described conventional electronic component mounting apparatus, it is difficult to shorten the time spent for the movement of the moving table, the component removal, the tape feeding, and the tape cutting, and the electronic component mounting is speeded up. It is a big problem in trying.

The present invention solves the above conventional problems, and an object of the present invention is to provide an electronic component mounting apparatus capable of increasing the electronic component mounting speed.

[0006]

In order to solve the above problems, the electronic component mounting apparatus of the present invention includes a plurality of component supply units for sequentially feeding a plurality of components housed in a tape at equal intervals to a predetermined component take-out position. A component supply unit that is arranged in parallel on the moving table and moves the moving table in the parallel direction of the component supply unit to select the component supply unit, and a circuit board positioning unit that positions the circuit board on which the component is mounted. A component mounting means for taking out the component at a predetermined component take-out position of the component supply unit selected by the component supply unit and mounting the component on the circuit board positioned by the circuit board positioning means; The tape from any of the component supply units is installed parallel to the moving direction with respect to the component supply unit. It is obtained by a cross possible plurality of cutting portions.

In the plurality of cutting parts of the electronic component mounting apparatus of the present invention, when the component supply unit selected next by the component supply part matches the previously selected component supply unit, a predetermined one of the plurality of cutting parts is selected. The tape cutting is performed by using a cutting section of No. 2 and a cutting section different from the predetermined cutting section when different.

[0008]

With the above structure, when the component supply unit selected next in the component supply unit matches the component supply unit selected last time in the plurality of cutting units, a predetermined cutting unit is used among the plurality of cutting units, If the tape is cut using a different cutting part from the specified cutting part when different, the cutting part is installed parallel to the moving direction of the moving table for each parts feeding unit, Since the tape can be cut, if different tape cutting methods and conditions are given to each of the multiple cutting parts, the tape cutting timing limit can be reduced and the tape cutting can be overlapped with other operations. Therefore, the electronic component mounting speed can be increased.

[0009]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings. 1 is a schematic plan view of an electronic component mounting apparatus showing an embodiment of the present invention, FIG. 2 is a schematic perspective view of the electronic component mounting apparatus of FIG. 1, and FIG. 3 is an electronic component mounting apparatus of FIG. 3 is a side view showing a state in which the component supply unit 12 of FIG. 1, 2 and 3
In the moving table 11, a large number of parts supply units
12 are arranged in parallel, and the arrow Z indicates that any component supply unit 12 can be positioned at a predetermined component supply position 13.
It is configured to be movable in any direction. This parts supply unit
The taping component 15 in which the electronic components 14 are accommodated in a row at equal intervals is configured to be intermittently feedable. The component supply unit is configured as described above, and a plurality of electronic components 14 accommodated in the tape at equal intervals are provided at a component supply position 13 that is a predetermined component extraction position.
A plurality of component supply units 12 to be sequentially sent to the moving table 11 are installed in parallel and installed on the moving table 11.
11 is configured to move in the parallel direction of the component supply unit 12.

Further, a plurality of suction nozzles 16 are arranged at equal intervals on a rotary table 17 which can be intermittently rotated in the direction of arrow A, and can move vertically at a predetermined position to suck and mount the electronic component 14. Is configured. Further, the component position regulation unit 18 regulates the position of the sucked electronic component 14. Furthermore, the component position θ rotation unit 19 can rotate the electronic component 14 at an arbitrary angle in the direction of the arrow B.
The component mounting means is configured as described above, and is configured to take out the electronic component 14 at the predetermined position 13 of the component supply unit and mount it at the predetermined position.

Further, the XY table 20 can be moved in the X and Y directions by a driving means (not shown) on which a circuit board 21 is placed, and an arbitrary position of the circuit board 21 can be mounted at a component mounting position. It is configured so that it can be positioned to 22. This constitutes a circuit board positioning means, and positions the circuit board 21 on which components are mounted.

Further, the nozzle θ rotation return section 23 is indicated by an arrow C.
To return the suction nozzle 16 to the original origin angle. Further, the feed lever 24 is operated immediately after the suction nozzle 16 sucks the electronic component 14 by a driving means (not shown) to intermittently feed the taping component 15. Further, a plurality of main cutters 25 and sub-cutters 26a and 26b serving as cutting units are installed in parallel with the moving direction of the moving table 11 to cut the tape. Use the main cutter 25 if it matches the supply unit 12,
If they are different, the sub cutters 26a and 26b are used.

FIG. 4 is a front view of the cutting portion in the electronic component mounting apparatus of FIG. 1, and FIG. 5 is a side view of the cutting portion of the electronic component mounting apparatus of FIG. In FIGS. 4 and 5, the main cutter 25, which is a cutting portion, is composed of a fixed blade and a movable blade, and the movable blade is supported so as to be slidable up and down. The movable blade is vertically driven by a cam 31 via a rod 27, a lever 28, a rod 29, and a lever 30. A stopper pin 32 is attached to the lever 30, and the cylinder 33 moves up to act the stopper 34, so that the operation of the lever 30 can be stopped. Therefore, the stopper 34 can be used to freely select the operation or non-operation of the main cutter 25. Also a sub cutter
Similar to the main cutter 25, 26a and 26b also include fixed blades and movable blades, and the movable blades are supported so as to be slidable up and down. Each of these movable blades is continuously driven up and down by a motor 35 so that the tape can be cut while the moving table 11 is operating. In addition, 36 is a cam shaft, and 37
Is a spring.

With the above configuration, the operation will be described below. First, the moving table 11 is an optional component supply unit 12
Is selected to position at a predetermined component supply position 13, which is the component take-out position. The suction nozzle 16 descends to a predetermined component supply position 13 and sucks the electronic component 14 to ascend. The suction nozzle 16 that has sucked the electronic component 14 has its component position regulated by a component position regulating unit 18, and further rotates the electronic component 14 at an arbitrary mounting angle at a component position θ rotation position 19. And X
The Y table 20 moves an arbitrary position of the circuit board 21 on the XY table 20 to the component mounting position 22. Further, the suction nozzle 16 mounts the electronic component 14 on the circuit board 21 at the component mounting position 22, further restores the nozzle angle to the original origin angle by the nozzle θ rotation return section 23, and then returns to the initial position. ..

Further, the suction nozzle 16 has a component supply unit 12
After picking up parts from the and rising, the feed lever 24 operates to intermittently feed the taping parts 15,
15 goes into the main cutter 25. After that, when the component supply unit 12 selected next on the movement table 11 matches the previously selected component supply unit 12, the movement table 11 is stopped without moving. At this time, the main cutter 25 operates to cut the taping component 15. Also, the component supply unit selected next on the moving table 11.
If 12 is different from the previously selected component supply unit 12, the moving table 11 moves, so the main cutter 25 is stopped by the stopper 34 and the taping component 15 is not cut by the main cutter 25. Then, the moving table 11 moves to position the next selected component supply unit 12. At this time, the taping component 15 that has entered the main cutter 25 is cut by the sub cutter 10a or 10b that is continuously operating.

As described above, since the cutting portions are installed in parallel with the moving direction of the moving table 11 with respect to the component supplying unit 12 so that the tape from the arbitrary component supplying unit 12 can be cut, the moving table 11 can be cut. With respect to the timings of the above operation, the component removal, the tape feeding, and the tape cutting, the tape cutting and the operation of the moving table 11 can overlap each other, and as shown in FIG.

[0017]

As described above, according to the present invention, the tape cutting operation and the movement table operation can be overlapped, and the electronic component mounting speed can be increased. Further, when operating the electronic component mounting apparatus with the same mounting tact as the conventional one, it is possible to improve the component pick-up rate by increasing the component take-out time and improve the reliability, and to reduce the movement table operating time. By increasing the length of time, the movable distance of the movable table can be increased, and even IC components having large intervals between component supply units can be mounted with the same tact.

[Brief description of drawings]

FIG. 1 is a schematic plan view of an electronic component mounting apparatus showing an embodiment of the present invention.

FIG. 2 is a schematic perspective view of the electronic component mounting apparatus of FIG.

3 is a component supply unit 12 of the electronic component mounting apparatus of FIG.
FIG. 3 is a side view showing a state in which is mounted on a moving table 11.

FIG. 4 is a front view of a cutting portion in the electronic component mounting apparatus of FIG.

5 is a side view of a cutting portion in the electronic component mounting apparatus of FIG.

6 is a timing chart showing an operation of the electronic component mounting apparatus of FIG.

FIG. 7 is a front view of a cutting portion in a conventional electronic component mounting apparatus.

8 is a side view of a cutting part in the electronic component mounting apparatus of FIG.

FIG. 9 is a timing chart showing the operation of the conventional electronic component mounting apparatus.

[Explanation of symbols]

 11 Moving table 12 Component supply unit 13 Component supply position 14 Electronic component 15 Taping component 16 Suction nozzle 17 Rotating table 18 Component position regulating part 19 Component position θ Rotating part 20 XY table 21 Circuit board 22 Component mounting position 24 Feed lever 25 Main cutter 26a, 26b Sub cutter 27, 29 Rod 28, 30 Lever 31 Cam 32 Stopper pin 33 Cylinder 34 Stopper 35 Motor

Front page continuation (72) Inventor Takahiro Yonezawa 1006 Kadoma, Kadoma, Osaka Prefecture Matsushita Electric Industrial Co., Ltd. Person Chimura Naohiko 1006 Kadoma, Kadoma-shi, Osaka Prefecture Matsushita Electric Industrial Co., Ltd.

Claims (2)

[Claims] 1. A plurality of component supply units for sequentially feeding a plurality of components accommodated in a tape at equal intervals to a predetermined component take-out position are arranged in parallel on a moving table, and the moving table is arranged in a parallel direction of the component supplying units. A component supply unit that moves to select the component supply unit, a circuit board positioning unit that positions a circuit board on which the component is mounted, and a predetermined component extraction position of the component supply unit selected by the component supply unit. The component mounting means for taking out the component and mounting it on the circuit board positioned by the circuit board positioning means, and the arbitrary component mounted on the component supply unit in parallel with the moving direction of the moving table. An electronic component mounting apparatus comprising: a plurality of cutting units capable of cutting a tape from a supply unit. 2. A plurality of cutting units, wherein a predetermined cutting unit of the plurality of cutting units is used when a component supply unit selected next by the component supply unit matches the previously selected component supply unit, and different. The electronic component mounting apparatus according to claim 1, wherein the tape is cut by using a cutting section different from the predetermined cutting section in this case.