JP3996280B2 - Component mounting machine and component mounting method - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a component mounting machine and a component mounting method provided with a top tape processing apparatus that peels off a top tape of a taping component containing an electronic component and processes the top tape.
[0002]
[Prior art]
Conventionally, as this type of component mounter, for example, a component mounter including a component supply device 133 shown in FIG. 6 is provided.
[0003]
In this component mounting machine, the electronic components 25 sequentially delivered from the component supply device 133 shown in FIG. 6 are sucked by the component suction nozzle 135 of the mounting and holding device 134, and sequentially by the component recognition camera 140 by the intermittent rotation motion of the mounting and holding device 134. After recognizing the posture of the electronic component 25 and correcting the posture of the electronic component 25, the electronic component 25 is mounted at a predetermined position on the substrate 137 held by the substrate holding XY table 136.
[0004]
FIG. 4 shows a taping component 28 in which the electronic component 25 is housed. The electronic component 25 is covered and covered with the top tape 2 until it reaches the component take-out device (not shown) to prevent the electronic component 25 from popping out. However, by the time it reaches the take-out position, it is peeled off in the direction of arrow C shown in FIG.
[0005]
When this winding progresses and the top reel 2 is full with the top tape 2 wound around, usually, the take-up reel 129 is removed and the top tape 2 is unwound and discarded. It is set on the take-up reel 129.
[0006]
Since this operation is performed by a worker's hand, the component supply device 133 cannot be used on the component mounter during this operation.
[0007]
[Problems to be solved by the invention]
As described above, conventionally, since the top tape 2 is wound around the take-up reel 129, the winding amount of the top tape 2 is inevitably limited.
[0008]
Accordingly, the component supply device 133 cannot supply the electronic component 25 to the component mounter when the component is out of stock and the winding amount of the top tape 2 is full in the take-up reel 129.
[0009]
In the case of out of parts, the same electronic component 25 can be set in another part supply device 133 in advance, and can be dealt with by immediately exchanging when the out of parts occur.
[0010]
However, when the winding amount of the top tape 2 on the winding reel 129 becomes full, the amount cannot be detected or grasped on the component mounter side, so it depends on the operator's sense. .
[0011]
In addition, since the work of unwinding the top tape 2 fully wound on the take-up reel 129 and the work of setting the top tape 2 on the take-up reel 129 again takes several minutes, the process of automatic mounting process is advanced. Among them, it is a factor that refuses to improve productivity.
[0012]
The present invention has been made in view of the above-described conventional circumstances, and can be structured such that the top tape winding process is eliminated, and the downtime of the equipment can be reduced by eliminating the winding work, thereby increasing the productivity. It can be improved, and its object is to provide a part products mounter and component mounting method Ru can facilitate the automation of the mounting process of electronic components.
[0013]
[Means for Solving the Problems]
In order to achieve the above object, the component mounter of the present invention includes a component supply unit in which a plurality of component supply devices each equipped with a taping component are installed, a component supply unit drive unit that moves the component supply unit, A top tape processing unit comprising: a mounting holding unit including a suction nozzle; and a top tape processing unit disposed between the component supply unit and the mounting holding unit and movable to a top tape processing position of a desired component supply device. Is equipped with a suction means that sucks when the top tape of the taping part is peeled off and reaches a predetermined length, and a cutter part that cuts the top tape that is being sucked by this suction means. The cutter part is fixed It is characterized by comprising a blade and a rotary blade whose rotation center line is substantially parallel to the width direction of the top tape and whose cut point moves in the width direction of the top tape as it rotates .
[0014]
In the component mounting method of the present invention, the desired component supply device is moved to the component removal position by the suction nozzle of the mounting holder, and the top tape of the taping component is peeled off before the component removal position by the component supply device. In the component mounting method in which the electronic component housed in the taping component is supplied to the component pick-up position and the supplied electronic component is mounted on the substrate by the suction nozzle of the mounting holder, the peeled top tape is predetermined every time the component is supplied. The top tape processing section that processes the peeled top tape is moved to the top tape processing position of the desired component supply device, and the top tape processing section is used when the sent top tape reaches a predetermined length. Aspirate the top tape in the suction state with the fixed blade and the rotation center line almost parallel to the width direction of the top tape, and the cut point will be It is characterized by cutting by a rotary blade which moves in the width direction of the tape.
[0016]
Further, the component supply device has a feed path mechanism for passing the peeled top tape between the gear of the geared lever and the gear meshing with the gear, and the geared lever is reciprocally rotated for each component feeding operation and the gear is The tape is rotated only in the tape feeding direction, and it is preferable that the peeled top tape is fed between the gears of the geared lever and the gears meshed therewith for each part feeding operation.
[0017]
According to the component mounting machine and the component mounting method of the present invention, when the top tape is peeled off and reaches a predetermined length, it is cut and processed by the cutter unit while sucking. The structure without the winding process can be obtained, the winding operation can be eliminated, the downtime of the equipment can be reduced, the productivity can be improved, and the automation of the mounting process of the electronic component can be promoted.
[0018]
Also , it is possible to smoothly feed the top tape to the cutter portion of the top tape processing device by the feed path mechanism by the component supply device, cut the top tape by this cutter portion, and suction the cut top tape by the suction means. Therefore, the component mounter is not stopped due to the top tape processing as in the prior art, and the productivity can be improved.
[0019]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, embodiments of the present invention will be described with reference to the drawings.
[0020]
1 is a side view showing a top tape processing apparatus and a component supply apparatus according to an embodiment of the present invention, FIG. 2 (a) is a view taken along line AA in FIG. 1, and (b) is a view taken along line BB. FIG. 3 is a perspective view of the component mounting machine of the embodiment, and FIG. 4 is a perspective view of the taping component in a state where the top tape is peeled from a state where the electronic component is accommodated and covered with the top tape.
[0021]
As shown in FIG. 4, the taping component 28 used in the present embodiment is formed in a band shape, and an electronic component 25 is placed in each of a plurality of component sealing holes 26 provided in the longitudinal direction. The top tape 2 is pasted to enclose the electronic component 25, and a plurality of feed holes 27 are formed in the longitudinal direction at the sides of the plurality of component encapsulating holes 26 to peel off the top tape 2. Thus, the electronic component 25 placed in the component sealing hole 26 is exposed and taken out.
[0022]
The component mounter 10 according to the present embodiment shown in FIG. 3 is a component that stores a plurality of electronic components 25 in a taping component 28 and supplies the electronic components 25 in a state of being stored in the taping component 28 as necessary. A component supply unit 1 having a component supply device 3 equipped with a plurality of storage cassettes 4 according to the type of the electronic component 25, and a taped component 28 from each component supply device 3 are peeled off and supplied from the top tape 2. A rotary head 12 having a plurality of suction nozzles 11 for mounting the electronic component 25 at predetermined positions in the X and Y directions of the printed circuit board 37, and a top disposed between the component supply device 3 and the suction nozzle 11. A tape processing device 9 is provided.
[0023]
Then, the top tape 2 supplied from the component supply device 3 and peeled off from the taping component 28 is sucked by the suction means provided with the suction duct 16, and is cut by the cutter portion 34 (see FIG. 1) of the top tape processing device 9. It is cut and sucked.
[0024]
In addition, as shown in FIG. 3, each component supply device 3 moves the table 6 on which the component supply device 3 is placed in the X direction by the rotation of the screw shaft 22 driven by the rotation drive unit 111. It is configured to be sequentially transferred to the position of the top tape processing device 9.
[0025]
In FIG. 3, reference numeral 8 is a controller for controlling each drive unit of the component mounting machine 10, and reference numeral 7 is a casing that covers a portion in which the suction nozzle 11 is equipped.
[0026]
Next, specific configurations and operations of the component supply device 3 and the top tape processing device 9 of the present embodiment will be described with reference to FIGS. 1 and 2.
[0027]
The taping component 28 sent out from the tape reel 13 'of the component supply device 3 is advanced by a vertical movement by driving from the outside of the lever 114 of the crank mechanism, and is sequentially sent to the component pick-up position a. Yes.
[0028]
At this time, the top tape 2 is peeled off as shown in FIG. 4 before the component take-out position a, and the path shown by the solid line in FIG. 1 is sent between the two geared levers 7 and 8 through a plurality of guide rollers. It is configured to be.
[0029]
Here, by the downward movement of the lever 114, the laterally substantially T-shaped T-shaped lever 5 rotates in the direction of arrow D around the pivot 5a in FIG. The protruding arm portion 7a that rotates integrally with the spring 7 is urged by the spring 10 'and rotates counterclockwise. As a result, the levers 7 and 8 with the gears rotate, and the top tape 2 has the above-described feed path. It is configured to be sent out to the left in FIG. 1 along the mechanism 71. Reference numeral 9 'denotes a spring for engaging the geared lever 8 with the geared lever 7.
[0030]
A one-way clutch (not shown) is built in between the levers 7 and 8 with both gears, and the gear is configured to rotate only in the direction of feeding the top tape 2 (left direction in FIG. 1). .
[0031]
Therefore, when the lever 114 is lifted by the urging force of the spring 6 attached to the lower end of the T-shaped lever 5, the gears 7 and 8 do not rotate, and only the lever 114 returns to the original angular position. Has been.
[0032]
The top tape processing device 9 moves in the X direction as shown in FIG. 3 and moves to a position facing the component supply device 3 that needs to process the top tape 2. When the top tape 2 reaches the opening 12 ′ of the top tape processing device 9 and the component supply device 3 is positioned at the component take-out position of the rotary head 12 (see FIG. 3), the top tape 2 is cut scrap suction duct. 16 is sucked to the suction duct 16 side by the negative pressure applied to it, and in this state, it is cut by the engagement of the rotary blade 13 and the fixed blade 14, and after this cutting, the top tape 2 is sucked into the scrap waste suction duct 16 and processed. It is comprised so that.
[0033]
The rotation center line of the rotary blade 13 is substantially parallel to the width direction of the top tape 2, and the cut point that is the contact point between the rotary blade 13 and the fixed blade 14 is changed from one end of the top tape 2 as the rotary blade 13 rotates. It is configured to move toward the edge. Further, the rotary blade 13 and the fixed blade 14 are configured such that the vertical position of the fixed blade 14 is adjusted by the adjusting bolt 15 so that the gap between them is approximately 0 mm. Further, as shown in FIG. 2A, the rotary blade 13 is provided so as to intersect with the small angle θ with respect to the fixed blade 14, and the top tape 2 is sequentially moved from one end to the other end as described above. It is configured to cut. This is for improving the cutting property of the top tape 2.
[0034]
The rotating blade 13 is supported at both ends by a plurality of bearings 21 as shown in FIG. 2A, and from the pulley 24 to the pulley 23 of the drive motor 20 as shown in FIGS. Are connected to each other via a timing belt 17 and are driven to rotate by driving of a drive motor 20. The drive motor 20 is preferably rotated at all times or when necessary.
[0035]
Thus, the top tape 2 can be continuously cut by the rotary blade 13 and the fixed blade 14.
[0036]
FIG. 3 shows a state in which a plurality of types of component supply devices 3 are mounted and the top tape processing device 9 is set on the component removal position. The scrap of the top tape 2 cut by the rotary blade 13 and the fixed blade 14 is configured to be collected from the cut waste suction duct 16 via a suction hose (not shown).
[0037]
According to the present type state, in a state where the top tape 2 is peeled, predetermined upon reaching a length, a negative pressure is cut by a cutter unit 34 comprising a rotary blade 13 and the fixed blade 14 while being sucked by scraps Is recovered from the suction duct 16 via the suction hose and processed, so that the structure of eliminating the winding process of the top tape 2 can be eliminated, and the downtime of the equipment can be reduced by eliminating the winding work. Productivity can be improved, and automation of the mounting process for electronic components can be promoted.
[0038]
Moreover, smooth feeding to the cutter portion 34 of the top tape processing device 9 by part article feeder 3 along path mechanism 71 sends the top tape 2, cutting the top tape 2 by the cutter unit 34, is the cutting top Since the tape 2 can be sucked by negative pressure with the suction means consisting of the cut waste suction duct 16 and the suction hose, there is no need to stop the component mounting machine due to the top tape processing as in the past, and the productivity is improved. Can be made.
[0039]
【The invention's effect】
As described above, according to the present invention, it is possible to provide a structure that eliminates the winding process of the top tape, to reduce the downtime of the equipment by eliminating the winding work, and to improve the productivity. It is possible to promote automation of the mounting process.
[Brief description of the drawings]
FIG. 1 is a side view showing a top tape processing apparatus and a component supply apparatus according to an embodiment of the present invention.
2A is a view taken along the line AA in FIG. 1, and FIG. 2B is a view taken along the line BB.
FIG. 3 is a perspective view of the component mounter according to the embodiment of the present invention.
FIG. 4 is a perspective view of a taping component in a state where the top tape is removed from a state where the electronic component is stored and covered with the top tape.
FIG. 5 is a side view showing an example of a conventional component supply apparatus.
FIG. 6 is a perspective view showing an example of a component mounter including a conventional component supply apparatus.
[Explanation of symbols]
2 Top tape 3 Component supply device 9 Top tape processing device 10 Component mounter 13 Rotating blade 14 Fixed blade 16 Suction duct (suction means)
28 Taping part 34 Cutter part 71 Feed path mechanism

Claims (5)

  A component supply unit provided with a plurality of component supply devices each equipped with a taping component, a component supply unit driving unit that moves the component supply unit, a mounting holding unit equipped with a suction nozzle, and a component supplying unit and mounting holding A top tape processing unit disposed between the parts and movable to a top tape processing position of a desired component supply device. The top tape processing unit has a predetermined length with the top tape of the taping component peeled off. A suction means for sucking when it reaches, and a cutter part for cutting the top tape sucked by the suction means. The cutter part has a fixed blade and a rotation center line substantially parallel to the width direction of the top tape. A component mounting machine comprising a rotary blade whose cut point moves in the width direction of the top tape as it rotates.   The component supply device has a feed path mechanism for passing the peeled top tape between the gear of the geared lever and the gear meshing with the gear, and the geared lever is rotated back and forth for each component feeding operation, and the gear is 2. The component mounting machine according to claim 1, wherein the component mounting machine rotates only in a feeding direction.   2. The component mounting machine according to claim 1, wherein the rotary blade of the cutter unit is arranged to intersect with the fixed blade at a minute angle.   Move the desired component supply device to the component take-out position by the suction nozzle of the mounting holder, and remove the electronic tape stored in the taping component with the top tape of the taping component peeled off before the component take-out position by the component supply device. In the component mounting method in which the supplied electronic component is mounted on the substrate by the suction nozzle of the mounting holding unit, the peeled top tape is sent to a predetermined path every time the component is supplied, and the peeled top tape is The top tape processing section to be processed is moved to the top tape processing position of the desired component supply device, the top tape processing section sucks when the sent top tape reaches a predetermined length, and the sucked top tape is Rotation in which the fixed blade and the rotation center line are almost parallel to the width direction of the top tape, and the cut point moves in the width direction of the top tape as it rotates. Component mounting method characterized by cutting at.   The stripped top tape is fed back and forth between the gears of the geared lever having a gear that rotates reciprocally for each part feeding operation and rotates only in one direction and the gear meshing therewith, and is sent every part feeding operation. The component mounting machine according to claim 1.

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