JP2000128116A5 - - Google Patents
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- Publication number
- JP2000128116A5 JP2000128116A5 JP1998304299A JP30429998A JP2000128116A5 JP 2000128116 A5 JP2000128116 A5 JP 2000128116A5 JP 1998304299 A JP1998304299 A JP 1998304299A JP 30429998 A JP30429998 A JP 30429998A JP 2000128116 A5 JP2000128116 A5 JP 2000128116A5
- Authority
- JP
- Japan
- Prior art keywords
- top tape
- component
- tape
- peeled
- aspirate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 claims description 3
- 238000003672 processing method Methods 0.000 claims description 3
- 238000000605 extraction Methods 0.000 claims 2
- 238000004804 winding Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 1
Description
【0013】
【課題を解決するための手段】
上記目的を達成するために、本発明のトップテープ処理方法は、テーピング部品のトップテープが剥がれた状態で所定長さに達した時に、吸引し、この吸引状態で前記トップテープをカッター部で切断して処理することを特徴としている。
0013
[Means for solving problems]
To achieve the above object, the top tape processing method of the present invention, when it reaches a predetermined length in a state of taped components top tape is peeled, and Aspirate, the top tape with a cutter unit in the suction state It is characterized by cutting and processing.
本発明のトップテープ処理装置は、テーピング部品のトップテープが剥がれた状態で所定長さに達した時に吸引する吸引手段と、この吸引手段で吸引される状態のトップテープを切断するカッター部を備えていることを特徴としている。 Cutter top tape processing apparatus of the present invention, for cutting a suction means for Aspirate upon reaching a predetermined length in a stop state in which the tape is peeled the taped component, the top tape of the condition being Aspirate with this suction means It is characterized by having a part.
本発明の部品実装機は、上記トップテープ処理装置を備えると共に、トップテープを部品送り毎に、所定経路に進めトップテープ処理装置に供給する送り経路機構を有する部品供給装置を備えていることを特徴としている。また本発明の部品実装方法は、テーピング部品のトップテープを部品取り出し位置の手前で剥がした状態で、テーピング部品に収納された電子部品を部品取り出し位置に供給し、この供給された電子部品を基板に装着する部品実装方法において、前記トップテープを部品供給毎に所定経路に進め、トップテープが剥がされた状態で所定長さに達した時に、吸引し、この吸引状態で前記トップテープをカッター部で切断することを特徴としている。 The component mounting machine of the present invention is provided with the above-mentioned top tape processing device, and also includes a component supply device having a feed path mechanism for advancing the top tape to a predetermined path for each component feed and supplying the top tape to the top tape processing device. It is a feature. Further, in the component mounting method of the present invention, the top tape of the taping component is peeled off before the component take-out position, the electronic component stored in the taping component is supplied to the component take-out position, and the supplied electronic component is supplied to the substrate. In the component mounting method to be mounted on the component, the top tape is advanced to a predetermined path for each component supply, and when the top tape reaches a predetermined length with the top tape peeled off, suction is performed, and the top tape is sucked into the cutter portion in this suction state. It is characterized by cutting with.
本発明のトップテープ処理方法とトップテープ処理装置によれば、トップテープが剥がれた状態で、所定長さに達したときに、吸引しながらカッター部で切断して処理するようにしたので、トップテープの巻取り工程を無くした構造とすることができ、巻取り作業を無くして設備の停止時間を減少できて生産性を向上でき、電子部品の装着工程の自動化を促進できる。 According to the top tape processing method and the top tape handling apparatus of the present invention, in a state in which the top tape is peeled, upon reaching a predetermined length, since to handle and cut by a cutter unit with Aspirate, The structure can eliminate the winding process of the top tape, eliminate the winding work, reduce the downtime of the equipment, improve the productivity, and promote the automation of the mounting process of the electronic component.
本発明の部品実装機によれば、部品供給装置によってトップテープを送り経路機構でスムーズにトップテープ処理装置のカッター部に送り、このカッター部でトップテープを切断し、この切断されたトップテープを吸引手段で吸引処理することができるので、従来のようなトップテープ処理に起因する部品実装機の停止がなくなり、生産性を向上させることができる。 According to the component mounting machine of the present invention, the top tape is smoothly fed to the cutter portion of the top tape processing apparatus by the feed path mechanism by the component supply device, the top tape is cut by this cutter portion, and the cut top tape is cut. it is possible to Aspirate treated with suction means, there is no stopping of the component mounting machine due to the top tape processing such as conventional, it is possible to improve the productivity.
Claims (5)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP30429998A JP3996280B2 (en) | 1998-10-26 | 1998-10-26 | Component mounting machine and component mounting method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP30429998A JP3996280B2 (en) | 1998-10-26 | 1998-10-26 | Component mounting machine and component mounting method |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2000128116A JP2000128116A (en) | 2000-05-09 |
JP2000128116A5 true JP2000128116A5 (en) | 2005-07-14 |
JP3996280B2 JP3996280B2 (en) | 2007-10-24 |
Family
ID=17931372
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP30429998A Expired - Fee Related JP3996280B2 (en) | 1998-10-26 | 1998-10-26 | Component mounting machine and component mounting method |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP3996280B2 (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4520672B2 (en) * | 2001-08-20 | 2010-08-11 | 山形カシオ株式会社 | Tape type parts supply equipment |
-
1998
- 1998-10-26 JP JP30429998A patent/JP3996280B2/en not_active Expired - Fee Related
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