JPH0528772Y2 - - Google Patents
Info
- Publication number
- JPH0528772Y2 JPH0528772Y2 JP2528887U JP2528887U JPH0528772Y2 JP H0528772 Y2 JPH0528772 Y2 JP H0528772Y2 JP 2528887 U JP2528887 U JP 2528887U JP 2528887 U JP2528887 U JP 2528887U JP H0528772 Y2 JPH0528772 Y2 JP H0528772Y2
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor wafer
- holding jig
- sheet holding
- outer ring
- wafer sheet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Packaging Frangible Articles (AREA)
- Special Conveying (AREA)
- Branching, Merging, And Special Transfer Between Conveyors (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2528887U JPH0528772Y2 (OSRAM) | 1987-02-23 | 1987-02-23 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2528887U JPH0528772Y2 (OSRAM) | 1987-02-23 | 1987-02-23 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63134546U JPS63134546U (OSRAM) | 1988-09-02 |
| JPH0528772Y2 true JPH0528772Y2 (OSRAM) | 1993-07-23 |
Family
ID=30825301
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2528887U Expired - Lifetime JPH0528772Y2 (OSRAM) | 1987-02-23 | 1987-02-23 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0528772Y2 (OSRAM) |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012059749A (ja) * | 2010-09-06 | 2012-03-22 | Shin Etsu Polymer Co Ltd | 基板用の保持治具 |
| JP7237413B2 (ja) * | 2018-05-14 | 2023-03-13 | 株式会社ディスコ | ウェーハの加工方法 |
| JP2019212813A (ja) * | 2018-06-06 | 2019-12-12 | 株式会社ディスコ | ウェーハの加工方法 |
| JP2019212814A (ja) * | 2018-06-06 | 2019-12-12 | 株式会社ディスコ | ウェーハの加工方法 |
| JP2019212815A (ja) * | 2018-06-06 | 2019-12-12 | 株式会社ディスコ | ウェーハの加工方法 |
| JP2020024991A (ja) * | 2018-08-06 | 2020-02-13 | 株式会社ディスコ | ウェーハの加工方法 |
| JP2020024990A (ja) * | 2018-08-06 | 2020-02-13 | 株式会社ディスコ | ウェーハの加工方法 |
| JP7166721B2 (ja) * | 2018-10-17 | 2022-11-08 | 株式会社ディスコ | ウェーハの加工方法 |
| JP7166722B2 (ja) * | 2018-10-17 | 2022-11-08 | 株式会社ディスコ | ウェーハの加工方法 |
| JP7166723B2 (ja) * | 2018-10-17 | 2022-11-08 | 株式会社ディスコ | ウェーハの加工方法 |
-
1987
- 1987-02-23 JP JP2528887U patent/JPH0528772Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS63134546U (OSRAM) | 1988-09-02 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH0528772Y2 (OSRAM) | ||
| US4407627A (en) | Automatic wafer orienting apparatus | |
| JPH0217794Y2 (OSRAM) | ||
| WO2023062738A1 (ja) | 位置合わせ治具 | |
| JPH0369078B2 (OSRAM) | ||
| JPH04320043A (ja) | Vノッチウエハの位置決め機構 | |
| JPS63133546A (ja) | ウエハ−の位置決め装置 | |
| JPH062975Y2 (ja) | 壜種対応型スタ−ホイ−ル | |
| JPS61271835A (ja) | 整合装置 | |
| JPS62186545A (ja) | 半導体ウエハの位置合せ法 | |
| JPH0332428U (OSRAM) | ||
| JP2001025961A (ja) | 半導体ウエハの貼付方法 | |
| JPH0213288Y2 (OSRAM) | ||
| CN120727628A (zh) | 搬运用手及搬运机器人 | |
| JPH0212067Y2 (OSRAM) | ||
| JPH0517752Y2 (OSRAM) | ||
| JPS60242954A (ja) | 面取り加工方法 | |
| JPS63182833A (ja) | 位置決め装置 | |
| JPH02122306U (OSRAM) | ||
| JPS6068339A (ja) | リソグラフィ−用マスク構造体 | |
| JPH0482852U (OSRAM) | ||
| JPH04308113A (ja) | 基板の位置決め装置 | |
| KR20250146212A (ko) | 반송용 핸드 및 반송 로봇 | |
| JPS62273747A (ja) | ウエハのオリフラ合わせ機構 | |
| JPH045634U (OSRAM) |